Invensas announces Teledyne DALSA sign DBI technology transfer and license agreement

Invensas Corporation, a wholly owned subsidiary of Tessera Holding Corporation (Nasdaq: TSRA), today announced that Teledyne DALSA, a Teledyne Technologies company, has signed a technology transfer and license agreement for Direct Bond Interconnect (DBI) technology. This agreement enables Teledyne DALSA to leverage Invensas’ revolutionary semiconductor wafer bonding and 3D interconnect technologies to deliver next-generation MEMS and image sensor solutions to customers in the automotive, IoT and consumer electronics markets. Teledyne DALSA is an international leader in high performance digital imaging and semiconductors and also one of the world’s foremost pure-play MEMS foundries.

“DBI technology is a key enabler for true 3D-integrated MEMS and image sensor solutions,” said Edwin Roks, president of Teledyne DALSA. “We are excited about the prospect of developing new products and providing new foundry services to our customers that utilize this technology. By working closely with Invensas, we will be able to move more quickly to deploy this capability efficiently and effectively.”

DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded instantaneously with exceptionally fine pitch 3D electrical interconnect without requiring bond pressure. The technology is applicable to a wide range of semiconductor devices including MEMS, image sensors, RF Front Ends and stacked memory.

“We are pleased that Teledyne DALSA, a recognized leader in digital imaging products and MEMS solutions, has chosen our DBI technology to accelerate the development and commercialization of their next generation MEMS and image sensor products,” said Craig Mitchell, president of Invensas. “As device makers look for increasingly powerful semiconductor solutions in smaller packages, the need for cost-efficient, versatile 3D technologies is greater than ever before. We are confident that the superior performance and manufacturability of DBI technology will help Teledyne DALSA deliver tremendous value to their customers.”

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