Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 202 ConFab 2014: Novati, Lumileds; Chipworks; IEEE CPMT Packaging Panel

    By Dr. Phil Garrou, Contributing Editor Dave Anderson, CEO of Novati talked about “More-than-Moore, Advanced Packaging and Creating Game-Changing Innovation.” In keeping with the main theme expressed by IFTLE for several years, Anderson echoed, “Most companies can’t afford to continue to pursue Moore’s Law scaling” and offered “More-than-Moore” as a product customization route for [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • TSMC 20nm Arrives – The First Shoe Drops

    By Dick James, Senior Technology Analyst, Chipworks For us at Chipworks interested in leading edge processes, 2014 so far has been the year of waiting for parts and processes that have been announced, but not shown up in the world of commercial production. It will surprise no-one in the business that they are Intel’s 14-nm, the 20-nm products from any of the big three foundries (in particular [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • Can we take cost out of technology scaling?

    There is much talk these days about continued scaling, including some recent posts by my colleague Ed Korczynski, in “Moore’s Law is Dead” Part 1 (What?) and Part 2 (When?). At The ConFab in June, keynote speaker, Dr. Gary Patton, vice president, semiconductor research and development center at IBM, talked about scaling, adding some historical perspective. I previously blogged about the “three [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Thoughts on MIG Conference Japan

    By Karen Lightman, Executive Director, MEMS Industry Group I am finally over the jet lag and able to share my thoughts from MEMS Industry Group (MIG) Conference Japan, MIG’s inaugural conference in Asia that was held on April 24. But first let me quickly express my happiness to have returned to Japan after a three+ year hiatus. (My last visit was before the tsunami/earthquake.) I ate sushi every [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • New Benchmark Established for EUV

    I received this news from Dan Corliss of IBM today and it is reproduced below. Dan is the EUV Development Program Manager for IBM. As the previous goal for ASML scanner for 2014 was 500 wafers a day, this is definitely big news. Dan called it a “watershed moment” in his LinkedIn post. Of course, we need to see this type of performance to happen longer term like weekly basis, and it needs to be [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Moore's Law is Dead - (Part 4) Why?

    We forgot Moore merely meant that IC performance would always improve (Part 4 of 4) IC marketing must convince customers to design ICs into electronic products. In 1965, when Gordon Moore first told the world that IC component counts would double in each new product generation, the main competition for ICs was discrete chips. Moore needed a marketing tool to convince early customers to commit to [...]