Amkor Technology receives “Device of the Year” for SWIFT semiconductor package

Amkor Technology, Inc. recently received the 3D InCites “Device of the Year” award during SEMICON West for its’ SWIFT semiconductor package. The awards were a result of industry voting for individuals, companies and products exhibiting excellence in 3D packaging expertise and contributing to the commercialization of game-changing technologies such as: fan-out wafer level packaging (FOWLP), interposer-based packages, 3D stacks and 3D System-in-Package (SiP).

Amkor’s SWIFT product was uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry. This package can deliver 2 µm line/space lithography with up to 4 layers of RDL and a very dense network of memory interface vias from bottom package to the top package at a very cost competitive price.

Jon Woodyard, Amkor's VP of Technical Programs accepts the 3D InCites award for "Device of the Year" from Francoise von Trapp and Stephen Hiebert, KLA-Tencor.

Jon Woodyard, Amkor’s VP of Technical Programs accepts the 3D InCites award for “Device of the Year” from Francoise von Trapp and Stephen Hiebert, KLA-Tencor.


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