Wafer-level packaging device shipments to overtake flip chip tech in 2018

The number of IC packages utilizing wafer-level packaging (WLP) will overtake flip chip shipments in 2018 and then continue growing at a compound annual growth rate of 15% (between 2014 and 2020) compared to just 5% for flip chip, according to the report entitled “Flip Chip/WLP Manufacturing and Market Analysis,” recently published by The Information Network, a New Tripoli, PA-based market research company.

“Advanced wafer-level packaging technologies hold the key to meeting future technology needs, from mobile devices to automotive applications, to those required for enabling the IoT,” noted Dr. Robert Castellano, [resident of The Information Network. “Flip chip technology is slowly replacing wire bonding for many high-performance chips, and wafer level packaging (WLP) is replacing flip chip.”

wlp device shipment

To meet the needs of thinner mobile devices, fan-out WLP (FO-WLP) enables redistribution of I/Os beyond the chip footprint, differing from Fan-in WLP in several key areas. One major advantage of FO-WLP, especially in mobile applications, is that the elimination of the substrate reduces the vertical footprint by an average of 40% compared with Fan-in WLP, enabling thinner products or making it possible to stack more components in the same form factor. The elimination of the interposer and TSVs also provides a cost reduction and eliminates concerns on the effects of TSVs on electrical behavior. The reduced path to the heat sink also helps improve thermal performance.

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One thought on “Wafer-level packaging device shipments to overtake flip chip tech in 2018

  1. Israel Beinglass

    One of the key missing feature regardinf advanced packaging is lack of standardization, still in 2017 each OSAT company as well as IDM and foundry have their own “standard” process (see Intel, TSMC, ASE, Armkor etc). Also the fabless companies are pushing their packaging suppliers to use their home brewing process. It is extremely difficult to develop the future packaging technology without standardization.

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