Device Architecture



Stanford technology makes metal wires on solar cells nearly invisible to light

11/30/2015  Stanford University scientists have discovered how to hide the reflective upper contact and funnel light directly to the semiconductor below.

Mergers: Commission clears Avago's acquisition of Broadcom

11/25/2015  The Commission concluded that the merged entity would continue to face effective competition in Europe.

Lattice Semiconductor appoints new COO

11/25/2015  Lattice Semiconductor Corporation, a manufacturer of programmable logic devices, has appointed Glen Hawk as COO.

Silicon Labs acquires Telegesis, a provider of ZigBee modules

11/24/2015  A privately held company founded in 1998 and based near London, Telegesis has established itself as a ZigBee expert with strong momentum in the smart energy market, providing ZigBee module solutions to many of the world’s top smart metering manufacturers.

Bookings and billings in semiconductor equipment industry weaken for second consecutive month

11/20/2015  North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in October 2015 (three-month average basis) and a book-to-bill ratio of 0.98.

Inotera appoints new president

11/19/2015  Inotera's Board of Directors announced this week that they have approved the appointment of Mr. Rod Morgan as president, succeeding Dr. Scott Meikle. The change is effective January 1, 2016.

Qualcomm names Cristiano Amon president of QCT

11/19/2015  Qualcomm Incorporated today announced that Cristiano Amon has been promoted to executive vice president, Qualcomm Technologies, Inc. and president of QCT, effective immediately.

GLOBALFOUNDRIES receives quality award from INOVA Semiconductors GmbH

11/19/2015  GLOBALFOUNDRIES today announced it has been presented with an Award of Excellence from INOVA Semiconductors GmbH, a specialist in the development of products for Gigabit/s serial data communication for in-vehicle Display- and Driver Assistance Systems.

Highlights from Day 1 of IDTechEx Printed Electronics USA 2015

11/19/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

ON Semiconductor to acquire Fairchild for $2.4B

11/18/2015  The acquisition creates a leader in the power semiconductor market with combined revenue of approximately $5 billion, diversified across multiple markets with a strategic focus on automotive, industrial and smartphone end markets.





Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015