Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Sponsored By:

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Date: Wednesday, August 9, 2017 at 1 p.m. ET

Free to attend

Length: Approximately one hour

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The slowing down of Moore’s Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

DOCI can be a lower cost alternative to integration of many functions on a single large chip that is often associated with low fab yields at immature nodes. In the consumer end DOCI is an enabler of compactness and power efficiency. To be accepted in the high performance end DOCI must deliver electrical performance not too inferior to single chips or provide efficient package level integration of heterogeneous designs and Fab technologies e,g. Processor and Memory, that are not easily manufactured on a single wafer. In all cases dense and compact package level interconnects with low parasitics using current and emerging Advanced Packaging (AP) technologies are key to wide adoption of DOCI.

Using metrics like electrical performance, density and cost of package level interconnects we will assess various AP technologies ranging from package substrates/interposers, packages like FO WLPS, flip chip, 2.5d modules, 3d stacks such as PoP, and those using TSVs. Recent commercial examples of integrating processor to memory by different approaches to DOCI will be compared.

Lastly emerging AP technologies (substrates cheaper than dual damascene interposers and TSVs) to reduce the cost of DOCI will be compared and opportunities for further development and implementation identified.

Speakers: 

dev guptaDr. Dev Gupta, CTO, APSTL llc, Scottsdale, AZ, USA

While at Motorola and Intel, Dr. Dev Gupta invented many of the Advanced Packaging technologies ( electroplated solder bump flip chip, robotic assembly, organic substrates w/ and w/o core, pillar flip chip, integrated passives, .. ) that have become industry standards today. The micro pillar and thermocompression flip chip technology he invented at Motorola nearly 25 years ago for Gallium Arsenide PAs is now used for building 3d Memory Stacks. He pioneered and managed the transfer of these AP technologies to high volume manufacturing in both the US and Japan. At APSTL he is responsible for identifying technology gaps, developing new technologies to address them, licensing, turn key engineering of Fabs for Advanced Packaging. He also takes an active role in mentoring and training Customer Engineers. Dr. Gupta has many Patents and Publications and often teaches at Conferences the theoretical aspects of Package Level Interconnects, Advanced Packaging and Systems Optimization. The current emphases at APSTL is to lower the cost Adv. Packaging by replacing TSVs, process innovations in die stacking etc. and license them.

  • Why there is such renewed interest in DOCI, first used in Multi-Chip Modules for mainframes some 3 decades ago.
  • Hear why and how DOCI can be a lower cost alternative to integration of many functions on a single large chip that is often associated with low fab yields at immature nodes.
  • Learn how to assess various Advanced Packaging technologies using metrics such as electrical performance, density and cost of package level interconnects.

Silicon Wafer Integrated Fan-out Technology (SWIFT®) Packaging

curtisCurtis Zwenger, VP Adv. Package & Technology Integration

Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and MEMS packaging technologies. He is currently responsible for the development and commercialization of Amkor’s Advanced Wafer Level Fan-Out package technologies, including WLFO and SWIFT®. Prior to joining Amkor, Curtis worked for Motorola. He holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

Curtis will discuss:

  • The development of SWIFT® technology and its extension into unique 3D structures.
  • The advantages of SWIFT® designs as compared to current competing packaging technologies.
  • How the SWIFT® process is poised to provide robust, reliable, and low-cost 3D packaging solutions for advanced mobile and networking products.

 

Sponsored by Amkor Technology

Amkor Technology, Inc. is one of the world’s largest providers of state-of-the-art packaging design, assembly and test services. As a strategic partner to leading semiconductor companies and electronics OEMs, operations include over 10M ft2 of volume production, development, sales and support services in Asia, Europe and the United States. Our solutions enable customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and packaging technology innovator. Additional information at: www.amkor.com.

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