Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 248 ECTC 4 Oxidation of EMC in Thin Packages; Compression Molding Large Panels; TSV Noise Coupling in 3DIC

    By Dr. Phil Garrou, Contributing Editor Continuing our look at the 2015 ECTC. Freescale - High Temperature Storage of Ultra-Thin Molded Array Packages Ultra-thin molded array packages (TMAP) with package thickness ≤ 500 μm are desirable for applications where system integration space is limited. Such ultra-thin packages require careful selection of the epoxy molding compound (EMC) to control [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • The Confab – Semi Industry is Now Mature

    By Dick James, Senior Technology Analyst, Chipworks The Confab started on Tuesday last week, an industry get-together organised by Solid State Technology (part of Extension Media), which they promote it as the “Semiconductor Manufacturing & Design Industry's Premier Conference and Networking Event”. The conference portion started with an afternoon panel session, “Exploring the Edges [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • IoT, Healthcare and 5G to Drive RF and Microwave

    Imagine the world in 2020, only five years from now. If predictions hold true, more than 50 billion devices will be connected to the Internet (creating the Internet of Things), through smart homes, smart cities, smart factories, smart everything. Two recent Cisco studies show there’s $19 trillion in IoT value is at stake in the private ($14.4 trillion) and public ($4.6 trillion) sectors. The studies [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Karen’s Hamburg MEMS Roadtrip – A Great Gig

    By Karen Lightman, Executive Director, MEMS Industry Group My favorite kind of business travel is when I can combine it with either a visit with friends/family or a site visit to a MEMS Industry Group (MIG) member company. This month, before I headed to Copenhagen to host MEMS Executive Congress Europe 2015, I had the pleasure of doing both. In the immortal words of the Beatles, I went to Hamburg [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • EUV Lithography – What is Next and When?

    By Vivek Bakshi, EUV Litho, Inc. This year started with an announcement, during the SPIE AL Conference, of the achievement of 100 W+ power from high volume manufacturing (HVM) EUV sources in the fab. One hundred watts at intermediate focus has been a long-standing benchmark and is a definite success, and we also can be sure that source power and availability will increase this year. The focus will [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Cross-point ReRAM Integration Claimed by Intel/Micron

    The Intel/Micron joint-venture now claims to have successfully integrated a Resistive-RAM (ReRAM) made with an unannounced material in a cross-point architecture, switching using an undisclosed mechanism. Pilot production wafers are supposed to be moving through the Lehi fab, and samples to customers are promised by end of this year. HP Labs announced great results in 2010 on prototype ReRAM using [...]