2.5D and 3D Packaging at the Tipping Point

July 1, 2014 at 1 p.m. EST

Register here: https://event.webcasts.com/starthere.jsp?ei=1038189

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. The time of HVM is fast approaching for 2.5D interposer and memory based 3D packages, with commentators expecting significant product announcements to be made over the next 12 – 18 months.

This webcast will discuss why now is the right time for these next generation packages.  The presenters will also discuss the backside via reveal module in the MEOL, and show how innovative wafer process engineering delivers cost and performance benefits to fuel the growth of 2.5 and first generation 3D devices.

Sponsored by:

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