Lock-in Thermography for Advanced Assembly Qualification

DCG logo w R tagline

 

Lock-in Thermography for Advanced Assembly Qualification

Date: August 26, 2015 at 1:00 p.m. ET

Free to attend

Length: Approximately one hour

NEW register_button

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored by DCG Systems, Inc. 

DCG Systems, Inc. is the industry’s leading supplier of systems that enable direct localization and characterization of electrical faults in integrated circuits, packages and board assemblies. DCG Systems are used worldwide throughout the electronics product life cycle, from IC process development and design de-bug, to yield ramp and yield enhancement, to supporting advanced packaging engineering, and finally to failure analysis of customer returns.

DCG Systems has more than 1500 systems deployed worldwide, and serves its global customer base from its headquarters in Fremont, California and its field offices in the United States, Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany. For more information about DCG Systems, visit www.dcgsystems.com.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...