First SEMICON Europa opens this year in co-location with productronica

SEMICON Europa 2017 will take place in Munich from 14 to 17 November, co-located with productronica. Consistent with SEMI’s theme “Connect, Collaborate, and Innovate,” co-locating SEMICON Europa with productronica gathers the full span of electronics manufacturing and end-products, creating the largest European electronics platform ever. More than 400 exhibitors will present their products and innovations at SEMICON Europa 2017. Over 40,000 attendees are expected at the co-located events.

After a period of slow growth, Europe’s semiconductor manufacturers are investing in new construction of 300mm fabs in Germany, Italy and France. Four semiconductor and MEMS manufacturers have announced investments in Europe totaling more than $10 billion. Bosch will build a new fab in Dresden; ST Microelectronics is planning two new 300mm fabs in Agrate and Crolles; and GLOBALFOUNDRIES and Infineon plan to expand their production capacity.

“The global industry will invest more than US$100 billion in equipment and materials this year. Forecasts for 2017 also predict that semiconductor manufacturers worldwide will exceed $400 billion in revenue ─ a new record,” says Ajit Manocha, president and CEO of SEMI.  “An unprecedented number of new inflections and applications will broadly expand the digital economy and drive increasing silicon content — in areas including IoT, assisted driving in automotive, Artificial Intelligence (AI), Big Data, and 5G. Assuming an average 7 percent CAGR, global chip sales could approach $1 trillion by 2030, and equipment and materials spending could similarly grow to nearly a quarter of a trillion dollars.”

The market segments in which European companies hold strong market positions also shape the conference program of SEMICON Europa 2017. More than 250 presentations, 50 conferences and high-caliber discussions provide an overview of current trends. Key issues this year include: materials, semiconductor manufacturing, advanced packaging, MEMS/sensors, power electronics, flexible and printed electronics. The focus is also on important applications such as the Internet of Things (IoT) and artificial intelligence (AI), smart manufacturing (“Industry 4.0″), automotive electronics and medical technology.

The Opening Ceremony will include a welcome speech by Ajit Manocha, president and CEO of SEMI,followed by Laith Altimime, president, SEMI Europe, plus four keynotes:

  • Bosch Sensortec: Stefan Finkbeiner, CEO, on how environmental sensing can contribute to a better quality of life in the context of the IoT
  • Rinspeed Inc.: Frank M. Rinderknecht, founder and CEO, on how to create innovative technologies, materials and mobility means of tomorrow
  • SOITEC: Carlos Mazure, CTO, executive VP, on contributions and benefits of engineered substrates solutions and thin-layer transfer technologies, focusing on applications in the smart space
  • TSMC Europe: Maria Marced, president, on opportunities for new business models to apply in the Smart City

On the exhibition show floor, the TechARENA free sessions are a highlight with the SEMI China Innovation and Investment Forum and the INNOVATION VILLAGE.

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