Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 240 AMD introduces High Bandwidth Memory (HBM) on Fiji R9 390X GPU

    By Dr. Phil Garrou, Contributing Editor AMD announces HBM in 2015 High End Graphics Module “FIJI” For over two years now, IFTLE has been saying that memory stacks will soon be seen in high end graphics processor modules. Nvidia was the first to announce the use of stacked memory with GPUs [see IFTLE 145 “GPU Roadmap….” (April 2013)]. Nvidia’s Volta GPU module was scheduled for 2015 [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • The Confab – Semi Industry is Now Mature

    By Dick James, Senior Technology Analyst, Chipworks The Confab started on Tuesday last week, an industry get-together organised by Solid State Technology (part of Extension Media), which they promote it as the “Semiconductor Manufacturing & Design Industry's Premier Conference and Networking Event”. The conference portion started with an afternoon panel session, “Exploring the Edges [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • IoT, Healthcare and 5G to Drive RF and Microwave

    Imagine the world in 2020, only five years from now. If predictions hold true, more than 50 billion devices will be connected to the Internet (creating the Internet of Things), through smart homes, smart cities, smart factories, smart everything. Two recent Cisco studies show there’s $19 trillion in IoT value is at stake in the private ($14.4 trillion) and public ($4.6 trillion) sectors. The studies [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Karen’s Hamburg MEMS Roadtrip – A Great Gig

    By Karen Lightman, Executive Director, MEMS Industry Group My favorite kind of business travel is when I can combine it with either a visit with friends/family or a site visit to a MEMS Industry Group (MIG) member company. This month, before I headed to Copenhagen to host MEMS Executive Congress Europe 2015, I had the pleasure of doing both. In the immortal words of the Beatles, I went to Hamburg [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • 2015 SPIE Advanced Lithography EUVL Conference – Summary and Analysis

    By Vivek Bakshi, EUV Litho, Inc. The SPIE AL EUVL Conference was held from February 22-26, 2015 in San Jose, CA. The atmosphere in this year’s EUVL Conference was the most positive toward EUVL that I have ever seen.  Here, in this blog, I will summarize the papers and data that caught my attention, give my opinion on the latest status of EUVL, and list the challenges that are still to be addressed. Scanner [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Bottoms-up ELD of Cobalt Plugs

    As reported in more detail at Solid State Technology, during the IEEE IITC now happening in Grenoble, imec and Lam showed a new Electroless Deposition (ELD) cobalt (Co) process that is claimed to provide void-free bottoms-up pre-filling of vias and contacts. The unit-process is intended to be integrated into flows to produce scaled interconnects for logic and DRAM ICs at the 7nm node and below. Co-incidentally [...]