Sales of semiconductor equipment in North America continue to demonstrate strong growth

North America-based manufacturers of semiconductor equipment posted $1.44 billion in orders worldwide in April 2014 (three-month average basis) and a book-to-bill ratio of 1.03, according to the April EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in April 2014 was $1.44 billion. The bookings figure is 10.8 percent higher than the final March 2014 level of $1.30 billion, and is 22.5 percent higher than the April 2013 order level of $1.17 billion.

The three-month average of worldwide billings in April 2014 was $1.40 billion. The billings figure is 14.1  percent higher than the final March 2014 level of $1.23 billion, and is 28.7 percent higher than the April 2013 billings level of $1.09 billion.

“Sales of semiconductor manufacturing equipment from North American producers continue to demonstrate strong sequential and year-over-year growth,” said Denny McGuirk, president and CEO of SEMI.  “The data through the first quarter reflects momentum in memory, foundry, and back-end spending.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

November 2013

1,113.9

1,238.0

1.11

December 2013

1,349.7

1,380.8

1.02

January 2014

1,233.2

1,280.3

1.04

February 2014

1,288.3

1,295.4

1.01

March 2014 (final)

1,225.5

1,297.7

1.06

April 2014 (prelim)

1,398.5

1,438.2

1.03

Source: SEMI, May 2014
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...
Edwards launches new Smart Thermal Management System at SEMICON Europa 2016
10/25/2016Smart TMS helps semiconductor, flat panel display and solar manufacturers improve their process performance and safety by red...