Avalanche Technology announces the start of volume production of STT-MRAM on 300mm wafers

Avalanche Technology, Inc., has entered into a manufacturing agreement with Sony Semiconductor Manufacturing Corporation to begin production of it’s Spin Transfer Torque Magnetic RAM (STT-MRAM) on 300mm wafers at various advanced geometry nodes.  Volume production is expected in early 2017 at Sony Semiconductor Manufacturing Corporation in Japan to address a wide range of applications for this disruptive non-volatile memory technology.

This partnership with Sony Semiconductor Manufacturing Corporation will help the adoption of perpendicular Magnetic Tunnel Junction (pMTJ)-based STT-MRAM and further validate the widely accepted industry belief that STT-MRAM is the memory technology of choice for a broad spectrum of applications.

“Avalanche is working on breakthrough memory products.  As a result, we are able to address a very large non-volatile memory market with a wide range of requirements.  STT-MRAM is an ideal solution for markets such as Storage, Automotive, IoT and embedded applications,” said Petro Estakhri, founder and CEO of Avalanche Technology.

“We are pleased to partner with Avalanche Technology on the production of pMTJ based STT-MRAM,” said Toshiyuki Yanase, Representative of Yamagata Technology Center of Sony Semiconductor Manufacturing Corporation.  “Working with Avalanche Technology, we look forward to manufacturing MRAM products that meet current and future demands in the memory market.”


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...
Edwards launches new Smart Thermal Management System at SEMICON Europa 2016
10/25/2016Smart TMS helps semiconductor, flat panel display and solar manufacturers improve their process performance and safety by red...