Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures. The resulting reliability, density, performance, and power savings benefits will continue to drive this vertical NAND transition. On December 10, 2013, Applied Materials, Inc. will host an important forum in Washington D.C. for a thought-provoking examination of the growing momentum in 3D NAND from device, system, and user perspectives.

3D NAND is clearly here to stay with leading-edge memory chipmakers focusing significant resources on this segment. But while 3D NAND promises substantial benefits in easing key planar scaling limitations, several questions remain regarding the future of this technology. How far can it be scaled? What issues will affect its scaling? Which applications will use it first? Will 3D NAND continue lowering the cost per bit? What technologies will follow?

Applied Materials and guest panelists from several industry leaders will provide insight on these critical issues in a panel titled “3D NAND Is a Reality – What’s Next?” To register for this event, please visit

Moderator: Gill Lee, senior director, principal member of technical staff, Silicon Systems Group, Applied Materials

Ritu Shrivastava, Ph.D. – vice president, technology development, SanDisk Corporation
Chuck Dennison – senior director, process integration, Micron Technology, Inc.
Seok-Kiu Lee – vice president, head of flash device technology group, R&D division, SK hynix Inc.
Hang-Ting Lue, Ph.D. – deputy director, Nanotechnology R&D division, Macronix International Co., Ltd.
Bradley Howard, Ph.D. – vice president, advanced technology group, Etch, Applied Materials, Inc.
Where:  Omni Shoreham Hotel,2500 Calvert Street NW, Washington, D.C.

When: Tuesday, December 10, 2013

5:00 – 6:00pm        Shuttle from Hilton Washington Hotel
5:00 – 6:15pm        Registration and Reception
6:15 – 7:30pm        Panel Discussion
7:30pm                 Return shuttle to Hilton Washington Hotel


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>


Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...
Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....