Advances in Wet Processing and Wafer Cleaning

August 14th at 1:00 p.m. ET

Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.

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Reidy_R-cropDr. Rick Reidy is a professor in the Department of Materials Science and Engineering at the University of North Texas (UNT). He is a member of the SEMATECH Surface Preparation and Cleaning Conference, Organizing Committee, the International Technology Roadmap for Semiconductors (ITRS) Front End Processes- Surface Preparation Technical Working Group and a co-chair of the Interconnect Surface Preparation Focus Team. Dr. Reidy’s research interests are supercritical processing of semiconductor materials, synthesis and characterization of novel porous ceramics for dielectric, sensor and energy applications, and ultra-low k dielectrics.

Abbas Rastegar_SEMATECH[2]Dr. Abbas Rastegar, is a Fellow in Technical Strategy Group at SEMATECH.  Abbas joined SEMATECH in 2003 where he managed cleans program in the Lithography. Since 2013, he managed  R&D in nanodefectivity in SEMATECH. Abbas has about 25 years of R&D experience in different physics, macromolecules, nano-science, and nano-technology disciplines with more than 150 published papers in technical journals and conferences.


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