Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 322 SEMI ISS 2017: A Period of Uncertainty?

    By Dr. Phil Garrou, Contributing Editor SEMI’s annual Industry Strategy Symposium was held at its usual site, Half Moon Bay, CA a few weeks ago. It may just be me, but it seemed like this year’s overall message was one of an industry searching. IFTLE thinks the end of scaling and the public indications that 450mm does not appear to be moving forward has left the industry wandering a bit. [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • Intel's 10nm Enigma

    By Dick James I’ve been looking back at the talk given by Mark Bohr and Zane Ball (Building Winning Products with Intel® Advanced Technologies and Custom Foundry Platforms) at the Intel Developer Forum (IDF) in August last year, and I’m a bit puzzled. [caption id="attachment_444" align="alignnone" width="625"] Mark Bohr presenting at the 2016 IDF in San Francisco (Source: Intel)[/caption] Mark [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • The New Driver for Semiconductor Tech

    Over the past 40 years, the electronics industry has gone through three distinct stage or “waves” of evolution. Last year, in a Solid State Technology webcast presentation, Intel’s Islam Salama described the waves and how the latest wave is driving the semiconductor industry in new and very different ways. Dr. Salama is responsible for packaging substrate pathfinding of high density interconnects [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Sentimental Feelings – Looking Back and Forward to MEMS & Sensors Executive Congress

    By Karen Lightman, Executive Director, MEMS & Sensors Industry Group I’m feeling sentimental as I prepare with the MEMS & Sensors Industry Group (MSIG) team for our annual MEMS & Sensors Executive Congress. Maybe it’s because this will be the last Executive Congress before MSIG becomes a strategic association partner of SEMI (here’s the announcement in case you missed it). I remember [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • Bringing you Holiday Cheers – Courtesy of Moore’s Law

    Vivek Bakshi, EUV Litho, Inc. Author's preface: This article is a departure from my usual high-tech language, because I think our industry needs to do more to educate non-technical readers about how their treasured electronic devices got to be so cheap and powerful. Our success in realizing Moore's Law has been one of the greatest achievements in modern science, and we must continue doing all we [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • XMC becomes YRST or Changjiang Storage

    As reported by Digitimes, a major enterprise in Wuhan, China has broken ground on the first of three mega-fabs to produce 3D-NAND chips. The final fab name-plate may ultimately read XMC or YMTC or YRST or possibly Changjiang Storage (not to be confused with GuangDong ChangJiang Storage Battery), but it is over half owned by the Chinese government’s Tsinghua Unigroup. Total investment in XMC/YRST [...]