Trends in Packaging

June 26, 2014 at 1 p.m. EST

The industry is rapidly developing new approaches to advanced packaging, from Cu-column flip-chip to wafer-level packaging and 3D TSV solutions. Is there a method to the madness? Understand the link between packaging, silicon (Si), and end products and the forces that are driving change.

Register here: https://event.webcasts.com/starthere.jsp?ei=1037866

Sponsored by:

Rudolph_logo_CMYK_registered

zeta logo

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

9 thoughts on “Trends in Packaging

    1. Lily Khor

      Great Presentation and overview. Can i have a copy of the presenttaion to digest further abd to share with my team?

      Reply

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....