Brewer Science, a supplier of thin-wafer-handling materials, processes, and equipment to the microelectronics industry, announced today the first commercial placement of its Cee 1300CSX thermal slide debonder.
The Cee 1300CSX thermal debonder enables high-temperature slide-off debonding of thinned silicon and compound semiconductor substrates (including GaAs, GaN, InP, and SiC) from a rigid carrier to allow further processing of delicate thinned wafers. This debonding can be accomplished in a confidential laboratory setting without interrupting high-volume track production time and without investing large amounts of capital in additional automation.
“This commercial launch marks another strategic milestone in reducing the customer’s cost of ownership for thin-wafer handling through Brewer Science’s equipment, temporary bonding materials, and process integration,” said Justin Furse, Brewer Science Equipment Technology Strategist.
The Brewer ScienceCee 1300CSX thermal debonder delivers exceptional accuracy, interface capabilities, and process flexibility. This uniquely designed debonder enables precise control of the process temperature for thermally sensitive substrate materials.