Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016. Following 2015’s highly successful debut in Milano, the SEMI European MEMS Summit this year moves to Stuttgart. Over 250 attendees, including the industry’s global thought leaders, will discuss challenges, opportunities, and solutions. A full capacity exhibition with representatives from the full value chain will complement the conference.
The event’s keynote presentations will feature:
- Bosch Sensortec: “Smart Connected MEMS Sensors – Enabler for the IoT” by Udo Gomez, CTO
- STMicroelectronics: “MEMS Sensors and Actuators – Opportunities and Challenges” by Benedetto Vigna, EVP and GM
- Qorvo: “BAW and the ‘Edge of Tomorrow’ in Wireless Communication: Innovate, Ramp. Repeat” by Robert Aigner, Senior Director
- AMKOR: “Sensor in Package – Standard Package Platform for Sensor Fusion and IoT” by Adrian Arcedera, VP
In addition to keynotes, the MEMS Summit’s exceptional speaker line-up includes presentations from ams AG, Bosch, Coventor, Fraunhofer IPMS, GLOBALFOUNDRIES, IHS, Invensas, NXP, Roland Berger, STMicroelectronics, Teledyne DALSA, and Yole Developpement. The event’s main sessions will address Market and Business, Technology, Internet of Things, Automotive, Consumer, and Wearable Electronics. Promising start-ups Innoluce, USound, Polight and Enerbee will pitch their innovative solutions in a brand new session.
The Summit benefits from strong support from within the industry including Platinum Sponsor Bosch Sensortec; Gold Sponsors ASE Group, STMicroelectronics, and SUSS MicroTec; Silver Sponsors Applied Materials, EV Group, LAM Research, and SPTS. Other sponsors include AMKOR Technology, JSR Micro, Materion, Trymax, and VAT.
For more information and registration, please visit www.semi.org/eu/EuropeanMEMSSummit