Honeywell announced today that it has introduced new RadLo low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data errors in semiconductors.
The new plating anodes for semiconductor packaging wafer bumping applications expand Honeywell’s RadLo offerings and employ proprietary Honeywell metrology and refining techniques.
“Our new low alpha plating anodes are already in high volume manufacturing at leading sub-contractors and have been qualified with OEM tool manufacturers,” said Chris Lee, product line director for Honeywell’s Advanced Metals and Polymers business. “The qualifications and rapid adoption demonstrate that we are serving an important need and helping our customers meet their challenges.”
Alpha particle radiation emanating from semiconductor packaging materials can cause data errors in memory cells, creating soft errors that can ultimately cause mobile phones, tablets, servers, gaming consoles, and other end use devices to malfunction. As semiconductors shrink and functional demands increase, chips are more sensitive to soft errors. Designers of packaging materials for semiconductors are now turning to low alpha materials such as Honeywell’s RadLo line to address the issue effectively.
At such extremely low alpha emission levels, accurate measurement of alpha flux is difficult due to the effects of contaminants and background radiation such as cosmic rays. To address this issue, Honeywell employs robust metrology and process controls.
The introduction of the RadLo anodes also supports the semiconductor industry’s move toward flip chip packaging and the increased adoption of electroplating for wafer bumping applications. Honeywell is uniquely positioned to manufacture plating anodes for use in wafer bumping with very high-purity (>99.99% pure) metal offerings, including low alpha lead (Pb), low alpha tin (Sn) and copper (Cu). Low alpha Sn anodes are available in several low alpha grades, including <0.002 counts per hour/cm2.