Trends in Packaging

June 26, 2014 at 1 p.m. EST

The industry is rapidly developing new approaches to advanced packaging, from Cu-column flip-chip to wafer-level packaging and 3D TSV solutions. Is there a method to the madness? Understand the link between packaging, silicon (Si), and end products and the forces that are driving change.

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11 thoughts on “Trends in Packaging

    1. Lily Khor

      Great Presentation and overview. Can i have a copy of the presenttaion to digest further abd to share with my team?

      Reply
  1. Robert Burkhardt

    I just missed your webcast ( delayed at a customer site ) is it possible there will be a re-cast of the material? is it possible to receive a summary of the materials presented?

    Reply

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