Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

Leadless Pacemakers with ultra-small size and ultra-low power consumption are emerging, improving analysis and clinical research of the intra-cardiac rhythm, and as a result, improving patients’ quality of life.

The new low-power ECG acquisition chip advances the state-of-the-art by consuming only 680nA when all features are active, and also provides competitive performance, such as input SNR>70dB, CMRR >90dB, PSRR >80dB without any external passive components. By equipping an ultra-low power analog feature extractor, the new chip is capable of assisting digital signal processor platforms for the implementation of low-power heartbeat detection algorithms.

Imec’s portfolio on integrated circuits for implantable cardiac monitoring applications is available for licensing. It also includes a low-power ASIC for intra-cardiac ventricular fibrillation detection, featuring best-in-class three low-power cardiac signal readout channel, one bio-impedance measurement channel, and low-latency beat detection feature, all with 20mW power dissipation (ISSCC2013).

imec

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...