Dr. Gary Patton joins The ConFab Advisory Board

Dr. Gary Patton, CTO and Head of Worldwide Research and Development, GLOBALFOUNDRIES

Solid State Technology today announced that Dr. Gary Patton has joined the Advisory Board for its annual conference and networking event, The ConFab. Dr. Patton is the CTO and Head of Worldwide Research and Development at GLOBALFOUNDRIES. As an advisory board member Dr. Patton will assist with defining the conference theme and inviting industry leaders to attend the event and take meetings with suppliers.

“It’s a great honor to have Gary on the Advisory Board,” said Pete Singer, Editor-in-Chief of Solid State Technology and conference chair for The ConFab. “Gary has tremendous insights into the next generation technology that will be required to move the semiconductor industry forward. He is also well versed in the economics of semiconductor manufacturing, which is the main focus of The ConFab.”

Dr. Patton, who delivered a keynote at The ConFab 2014 and returned as a VIP attendee in 2015, is responsible for the semiconductor technology R&D roadmap, operations, and execution at GLOBALFOUNDRIES. He was previously VP of IBM’s Semiconductor Research and Development Center in East Fishkill, New York.

The twelfth annual ConFab, which will take place June 12-15, 2016 at the Encore at the Wynn in Las Vegas, will focus on the economics of semiconductor manufacturing and design. Attendees will hear about:

  • The outlook for 2016 and 2017.
  • Technical challenges facing the industry, including next generation lithography, 3D integration, and advanced packaging and testing of increasingly complex chips.
  • Opportunities to maximize collaborative efforts between fabs, fabless/design companies, OSATs, and equipment and materials suppliers.
  • The opportunities of high growth markets

Now in its twelfth year, The ConFab is an executive-level conference and networking event for business leaders from the semiconductor manufacturing and design industry. The event featured a high-level conference program, networking events and strategic business meetings with purchasing decision makers and influencers. Learn more at www.theconfab.com.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...