Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 201 2014 ConFab: Global Foundries; IBM, G450C

    By Dr. Phil Garrou, Contributing Editor Yes, we have now passed numero 200 on what I shall self proclaim the #1 informational blog for 3DIC and advanced packaging on the internet! Again, my thanks to Pete Singer for continued support. Now that you have taken a look at us, let's take a look at some of the presentations at this year's ConFab.  Subramani Kengeri, Vice President, Advanced Technology [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • TSMC 20nm Arrives – The First Shoe Drops

    By Dick James, Senior Technology Analyst, Chipworks For us at Chipworks interested in leading edge processes, 2014 so far has been the year of waiting for parts and processes that have been announced, but not shown up in the world of commercial production. It will surprise no-one in the business that they are Intel’s 14-nm, the 20-nm products from any of the big three foundries (in particular [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • Can we take cost out of technology scaling?

    There is much talk these days about continued scaling, including some recent posts by my colleague Ed Korczynski, in “Moore’s Law is Dead” Part 1 (What?) and Part 2 (When?). At The ConFab in June, keynote speaker, Dr. Gary Patton, vice president, semiconductor research and development center at IBM, talked about scaling, adding some historical perspective. I previously blogged about the “three [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Thoughts on MIG Conference Japan

    By Karen Lightman, Executive Director, MEMS Industry Group I am finally over the jet lag and able to share my thoughts from MEMS Industry Group (MIG) Conference Japan, MIG’s inaugural conference in Asia that was held on April 24. But first let me quickly express my happiness to have returned to Japan after a three+ year hiatus. (My last visit was before the tsunami/earthquake.) I ate sushi every [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • 2014 EUVL Workshop: Highlights and Summary

    By Vivek Bakshi, EUV Litho, Inc. Keynote talks The 2014 EUVL Workshop was held late last month amid some positive highlights and lots of R&D updates. The keynote talks this year were from Intel, Gigaphoton and Toshiba. Intel in their keynote, paraphrasing Mark Twain and Mark Bohr, said that “rumors of scaling’s death are greatly exaggerated!” I tend to agree. In terms of choices [...]