WIN Semiconductor increases wafer manufacturing capacity by 20%

WIN Semiconductors Corp (TPEx:3105), the world’’s largest pure-play compound semiconductor foundry, has completed phase 2 expansion at its newest wafer fab, Fab C. This operation is now fitted with clean rooms, efficient process lines and advanced equipment for GaAs MMIC production, epitaxial growth of compound semiconductors, as well as fabrication and test of optical devices. Continued build-out of the new manufacturing facility further validates the pure-play foundry model in the compound semiconductor industry.

Serving customers in mobile PA, WiFi, wireless infrastructure and optical markets, WIN Semiconductors provides a broad portfolio of Hetero-junction Bipolar Transistor (HBT), Pseudomorphic High Electron Mobility Transistor (pHEMT), integrated BiHEMT technology solutions and optical devices. WIN Semiconductors’ manufacturing services can support most any application from 50MHz to 150GHz and through light-wave.

“In response to increasing demand across all market segments, we continue to add manufacturing capacity at our third wafer fab located in Guishan, Toayuan City, Taiwan. Known as Fab C, the facility now supports mass production of a wide range of compound semiconductor technologies. When fully built out, the 706,000ft2 facility will more than double our capacity,” said Kyle Chen, Senior Vice President and Chief Operating Officer of WIN Semiconductors.

Win Semi Fb C PR image

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...