SEMATECH announced today that Particle Measuring Systems has joined SEMATECH to advance the development of nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices. This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.
Speaking with SEMATECH, Brian Knollenberg, VP/GM at Particle Measuring Systems said, “Partnering with SEMATECH accelerates our cycle of learning, enabling us to provide industry leading particle metrology solutions for evolving semiconductor manufacturing processes.”
Particle Measuring Systems will work with SEMATECH to advance particle counting technologies in ultrapure water and common chemistries used in the preparation and cleaning of wafer surfaces throughout the entire semiconductor manufacturing process. This development work will accelerate learning in nanoparticle detection in solutions and will also aid in understanding the correlation between the particles seen in solutions and the particles found on surfaces exposed to solutions.
“SEMATECH’s Nanodefect Center aims to build industry participation in detecting, modeling, characterizing and providing solutions for defect issues as geometries shrink below the 10nm node,” said Michael Lercel, senior director of Lithography, Metrology and Nanodefectivity. “Partnering with Particle Measuring Systems brings additional expertise to SEMATECH, and in turn, will raise the level of our research efforts and further strengthen our commitment in identifying and addressing the challenges of future technology nodes.”
Built on more than a decade of technical expertise in surface cleaning, particle removal and cleaning technology development, SEMATECH’s Nanodefect Center provides a complete suite of metrology and analysis capabilities to investigate the generation, propagation, removal and impact of defects generated by equipment, equipment components and materials used in advanced semiconductor processes such as lithography, etch, CMP, deposition and cleaning.