Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 291 Samsung EM enters FO-WLP Packaging Mkt; Mold Cmpd Free FO-WLP for Sub MM ICs

    By Dr. Phil Garrou, Contributing Editor Samsung Electro-Mechanics launches IC packaging business Reports are that Samsung EM (Electro-Mechanics), part of the Samsung Group, is entering the integrated circuit packaging business [link] Samsung Electronics system LSI and Samsung Electro-Mechanics will join forces to staff the project and launch the business. They will transform current LCD assembly [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • ASMC 2016 Conference Has Highest Attendance Ever, Chipworks Achieves Twelfth Paper

    By Dick James, Senior Technology Analyst, Chipworks It’s spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference, in the amiable ambiance of Saratoga Springs, New York. The conference took place a couple of weeks ago, on May 16 – 19. As the name says, ASMC is an annual conference focused on the manufacturing [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • 10 Reasons to Attend The ConFab this June

    The ConFab Conference and Networking Event will be held June 12-15. Presented by Solid State Technology, this executive-level event is designed exclusively for those driving growth and innovation in the semiconductor industry. With a theme the “New Age of Innovation for Semiconductors,” it features deep insights on the challenges and opportunities facing the industry and also offers powerful networking [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Check out the finalists for MEMS & Sensors Technology Showcase at MEMS Executive Congress 2015

    By Karen Lightman, Executive Director, MEMS Industry Group Back in 2001 when I was a young mother with a baby in diapers, I dreamed of a MEMS-enabled gizmo (perhaps on her diaper?) that would remotely indicate if my daughter was sleeping. She was (and still is) a restless sleeper, and I had many nights where I tip-toed into her room to ensure that she was breathing and yes, indeed, still alive in [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • Latest on EUVL Development to be Discussed in EUVL Workshop in Berkeley

    By Vivek Bakshi, EUV Litho, Inc. During this year’s SPIE Advanced Lithography conference in San Jose, there was a definite switch to optimism about EUVL from all keynote speakers. The message of “Not if, but when” for EUVL ‒ with early adoption expected in coming years ‒ was clearly heard from leading-edge chip makers and EUVL suppliers. With demonstration of 200 W source in the lab and [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Eloquent Executives Ecosystem Expositions

    #cmc,#confab,#namedropping With dimensional scaling reaching economic limits, each company in the IC fab industry must rely upon trusted connections with customers and suppliers to know which way to go, and the only way to gain trusted connections is through attending live events. Fortunately, whether you are an executive, and engineer, or an investor, there is at least one must-attend event happening [...]