OEM Group announces post-dice clean solutions for plasma and laser dicing methods

OEM Group announced today a Post-Dice Clean solution on the proven Cintillio™ Batch Spray platform following plasma and laser dicing methods. Designed specifically to remove residue and particles left behind from these dicing methods, OEM Group’s Cintillio™ SST (Spray Solvent Tool) and Cintillio™ Eco-Clean systems utilize their patented Enhanced Spray Technology (EST) to deliver process improvement through uniform media flow with a nozzle-per-wafer concept ensuring uniform flow and increased rinse efficiency.

After wafers are singulated prior to “pick and place,” the conventional method of cleaning is by water rinsing; however, some singulation methods, particularly plasma and laser, may leave behind residues that water cannot clean. Slag, polymers, and other residues impede device performance and may cause corrosion or affect downstream processes. The Cintillio™ post-dice clean process successfully removes these residues to maintain final device performance. Chris Forgey, CTO for OEM Group says, “We’re pleased to leverage our patented Ozone process specifically for post dice clean applications, delivering value and superior process capability for this specific application.”

Along with the patented Enhanced Spray Technology (EST), both platforms adapt wafer carriers and rotors to hold multiple “diced wafer-on-tape-on-frame” substrates, delivering greater throughput, reduced chemical utilization, space efficient footprint, and excellent overall performance. According to OEM Group Applications Lab Manager, Joshua Levinson, Ph.D., “Any device manufacturer who performs back-end processing of wafers and who employs wafer singulation to create diced substrates will benefit from our solutions. Batch processing also reduces the number of cleaning tools required in a fab and lowers overall cost of ownership, waste generation, and DI water usage.”

With global headquarters in metro Phoenix, Arizona and additional sites throughout the North America, Europe, Japan and Asia, OEM Group, LLC is a semiconductor capital equipment manufacturer and innovator in new and remanufactured 75mm–200mm tools and services.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...