Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment. The 3D InCites Awards recognize achievements to further the commercialization of 2.5D and 3D IC technologies. SSEC received the award for the WaferEtch TSV Revealer tool, which is a single wafer wet processing platform for 3D IC and interposer wet etching applications designed to reduce process and capital equipment costs. The WaferEtch features superior uniformity of silicon thickness (as low as -/+ 0.7%) and high throughput. 

“Bringing 3D ICs to high-volume manufacturing is a requirement for the industry to move forward into the next technology node,” said Erwan Le Roy, Marketing Vice President at SSEC. “SSEC’s WaferEtch TSV Revealer helps to achieve this through integrating a low-cost wet etch process with metrology for performing thickness measurement. Our system replaces four tools with one (CMP, silicon thickness measurement, plasma etch, and clean), so we are able to achieve this at the lowest cost to the manufacturer.”

The 3D InCites Awards were established in 2013 to recognize achievements to further the commercialization of 2.5D and 3D IC technologies. The 2014 3D InCites Awards were presented at a breakfast ceremony hosted by Impress Labs on Thursday, July 10, 2014, at the Impress Lounge during SEMICON West. The event featured guest speaker Bryan Black, Senior Fellow, AMD, who has led AMD¹s die stacking program for the past seven years. Black talked about the future of die stacking and where the benefits lie within the context of mainstream computing CPUs, APUs, and GPUs.

This year’s event was co-promoted by 3D InCites, the premier online content source for reliable 3D technology information; SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains; and TechSearch International, the leading market research firm for advanced semiconductor packaging technology.

SSEC

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...