Wafer Processing

Date: Date and time TBD

Free to attend

Length: Approximately one hour

Registration coming soon.

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Contact Jenna Johnson about sponsorship opportunities for this event. 

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