Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 226 RTI ASIP Part 2: 3D Memory, Heterogeneous Integration, High Density Laminates, Embedded films

    By Dr. Phil Garrou, Contributing Editor Let's continue our end of year look at presentations at the RTI ASIP Conference. Yole Developpement During my 2014 market Update presentation 2.5 / 3DIC for Yole Developpment, we looked at the timeline for introduction of the various new memory architectures as shown below:   Another popular slide discussed cost vs density for current [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • IEDM – Monday was FinFET Day

    By Dick James, Senior Analyst, Chipworks In my conference preview blog last week, I mentioned that session 3 on the Monday afternoon would be a hot session, with three finFET papers, by TSMC, Intel, and IBM. I was right – even though they were given in the Grand Ballroom, it was full. Paper 3.1 from TSMC disclosed what looks like their 16FF+ 16nm finFET technology, advanced from the 16FF reported [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • Exponentially Rising Costs Will Bring Changes

    Scott McGregor, President and CEO of Broadcom, sees some major changes for the semiconductor industry moving forward, brought about by rising design and manufacturing costs. Speaking at the SEMI Industry Strategy Symposium (ISS) in January, McGregor said the cost per transistor was rising after the 28nm, which he described as “one of the most significant challenges we as an industry have faced.” He [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Wearable Devices and the Search for the Holy Grail at 2015 International CES

    By Karen Lightman, Executive Director, MEMS Industry Group Several years ago, I coined the phrase “MEMS frickin’ everywhere.” I shared my vision for MEMS enabling a smarter and better world. This was before the term Internet of Things (IoT) had taken hold. My catchphrase got me into a bit of trouble with those offended by my use of a modified expletive as well as skeptics of the potential [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • 2014 EUV Source Workshop Summary

    By Vivek Bakshi, EUV Litho, Inc. Short Summary At the 2014 Source Workshop in Dublin, the semiconductor industry’s largest annual gathering of EUV source experts, we received the latest updates on current EUV source technology (Sn laser-produced plasma [LPP]) and discussed potential and challenges of Free Electron Laser (FEL) based sources as the next generation high power EUV sources. The [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Ferromagnetic Room Temperature Switching

    Bismuth-ferrite could make spin-valves that use 1/10th the power of STT A research team led by folks at Cornel University (along with University of California, Berkeley; Tsinghua University; and Swiss Federal Institute of Technology in Zurich) have discovered how to make a single-phase multiferroic switch out of bismuth ferrite (BiFeO3) as shown in an online letter to Nature. Multiferroics, allowing [...]