Advanced Packaging

Advanced Packaging

Date: September 2014 (Date and time to be announced)

Free to attend

Length: Approximately one hour

Speakers: To be announced

Registration will be available soon. Click here to pre-register.

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Want to sponsor this webcast? Contact Sabrina Straub

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