Mentor Graphics acquires Berkeley Design Automation

Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

In it’s official press release, Mentor Graphics said the acquisition of BDA aligns with Mentor’s goal to deliver technologies with superior performance and automation for the growing challenges of Analog/Mixed-Signal (AMS) verification.

“BDA has built an outstanding reputation helping nanometer-scale analog, mixed-signal, and RF design teams rigorously verify and characterize leading-edge circuits,” said Ravi Subramanian, president and CEO of Berkeley Design Automation. “With Mentor’s outstanding market reach and our combined technology portfolio, we look forward to providing world-class solutions to the entire AMS design community.”

“Tight integration between best-in-class tools, strong foundry partnerships and impeccable engineering work were the criteria used in our decision to acquire BDA,” said Robert Hum, vice president and general manager, DSM division at Mentor. “When complex analog and mixed-signal circuits are designed for nanometer geometries, the verification tools must have the capacity, capability and performance to enable designers to predictably and reliably solve increasingly tough verification problems. Joining forces with BDA gives our mutual customers the most advanced tools that deal with the growing number of nanometer-scale physical effects that design teams are facing.”

“Bessemer Venture Partners is excited by Mentor’s acquisition of BDA,” said Umesh Padval, Partner at Bessemer Venture Partners. “BVP backs great entrepreneurs who lead transformative startups – and BDA certainly fits that strategy. We are proud of BDA’s success, and we believe the combination with Mentor will create the industry’s most powerful mixed-signal verification technology business with critical scale and a large market reach.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...