06/28/2016 FormFactor, Inc. today announced that it has completed the acquisition of Beaverton, Oregon-based Cascade Microtech, Inc.
06/27/2016 Presto will provide supply chain management and production services for several of NAGRA’s key products in the Pay TV market.
06/27/2016 Semiconductor Manufacturing International Corporation jointly announces with LFoundry Europe GmbH and Marsica Innovation S.p.A., the signing of an agreement on June 24, 2016 to purchase a 70% stake of LFoundry for a consideration of 49 million EUR.
06/24/2016 Qualcomm Incorporated announced that it has filed a complaint against Meizu in the Beijing Intellectual Property Court.
06/24/2016 With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.
06/24/2016 In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).
06/23/2016 According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.
06/23/2016 The successful production of 28nm Snapdragon products in Beijing represents an important step for SMIC's 28nm technology.
06/23/2016 The AFS Platform provides the world's fastest circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits.
06/23/2016 POET completes the transaction owning 100% of BB Photonics and its assets, including intellectual property and technologies.
06/22/2016 Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.
06/22/2016 Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.
06/21/2016 The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.
June 2016 (Date and time TBD)/ Sponsored by Air Products
June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
coating, advantages of parylene, and applications for parylene to
protect electronic devices.
As technology continues to advance, devices will encounter rugged
environments and it is vital that they are properly protected. Parylene
conformal coating is one way that manufacturers are giving their devices
a higher level of protection, along with increasing the overall quality
of their products.
Parylene conformal coating applications for Electronics include:
· I/O & PCI Modules
· Power Converters and Supplies
· Other Embedded Computing applications
· Other specialty electronics and assemblies April 26, 2016Sponsored by Diamond-MT
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.