FlipChip International acquires Millennium Microtech Shanghai

FlipChip International announced today the 100% acquisition of Millennium Microtech (Shanghai) – (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China. The MMS name will be changed to FlipChip International.

FCI acquired a majority shareholding in MMS in July 2012 and have since worked diligently with the Chinese authorities over the intervening period to acquire the remaining shares. With 100% ownership of MMS, FCI also gains full ownership of the Joint Venture Bumping facility FCMS. Full ownership will allow FCI to further develop our Shanghai facility with transferred technologies in WLCSP and embedded die technology from FCI Phoenix. These will include our ChipsetT embedded die technology, our Spheron WLCSP, and our plated copper Spheron WLCSP processes.

The strategic 100% acquisition of MMS has extended the global footprint of FCI to offer existing and new customers turnkey services including wafer and final test. FlipChip International will offer the optimum technology for the coming generations of packaging required in the smart phone, tablet, medical and automotive industries. FlipChip International will also provide a complete range of packaging and testing services in Asia to complement the existing bumping and Wafer level Packaging services already associated with FCI in Phoenix, Arizona.

David Wilkie the FCI President and CEO said, “The acquisition of MMS and FCMS is an important part of FlipChip International’s plan to grow the Asian portion of our advanced packaging business. In our class 100 Shanghai bump facility we will add increasingly complex wafer bumping technologies, and offer our Asian customers improved cycle times due to the location near many wafer foundries. Our high volume capability will enable FCI to further develop advanced IC packaging solutions such as Spheron WLCSP and ChipsetT, while still supporting more traditional IC package assembly and test.”

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