Global market for CVD to reach $6.8B in 2019

BCC Research reveals in its new report, Thin-layer Deposition: CVD, Ion Implantation and Epitaxy, the global market for chemical vapor deposition (CVD) is expected to grow to $6.8 billion by 2019, with a five-year compound annual growth rate (CAGR) of 6.3%. The ion implantation category is the fastest moving segment in this market, growing at a significant CAGR of 16.3%.

Thin-layer deposition, a process used to produce advanced, high-performance materials, is critical to the semiconductor industry and for the miniaturization of electronic devices. Indeed almost all applications within the microelectronics industry utilize some form of this process, including CVD, ion implantation, and/or epitaxy.

The CVD category is the largest segment of the overall market. However, the ion implantation segment is estimated at just about $2.2 billion for 2014 and is expected to jump to nearly $4.7 billion in 2019.

“Over the last few years, the semiconductor industry has experienced a relatively positive and steady growth primarily fueled by the demand for semiconductors and electronic components and devices for everyday items such as smartphones, tablets, and laptops,” says BCC Research semiconductor analyst Mayank Jain. “Thin-layer deposition is a critical process in the manufacturing of semiconductors and electronic components.”

Thin-layer Deposition: CVD, IOn Implantation and Epitaxy provides an overview of the global markets for thin-layer deposition technologies, including chemical vapor deposition, ion implantation, and epitaxy. It includes analyses of global market trends, with data from 2013, estimates for 2014, and projections of CAGRs through 2019, and domestic and international technological issues. An analysis of the industry’s manufacturing capacity and consumption by various regional markets is also included.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...