Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 347: ASE Embedded Packaging Solutions

    At the recent IMAPS Carolina Chapter meeting Rich Rice of ASE gave an update presentation on “Embedded Packaging Solutions”. Specifically: SESUB- Semiconductor Embedded In Substrate aEASI –Advanced Embedded Active System Integration FOWLP- Fan Out Wafer Level Package SESUB - ASE offers SESUB through the JV with TDK - embedding IC releases surface space for other components or [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • Intel Unveils More 10nm Details

    By Dick James On March 28, Intel held a Technology and Manufacturing Day in San Francisco, not surprisingly focusing on the work of the Technology and Manufacturing Group (TMG) within the company. This event was an exposition of the 10nm process, a new 22FFL ultra-low-power process, a quick mention of EMIB packaging, a plug for the enhanced 14nm technologies, some more marketing of Intel foundry, [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • The ConFab 2018 will be held May 20-23

    The ConFab 2018, to be held May 20-23 in Las Vegas, will take a close look at the new applications driving the semiconductor industry, the technology that will be required at the device and process level to meet new demands, and – perhaps most importantly – the kind of strategic collaboration that will be required. It is this combination of business, technology and social interactions that make [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • MEMS & Sensors Technical Congress 2017: Knowing Your Unknowns

    By Karen Lightman, MEMS & Sensors Industry Group | SEMI As in life, knowing everything in MEMS and sensors is impossible. Often the best we can do is to “know the unknowns” because articulating what we do not yet understand allows us to seek answers so that we can stay competitive. MEMS and sensors supply chain members need to know what is “state of the art” in terms of technology, [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • Understanding EUV Lithography Basics and Status – Key Concepts

    By Vivek Bakshi, EUV Litho, Inc. For a better understanding of EUVL’s status, challenges and opportunities, it is important to study its fundamental components. There are several, with the main ones being source, mask, optics, imaging and resists. They are very different from those in the current 193 nm immersion lithography, and a comprehensive overview of these components is a must. Hence, in [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • PCM + ReRAM = OUM as XPoint

    The good people at TECHINSIGHTS have reverse-engineered an Intel “Optane” SSD to cross-section the XPoint cells within (http://www.eetimes.com/author.asp?section_id=36&doc_id=1331865&), so we have confirmation that the devices use chalcogenide glasses for both the switching layer and the selector diode. That the latter is labeled “OTS” (for Ovonic Threshold Switch) explains the confusion [...]