Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 327 SEMI 3D Summit Part 3: Increased Use of Sensors; HVM FOWLP Applications

    By Dr. Phil Garrou, Contributing Editor Finishing our look at the 2017 SEMI 3D Summit in Grenoble. Yole Thibault Bisson of Yole discussed 3D packaging as a key enabler. Yole predicts a significant increase in the use of sensors in smartphones. While the use of sensors was limited to 3 during the advent of the smartphone in ~2007 (microphone, accelerometer and CIS), by 2021 they expect [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • Intel's 10nm Enigma

    By Dick James I’ve been looking back at the talk given by Mark Bohr and Zane Ball (Building Winning Products with Intel® Advanced Technologies and Custom Foundry Platforms) at the Intel Developer Forum (IDF) in August last year, and I’m a bit puzzled. [caption id="attachment_444" align="alignnone" width="625"] Mark Bohr presenting at the 2016 IDF in San Francisco (Source: Intel)[/caption] Mark [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • The New Driver for Semiconductor Tech

    Over the past 40 years, the electronics industry has gone through three distinct stage or “waves” of evolution. Last year, in a Solid State Technology webcast presentation, Intel’s Islam Salama described the waves and how the latest wave is driving the semiconductor industry in new and very different ways. Dr. Salama is responsible for packaging substrate pathfinding of high density interconnects [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Sentimental Feelings – Looking Back and Forward to MEMS & Sensors Executive Congress

    By Karen Lightman, Executive Director, MEMS & Sensors Industry Group I’m feeling sentimental as I prepare with the MEMS & Sensors Industry Group (MSIG) team for our annual MEMS & Sensors Executive Congress. Maybe it’s because this will be the last Executive Congress before MSIG becomes a strategic association partner of SEMI (here’s the announcement in case you missed it). I remember [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • Further Thoughts from the 2017 SPIE AL EUV Lithography Conference

    By Vivek Bakshi, EUV Litho, Inc. Stochastics, Lent, Reporting on Conferences, Reality of Things, and a New SEMATECH In the previous blog, I listed technology status and would now like to discuss a couple of topics in detail. During last year's SPIE AL conference, the message for EUVL was “Not If, but When.” This year the message was “Not If, but When and How Much Volume.” It was nice [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • EUVL Masks may need to be Tool-Specific

    Extreme Ultra-Violet Lithography (EUVL) keeps hurting my brain. Just when I can understand how it could be used in profitable commercial high-volume manufacturing (HVM) I hear something that seriously strains my brain. First it was the mirrors and mask in vacuum, then it was the resist and pellicle, then it was the source power and availability, and in each case scientists and engineers did amazing [...]