Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.
By Dr. Phil Garrou, Contributing Editor
Yes, we have now passed numero 200 on what I shall self proclaim the #1 informational blog for 3DIC and advanced packaging on the internet! Again, my thanks to Pete Singer for continued support.
Now that you have taken a look at us, let's take a look at some of the presentations at this year's ConFab. Subramani Kengeri, Vice President, Advanced Technology [...]
By Dick James, Senior Technology Analyst, Chipworks
For us at Chipworks interested in leading edge processes, 2014 so far has been the year of waiting for parts and processes that have been announced, but not shown up in the world of commercial production. It will surprise no-one in the business that they are Intel’s 14-nm, the 20-nm products from any of the big three foundries (in particular [...]
There is much talk these days about continued scaling, including some recent posts by my colleague Ed Korczynski, in “Moore’s Law is Dead” Part 1 (What?) and Part 2 (When?). At The ConFab in June, keynote speaker, Dr. Gary Patton, vice president, semiconductor research and development center at IBM, talked about scaling, adding some historical perspective. I previously blogged about the “three [...]
Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.
By Karen Lightman, Executive Director, MEMS Industry Group
I am finally over the jet lag and able to share my thoughts from MEMS Industry Group (MIG) Conference Japan, MIG’s inaugural conference in Asia that was held on April 24. But first let me quickly express my happiness to have returned to Japan after a three+ year hiatus. (My last visit was before the tsunami/earthquake.) I ate sushi every [...]
By Vivek Bakshi, EUV Litho, Inc.
The 2014 EUVL Workshop was held late last month amid some positive highlights and lots of R&D updates. The keynote talks this year were from Intel, Gigaphoton and Toshiba.
Intel in their keynote, paraphrasing Mark Twain and Mark Bohr, said that “rumors of scaling’s death are greatly exaggerated!” I tend to agree. In terms of choices [...]
We forgot Moore merely meant that IC performance would always improve (Part 4 of 4)
IC marketing must convince customers to design ICs into electronic products. In 1965, when Gordon Moore first told the world that IC component counts would double in each new product generation, the main competition for ICs was discrete chips. Moore needed a marketing tool to convince early customers to commit to [...]