TOWA launches new Packaging Development Center

The TOWA Corporation of Japan, a supplier of packaging equipment for semiconductor, electronics and LED industries, has decided to expand their activities in Europe with an Innovation Center for Packaging Development and announced the launch of TOWA Europe B.V.

Europe has become an area where special IC s and electronic applications are being developed and produced, such as sensors, MEMS, vision applications, specific ICs, in particular for semiconductor, automotive and medical applications .In 2004 TOWA Europe GmbH was established, to serve the many European customers. The activities originally consisted of the supply of the TOWA encapsulation equipment, after sales service and spare parts.

However, in addition to this, the cooperation with the package/product development centers of European customers and European institutes became an important activity and TOWA Europe started to play a role in the development of new products.

To further expand this, it has been decided to establish a Packaging Development Center in the Netherlands, for which TOWA Europe has been founded. This center is located at Geograaf 14, Duiven, The Netherlands.

Laboratory

A fully equipped laboratory with 2 TOWA molding systems, test and measuring equipment as well as an engineering department is available to give full support in all the phases of product development, from initial concept up to test, qualification and industrialization.

The TOWA Corporation of Japan, founded in 1979, is a supplier of molding and singulation equipment for the global semiconductor and electronics industries

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