Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 287 SMIC Ups the Ante on Packaging; IMAPS DPC 2016 part 4; SiP, Sputtered Cu Shielding and Si TF Caps

    By Dr. Phil Garrou, Contributing Editor SMIC Ups Ownership in JCET Following the lead of global foundry leader TSMC, SMIC, in two separate moves has put an additional $0.5B into JCET (Jiangsu Changjiang Electronics Technology), mainland China’s largest semiconductor packaging assembly and test business, uping their ownership position to $14.25% and making it the biggest shareholder in JCET. [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • What to Expect in 2016 in the Chipworld

    By Dick James, Senior Technology Analyst, Chipworks It’s the time in the media world that we see a frenzy of predictions for the coming year. They are mostly business or tech trends, so I figured I might as well chip in (har! har!), and give a more detailed idea of what new semiconductor products we look forward to this year, now that we are in 2016. This might seem to be a bit like fortune-telling, [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • 10 Reasons to Attend The ConFab this June

    The ConFab Conference and Networking Event will be held June 12-15. Presented by Solid State Technology, this executive-level event is designed exclusively for those driving growth and innovation in the semiconductor industry. With a theme the “New Age of Innovation for Semiconductors,” it features deep insights on the challenges and opportunities facing the industry and also offers powerful networking [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Check out the finalists for MEMS & Sensors Technology Showcase at MEMS Executive Congress 2015

    By Karen Lightman, Executive Director, MEMS Industry Group Back in 2001 when I was a young mother with a baby in diapers, I dreamed of a MEMS-enabled gizmo (perhaps on her diaper?) that would remotely indicate if my daughter was sleeping. She was (and still is) a restless sleeper, and I had many nights where I tip-toed into her room to ensure that she was breathing and yes, indeed, still alive in [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • 2015 Source Workshop - What we expect to hear

    By Vivek Bakshi, EUV Litho, Inc. EUV Sources remain the key enabler to move EUVL into manufacturing, and we look forward to the upcoming 2015 Source Workshop (November 9-11, 2015, Dublin, Ireland) for the latest developments and status of EUV Source technology. Both high-volume manufacturing (HVM) level and metrology EUV sources are needed for chip manufacturing using EUVL. For HVM sources, power [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Trefonas Earns 2016 Perkin Medal

    The Society of Chemical Industry (SCI), America Group, announced on May 5, 2016 that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at Dow Chemical Co (NYSE:DOW), has won the 2016 SCI Perkin Medal. This honor recognizes Trefonas’ contributions in the development of chemicals that enable microlithography for the fabrication of microelectronic circuits. Trefonas will receive the medal [...]