This week, SEMI announced the keynote speakers for the third edition of the European 3D TSV Summit, event that will take place on January 19-21, 2015 in Grenoble, France. As an increasing number of companies, such as IBM, Xilinx, Samsung and Bosch, are taking 3D through-silicon-via (TSV) technology to the commercialization phase, the necessity for understanding the business and technological context surrounding these devices has become more important than ever. In this context, SEMI has invited experts on the forefront of the technology to share their perspectives on the industry.
Joining the conference as a keynote speaker, Bryan Black, senior fellow at AMD, will inform participants that die stacking is finally happening in mainstream computing and explain the impacts of this technology on the industry. Timo Henttonen, senior manager packaging at Microsoft, will discuss his vision of the future of 3D TSV for smartphones and connected devices. Finally, Bill Chen, fellow and senior technical advisor at ASE Group, will deliver a talk about the integration of 3D TSV into the DNA of packaging.
In addition to these three keynote speakers, over 20 invited speakers and panel discussion participants will share their views during the 3D TSV conference, including industry experts from Qualcomm, IBM, HP, ams AG, imec, CEA-LETI, Fraunhofer-IKTS, Broadpak, SPTS, Suss Microtec, EV Group, BESI, KLA-Tencor, Rudolph Technologies, Asahi Glass, Corning, Oerlikon, STMicroelectronics, AMKOR and more.
New this year, the Summit will include a Pre-Summit Market Briefing dealing specifically with the 3D TSV market outlook and hosting several talks by financial analysts and industry consultants, including Yole Development, TechSearch International, AlixPartners and ATREG.
Over 30 companies will join the event as exhibitors. In addition to the exhibit and conference, attendees will have the opportunity to set up one-on one business meetings and visit the CEA-Leti 300mm TSV-capable clean room.