Micron collaborates with Intel on on-package memory solution, leveraging 3D memory technology

Micron Technology, Inc., a provider of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel’s next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron’s Hybrid Memory Cube products.

Read more: Inside the Hybrid Memory Cube

“The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light,” said Chirag Dekate, Research Manager at IDC. “Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver.”

Delivering 5X the sustained memory bandwidth versus DDR4 with one-third the energy per bit in half the footprint, the Knights Landing high performance, on package memory combines high-speed logic and DRAM layers into one optimized package that will set a new industry benchmark for performance and energy efficiency. The memory stack provides optimal levels of reliability, availability, and serviceability, which are critical elements for high-performance computing systems. One of the first applications of the Knights Landing system—a next-generation Cray XC supercomputer—was announced by NERSC on April 29.

“Intel’s many integrated cores (MIC) architecture and Micron’s high performance memory is a formidable combination,” said Tom Eby, vice president for Micron’s compute and networking business unit. “Intel’s and Micron’s advanced technologies successfully marry the processor to a memory system that delivers the very rare coupling of low power and extreme bandwidth.”

“The next-generation Intel® Xeon Phi processor, codenamed Knights Landing, will launch with up to 16GB of high performance, on-package memory that delivers dramastically improved the sustained memory bandwidth versus DDR4 and brings tremendous power-efficiency and space-savings. It is the first Intel HPC processor to use this new high performance on package memory,” said Charles Wuischpard, Vice President, General Manager, Workstations and High Performance Computing Data Center Group at Intel. “This will allow the world’s leading researchers, scientists, and engineers to run larger workloads faster while maintaining current code investments. We’re pleased to be working with Micron to deliver it.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...