Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications. This marks an industry milestone in leveraging Brewer Science’s unique ability to combine processing equipment, high-temperature temporary adhesives, and process integration into a seamless thin-wafer handling solution.
The Apogee bonder supports multiple temporary bonding/debonding technologies including thermal slide, mechanical peel, and laser release debonding. The Apogee bonder completes the Brewer Science thin wafer handling tool suite for low-volume compound semiconductor production of RF filters, analog power devices, LEDs, and solar devices. This collection of tools provides reduced time to market for ultrathin wafer technologies using Brewer Science’s integrated material and process solutions.
The Brewer Science Apogee bonder delivers exceptional accuracy, interface capabilities, and process flexibility. Industry-leading features include:
- Substrate size range of 50-300mm
- Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
- Ultraflat self-leveling platens minimize total thickness variation (TTV)
- Evacuated bond chamber eliminates voids
- Carrier and device are separated during pre-bond evacuation
- Total thickness variation: <10%
- Real-time access and control to process data and push notifications
Brewer Science processing equipment allows customers to cost-effectively enter new areas of product development and low-volume manufacturing. The equipment product suite can be used to develop process technologies for compound semiconductor, ultrathin CMOS, and MEMS manufacturing as well as thin films, sensors, and advanced packaging. The compact footprint, intuitive design, durability, and experience add up to years of high-performance processing that makes this tool suite perfect for low-volume production or R&D lab environments.