Lock-in Thermography for Advanced Assembly Qualification
Date: August 26, 2015 at 1:00 p.m. ET
Free to attend
Length: Approximately one hour
Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.
Sponsored by DCG Systems, Inc.
DCG Systems, Inc. is the industry’s leading supplier of systems that enable direct localization and characterization of electrical faults in integrated circuits, packages and board assemblies. DCG Systems are used worldwide throughout the electronics product life cycle, from IC process development and design de-bug, to yield ramp and yield enhancement, to supporting advanced packaging engineering, and finally to failure analysis of customer returns.
DCG Systems has more than 1500 systems deployed worldwide, and serves its global customer base from its headquarters in Fremont, California and its field offices in the United States, Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany. For more information about DCG Systems, visit www.dcgsystems.com.