Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 296: The 2016 ConFab – China the "Wild Card"; HBM Close Up; Comparing High Density Packaging Technologies

    By Dr. Phil Garrou, Contributing Editor By now every web site from the MIT review to Popular Mechanics (yes, seriously) has picked up the release of the last ITRS roadmap and it's conclusion that Moore's Law or more precisely "scaling," as we have known it, are a thing of the past. I will let the dust settle and dedicate IFTLE 300, my milestone, to discuss this milestone. But for now, taking [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • IEDM 2016 Has "New Twists," Supplier Exhibits for the First Time

    By Dick James, Senior Technology Analyst, Chipworks A bit earlier than usual, the IEDM (International Electron Devices Meeting) press kit is available, and among the announcements are a couple of surprises. The biggest practical change is the addition of an exhibit hall – up to now the conference has been almost religiously anti-commercial, to the extent that forums (fora?) sponsored by (e.g.) [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • Etch Abatement Needed at 200mm Fabs to Meet WSC Goals for 2020

    I'm delighted to turn the blog over again to Mike Czerniak, Environmental Solutions Business Development Manager at Edwards. A longtime champion of the environment, Mike, nominated by the UK Department of Energy and Climate Change (DECC), was just been accepted as the ‘expert witness’ on CF4 for the forthcoming Intergovernmental Panel on Climate Change (IPCC) working party on emissions of this [...]




Karen Lightman is managing director of MEMS Industry Group, the trade association advancing MEMS across global markets.

  • Check out the finalists for MEMS & Sensors Technology Showcase at MEMS Executive Congress 2015

    By Karen Lightman, Executive Director, MEMS Industry Group Back in 2001 when I was a young mother with a baby in diapers, I dreamed of a MEMS-enabled gizmo (perhaps on her diaper?) that would remotely indicate if my daughter was sleeping. She was (and still is) a restless sleeper, and I had many nights where I tip-toed into her room to ensure that she was breathing and yes, indeed, still alive in [...]




    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • Update from EUVL Workshop in Berkeley

    By Vivek Bakshi, EUV Litho, Inc. The 2016 EUVL Workshop was held last month at LBL in Berkeley, where we heard the latest news on EUV Lithography R&D development topics. The keynote talks were given Harry Levinson (GlobalFoundries), Britt Turkot (Intel) and Igor Fomenkov (Cymer/ASML). There were progress reports on the current technical areas of focus that I will talk about below. However, [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • The Last Technology Roadmap

    After many delays, the last ever International Technology Roadmap for Semiconductors (ITRS) has been published. Now that there are just a few companies remaining in the world developing new fab technologies in each of the CMOS logic and memory spaces, each leading-edge company has a secret internal roadmap and little motivation to compare directions within fiercely competitive  commercial markets. [...]