Electronics Manufacturing Blog

Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.

    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 308 SEMICON Taiwan Part 2: Laser Processing for WLP; IoT in the Post-Smart Phone Era

    By Dr. Phil Garrou, Contributing Editor Continuing our look at Advanced Packaging in SEMICON Taiwan 2016. AMKOR – Lasers for the Manufacture of WLCSP WL Huang of Amkor examined the use of lasers in the manufacture of WLCSP (fan-in WLP). As we all know by now Huang pointed to size, weight, cost and performance as the drivers for WLCSP. In the following chart, Huang shows that the same [...]

    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • ST Micro electronics Time-of Flight Sensors and Starship Enterprise Show up in the iPhone 7 Series

    By Dick James, Senior Technology Analyst, Chipworks One of the lesser-known stories of mobile phone evolution is the development of proximity sensing in order to save power and disable touch-screen functions when the phone is actually being used as a phone. This essentially means turning off the screen (and the touch-capability tasks) when the phone is brought up to the ear. In the very early [...]

    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • Etch Abatement Needed at 200mm Fabs to Meet WSC Goals for 2020

    I'm delighted to turn the blog over again to Mike Czerniak, Environmental Solutions Business Development Manager at Edwards. A longtime champion of the environment, Mike, nominated by the UK Department of Energy and Climate Change (DECC), was just been accepted as the ‘expert witness’ on CF4 for the forthcoming Intergovernmental Panel on Climate Change (IPCC) working party on emissions of this [...]

Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Sentimental Feelings – Looking Back and Forward to MEMS & Sensors Executive Congress

    By Karen Lightman, Executive Director, MEMS & Sensors Industry Group I’m feeling sentimental as I prepare with the MEMS & Sensors Industry Group (MSIG) team for our annual MEMS & Sensors Executive Congress. Maybe it’s because this will be the last Executive Congress before MSIG becomes a strategic association partner of SEMI (here’s the announcement in case you missed it). I remember [...]

    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • Pushing Frontiers of EUV Source Technology – 2016 Source Workshop (November 7-9, 2016)

    By Vivek Bakshi, EUV Litho, Inc. EUV Sources remain the key component for ensuring EUV Lithography’s entry into fabs for high-volume manufacturing. Two big factors that have enabled dramatic progress in source readiness are related to improvements in source power and source lifetime. Now the question is how far we can push source power and lifetime, and what is needed to enable continued progress. For [...]

    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Dan Rose departs material realm

    [caption id="attachment_267" align="alignleft" width="208"] Daniel J. Rose, Ph.D. November 7, 1937 – September 20, 2016[/caption] With sadness I post that Daniel J. Rose, Ph.D.—founder of Rose Associates—passed away on September 20, 2016, due to complications of Alzheimer’s disease. Dan Rose received a Ph.D. in materials engineering from the University of British Columbia, and subsequently [...]