Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.
- Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
IFTLE 206 COSMOS and DAHI Herald the Era of 3D Heterogeneous Integration
By Dr. Phil Garrou, Contributing Editor For about a decade now, we have been awaiting the full commercialization of 3DIC. From the beginning most practitioners laid out a roadmap where CMOS Image sensors led the way followed by memory stacks, memory-on-logic, logic on logic and lastly the holy grail of heterogeneous integration where we could combine advanced semiconductor materials and different [...]
- DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
The Second Shoe Drops - Now We Have the Samsung V-NAND Flash
By Dick James, Senior Technology Analyst, Chipworks Two weeks ago, we posted about the TSMC 20nm product that we had in-house; now after waiting for a year since Samsung's announcement of V-NAND production, we have that in the lab and can start to see what it looks like. The vertical flash was first released in an enterprise solid-state drive (SSD) last year, in 960 GB and 480 GB versions, [...]
- Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.
Thoughts on MIG Conference Japan
By Karen Lightman, Executive Director, MEMS Industry Group I am finally over the jet lag and able to share my thoughts from MEMS Industry Group (MIG) Conference Japan, MIG’s inaugural conference in Asia that was held on April 24. But first let me quickly express my happiness to have returned to Japan after a three+ year hiatus. (My last visit was before the tsunami/earthquake.) I ate sushi every [...]
- Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
Thoughts on the Significance of IBM’s EUV Benchmark
By Vivek Bakshi, EUV Litho, Inc. Since I posted in last week’s EUVL Focus blog the news of IBM’s EUV benchmark with the NXE3300B scanner at the EUV Center of Excellence in Albany, this news has received lots of attention, as it is a significant achievement. I have also received some questions and comments. I believe most of them come from a lack of familiarity with leading edge tool development [...]
- Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
Leti integrates everything
[caption id="attachment_59" align="alignleft" width="625"] Figure 1: Leti’s 300mm diameter silicon wafer fabrication line on the MINATEC campus in Grenoble, France. In the foreground is space for a new fab intended for work on silicon-photonics. (Source: Ed Korczynski)[/caption] Now I know how wafers feel when moving through a fab. Leti in Grenoble, France does so much technology integration that [...]