Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 234 IBM to Share Technology with China; More on Apple A9 Business; Fujitsu puts liquid Cooling in Smartphones

    By Dr. Phil Garrou, Contributing Editor IBM to share technology with China In IFTLE 222, we discussed the recent announcement by China that they are becoming a major predator of the IC business. This is exemplified by recent acquisitions of STATSChipPAC (see IFTLE 222)(link),  FlipChip Int (FCI) (link) and Omnivision. Now, according to Reuters, IBM Corp has announced that they will share [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • IEDM – Monday was FinFET Day

    By Dick James, Senior Analyst, Chipworks In my conference preview blog last week, I mentioned that session 3 on the Monday afternoon would be a hot session, with three finFET papers, by TSMC, Intel, and IBM. I was right – even though they were given in the Grand Ballroom, it was full. Paper 3.1 from TSMC disclosed what looks like their 16FF+ 16nm finFET technology, advanced from the 16FF reported [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • IoT and The ConFab 2015

    I’m delighted to announce the keynotes and other key speakers for The ConFab 2015, to be held May 19-22 at The Encore at The Wynn in Las Vegas. Our first keynote, on Wednesday, will be Ali Sebt, President and CEO of Renesas America, who will provide his insight on monetizing the Internet of Things. He’ll discuss how intelligent and connected platforms will enable new value chains based on a [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Karen’s Hamburg MEMS Roadtrip – A Great Gig

    By Karen Lightman, Executive Director, MEMS Industry Group My favorite kind of business travel is when I can combine it with either a visit with friends/family or a site visit to a MEMS Industry Group (MIG) member company. This month, before I headed to Copenhagen to host MEMS Executive Congress Europe 2015, I had the pleasure of doing both. In the immortal words of the Beatles, I went to Hamburg [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • 2015 SPIE Advanced Lithography EUVL Conference – Summary and Analysis

    By Vivek Bakshi, EUV Litho, Inc. The SPIE AL EUVL Conference was held from February 22-26, 2015 in San Jose, CA. The atmosphere in this year’s EUVL Conference was the most positive toward EUVL that I have ever seen.  Here, in this blog, I will summarize the papers and data that caught my attention, give my opinion on the latest status of EUVL, and list the challenges that are still to be addressed. Scanner [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Batteries? We don’t need no stinking batteries.

    We’re still used to thinking that low-power chips for “mobile” or “Internet-of-Things (IoT)” applications will be battery powered…but the near ubiquity of lithium-ion cells powering batteries could be threatened by capacitors and energy-harvesting circuits connected to photovoltaic/thermoelectric/piezoelectric micro-power sources. At ISSCC2015 in San Francisco last week, there were several [...]