Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.
- Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
IFTLE 211 Semicon Taiwan part 2: Unimicron, Yole, Micron
By Dr. Phil Garrou, Contributing Editor Continuing our look at 2014 SEMICON Taiwan. Unimicron YH Chen of Unimicron addressed “Panel Level Embedded Substrate Technology.” Unimicron puts forth a proposal that embedded packaging saves cost because it (a) decreases the substrates used,(b) decreases the area of HDI board needed, (c) better electrical performance due to the proximity of the [...]
- DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
The Second Shoe Drops - Now We Have the Samsung V-NAND Flash
By Dick James, Senior Technology Analyst, Chipworks Two weeks ago, we posted about the TSMC 20nm product that we had in-house; now after waiting for a year since Samsung's announcement of V-NAND production, we have that in the lab and can start to see what it looks like. The vertical flash was first released in an enterprise solid-state drive (SSD) last year, in 960 GB and 480 GB versions, [...]
- Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.
By Stephen Whalley, Chief Strategy Officer, MEMS Industry Group It was over 10 years ago that I last visited Shanghai and oh my, how things have changed, most visibly, the skyline. Looking across the Huangpu River from The Bund back then, I clearly remember the ‘Pearl’ TV tower and a few tall buildings and thought how impressive it looked. Now, the view is an even more sumptuous feast [...]
- Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
Thoughts on the Significance of IBM’s EUV Benchmark
By Vivek Bakshi, EUV Litho, Inc. Since I posted in last week’s EUVL Focus blog the news of IBM’s EUV benchmark with the NXE3300B scanner at the EUV Center of Excellence in Albany, this news has received lots of attention, as it is a significant achievement. I have also received some questions and comments. I believe most of them come from a lack of familiarity with leading edge tool development [...]
- Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
IBM Shows Graphene as Epi Template
Last month in Nature Communications (doi:10.1038/ncomms5836) IBM researchers Jeehwan Kim, et al. published “Principle of direct van der Waals epitaxy of single-crystalline films on epitaxial graphene.” They show the ability to grow sheets of graphene on the surface of 100mm-diameter SiC wafers, the further abilitity to grow epitaxial single-crystalline films such as 2.5-μm-thick GaN on the graphene, [...]