Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.
- Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
IFTLE 225 IEEE 3DIC – Cork: The Thermal Impact of TSVs – reexamined; Parylene: an IFTLE alternative opinion
By Dr. Phil Garrou, Contributing Editor Let’s take a look at some of the key presentations at the 2014 IEEE 3DIC Conference recently in Cork, Ireland. Global Integration Institute (GINTI) – µ-XRD for Thermo-mechanical Stress Measurement Copper-Through-Silicon-Via (Cu-TSV) is increasingly used for two reasons: (i) the very low resistivity of Cu as compared to that of the other TSV-fill [...]
- DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
IEDM – Monday was FinFET Day
By Dick James, Senior Analyst, Chipworks In my conference preview blog last week, I mentioned that session 3 on the Monday afternoon would be a hot session, with three finFET papers, by TSMC, Intel, and IBM. I was right – even though they were given in the Grand Ballroom, it was full. Paper 3.1 from TSMC disclosed what looks like their 16FF+ 16nm finFET technology, advanced from the 16FF reported [...]
- Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
Semiconductor Materials: Growth, Opportunities and Challenges
Don’t miss this week’s webcast on Thursday at 1:00 pm Eastern, 10:00am Pacific. We have two great speakers lined up. First, Lita Shon‐Roy, President/CEO of Techcet, will provide an overview of chip level materials markets, focusing on growth and opportunities. Next, SRC’s Jon Candelaria, Director, GRC Interconnect and Packaging Sciences, will describe how today’s researchers are exploring [...]
Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.
Wearable Devices and the Search for the Holy Grail at 2015 International CES
By Karen Lightman, Executive Director, MEMS Industry Group Several years ago, I coined the phrase “MEMS frickin’ everywhere.” I shared my vision for MEMS enabling a smarter and better world. This was before the term Internet of Things (IoT) had taken hold. My catchphrase got me into a bit of trouble with those offended by my use of a modified expletive as well as skeptics of the potential [...]
- Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
2014 EUV Source Workshop Summary
By Vivek Bakshi, EUV Litho, Inc. Short Summary At the 2014 Source Workshop in Dublin, the semiconductor industry’s largest annual gathering of EUV source experts, we received the latest updates on current EUV source technology (Sn laser-produced plasma [LPP]) and discussed potential and challenges of Free Electron Laser (FEL) based sources as the next generation high power EUV sources. The [...]
- Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
Ferromagnetic Room Temperature Switching
Bismuth-ferrite could make spin-valves that use 1/10th the power of STT A research team led by folks at Cornel University (along with University of California, Berkeley; Tsinghua University; and Swiss Federal Institute of Technology in Zurich) have discovered how to make a single-phase multiferroic switch out of bismuth ferrite (BiFeO3) as shown in an online letter to Nature. Multiferroics, allowing [...]