Deca Technologies ships 100-millionth wafer-level packaged component

Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP) manufactured using Deca¹s unique, integrated Autoline production platform, which is designed to achieve faster time-to-market at lower cost.

Leveraging advanced Autoline volume production technologies from SunPower Corp., a solar technology and energy services provider, Deca achieved this milestone by addressing cycle time and capital cost challenges that semiconductor device manufacturers have struggled with using the conventional approach to WLCSP manufacturing.

Demand for WLCSP is being driven by manufacturers of wireless connectivity, audio and power management components for the handset and wearable electronics markets. Demand fluctuations in these markets can lead to challenges in managing inventories. Customers have found that Deca’s unique approach helps them better manage their inventories and reduce their working capital.

“Congratulations to the Deca team on achieving this significant milestone,” said Brent Wilson, senior vice president of the Global Supply Chain Organization at ON Semiconductor. “Deca’s innovative technologies and focus on customer service have made the company a valuable part of our supply chain. We look forward to continued shared success in the future.”

“Reaching 100 million units is an important milestone for Deca because it validates our unique approach to WLCSP manufacturing,” said Chris Seams, CEO of Deca Technologies. “Based on the demand forecasted by our customers, we anticipate passing the half-billion mark in unit shipments this year.”

“As a customer of Deca Tech, Cypress has used the fast New Product Introduction capability of Deca to streamline its back-end process and achieve cycle times of fewer than three days for full turnkey wafer-level packaging, test and singulation,” said T.J. Rodgers, president and CEO of Cypress Semiconductor Corp. “We are even more pleased with Deca as our subsidiary,” Rodgers continued. “The company’s quick ramp to the 100-million-unit milestone is proof of the value proposition that we envisioned when we invested in this market.”


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

One thought on “Deca Technologies ships 100-millionth wafer-level packaged component

  1. Bill Kohnen

    Congratulations to Deca and it’s operations team in the Philippines which really made this possible.


Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...