October 26, 2016 at 1 p.m. ET
Free to attend
Length: Approximately one hour
With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. The exponential impact of connectivity represents a data-centric future and drive an accelerated transformation throughout the network fabrics. Additionally, the users’ expectations and demand of emerging applications, such as autonomous driving, would not tolerate today’s level of latency and computing capacity. All aspects of the computing continuum – silicon, software and computing capacity that are staggered at different levels in the network- would need to be transformed and advanced performance would need to be pushed to lower levels of the network delivering an increased speed, capacity and an immediate access. This fundamental shift manifests itself through different device (s) requirements and is driving a third wave of technologies with a larger semiconductor footprint. With that comes an increased reliance on microelectronics packaging to deliver far more integrated, complex and advanced solutions at different levels of the network- from handheld and client interface devices to the data center, the cloud and devices at the edge. With accelerated and extended product life-cycle expectations, wearable electronics, and a large assortment of IoT devices, next-generation electronics will require several new packaging solutions. Smaller form factors, lower power consumption, flexible designs, increased memory performance, and-more than ever-a closely managed silicon package, co-optimization and architectural innovations. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.
The above mentioned move to cloud computing, the transformation of the network and the growth of data analysis are the fundamental growth drivers for the integrated circuit (IC) scaling moving forward. In turn, they represent a tremendous opportunity for microelectronics packaging to deliver, grow and transform into an increasingly influential and enabling role.
Dr. Islam Salama, Intel Corporation
Dr. Islam Salama is with Intel Corporation responsible for packaging substrate Pathfinding of the high density interconnect across all Intel products. In this capacity, Islam manages a global team of technologists and manufacturing team responsible for delivering next generation packaging technologies. His team focuses on packaging substrate architectures, process and materials technology building blocks, intellectual property management, and manufacturing ecosystem development.
Islam has a Ph.D. in laser materials processing from the College of Optics and Photonics (CREOL), UCF and has been with Intel since 2003. Islam authored over 35 technical papers, was awarded more than 50 international patents in the fields of HDI substrate technology, laser technology, materials processing and semiconductor fabrication. Islam is an elected member of the board of directors for the Laser Institute of America (LIA), a member of the steering committee with the international technology manufacturing initiative (iNEMI), and a board member of Applicote Associates LLC-a photonics and manufacturing technology start-up.
Sponsored by Air Products
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