Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities. As the Internet of Things quickly becomes a reality, Samsung’s foundry business offers chip designers the ability to integrate advanced RF functionality into their designs, making connectivity applications such as the connected home appliances, auto infotainment systems and heating/cooling systems possible.
“With only a handful of companies offering advanced process technology, the options to manufacture RF capabilities into chip designs are greatly reduced,” said Shawn Han, vice president of Foundry Marketing, Samsung Electronics. “As we enter the Internet of Things era, smaller, power-efficient RF solutions provide the critical functionality for the SoC solution as smart connected devices becomes more prevalent. Samsung Foundry is collaborating with our ecosystem partners and customers to provide the most advanced, low cost, lowest power RF technology possible.”
Samsung’s foundry business has already released its 28RF process design kit (PDK) and verification method to several customers, which has been proven by simulation and silicon results in real design. Samsung’s 28RF process is built on top of the high-volume manufacturing proven 28LPP HKMG process. Silicon results have shown 280GHz of Ft and 400GHz of Fmax with normal condition.
Through the collaboration with EDA partners, 28RF PDK includes design manual, accurate SPICE models, DRC/LVS, PEX and ESD decks, along with RF specific module verification and extraction rules. Samsung Foundry will start mass production of the 28RF process technology in early 2015.
Samsung is currently manufacturing foundry customers’ 28nm designs on its 28LPS (pSION), 28LPP (HKMG) and 28LPH (HKMG) process nodes. Multiple customer designs have been silicon-validated, and many more products are being manufactured at Samsung’s logic fabs, the S1 Line and S2 Line in Korea and USA, respectively.