GLOBALFOUNDRIES announces enhanced RF SOI process design kit

GLOBALFOUNDRIES today announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

GF’s advanced RF technology platform, 7SW SOI, is optimized for multi-band RF switching in next-generation smartphones and poised to drive innovation in Internet of Things (IoT) applications. Designed for use with Coupling Wave Solutions’ (CWS) simulation tool, SiPEX™, GF’s 7SW SOI PDK allows designers to integrate RF switches with other critical RF blocks that are essential to the design of complex electronic systems for future RF communication chips. Specifically, this new capability allows designers to improve RF simulation output by simulating a highly-resistive substrate parasitic effect across their entire design.

“GF leads the industry in RFSOI technology, and we are committed to providing our customers with design productivity solutions for our RF processes,” said Bami Bastani, senior vice president of RF at GF. “CWS’ SiPEX™ tool provides our customers with best-in-class correlation between simulated results and real world measurements, further optimizing the design layout to achieve efficiency and deliver differentiated RF front-end solutions.”

“This is great news for the RF design community,” said Brieuc Turluche, chairman of the board of directors and chief executive officer of CWS. “The integration of SiPEX into GF’s RF SOI PDKs is a major milestone to achieve first-time correct complex and optimized RF SOI designs for high-performing cellular, IoT, 5G and Wi-Fi communication chips.”

GF’s RF SOI technologies offer significant performance, integration and area advantages in front-end RF solutions for mobile devices and RF chips for high-frequency, high-bandwidth wireless infrastructure applications. CWS’ SiPEX accelerates the design of RF SOI switches by improving linearity simulation accuracy. It can also be effective in the design of low-noise amplifiers (LNA) and power amplifiers (PA), enabling designers to reduce their size to lower costs.

SiPEX™ is available in the current release of GF’s 7SW SOI PDK. For more information on the company’s RF SOI solutions, contact your GF sales representative or go to www.globalfoundries.com.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...