Amkor Technology receives “Device of the Year” for SWIFT semiconductor package

Amkor Technology, Inc. recently received the 3D InCites “Device of the Year” award during SEMICON West for its’ SWIFT semiconductor package. The awards were a result of industry voting for individuals, companies and products exhibiting excellence in 3D packaging expertise and contributing to the commercialization of game-changing technologies such as: fan-out wafer level packaging (FOWLP), interposer-based packages, 3D stacks and 3D System-in-Package (SiP).

Amkor’s SWIFT product was uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry. This package can deliver 2 µm line/space lithography with up to 4 layers of RDL and a very dense network of memory interface vias from bottom package to the top package at a very cost competitive price.

Jon Woodyard, Amkor's VP of Technical Programs accepts the 3D InCites award for "Device of the Year" from Francoise von Trapp and Stephen Hiebert, KLA-Tencor.

Jon Woodyard, Amkor’s VP of Technical Programs accepts the 3D InCites award for “Device of the Year” from Francoise von Trapp and Stephen Hiebert, KLA-Tencor.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....