Device Architecture

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DEVICE ARCHITECTURE ARTICLES



Broadcom completes acquisition of Brocade Communications Systems

11/17/2017  Broadcom Limited, a semiconductor device supplier to the wired, wireless, enterprise storage, and industrial end markets, today announced that it has completed its acquisition of Brocade Communications Systems, Inc.

Semiconducting carbon nanotubes can reduce noise in carbon nanotube interconnects

11/17/2017  Crosstalk and noise can become a major source of reliability problems of CNT based VLSI interconnects in the near future.

A new window into electron behavior

11/17/2017  Scientists invent technique to map energy and momentum of electrons beneath a material's surface.

SkyWater significantly expands pure-play technology foundry customer base

11/16/2017  SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

Marvell Semiconductor president and CEO Matt Murphy elected chair of SIA

11/16/2017  The Semiconductor Industry Association today announced the SIA Board of Directors has elected Matt Murphy, president and CEO of Marvell Semiconductor, Inc., as its 2018 Chair and Sanjay Mehrotra, president and CEO of Micron Technology, Inc., as its 2018 Vice Chair.

Electronics industry conference to debut in Kuala Lumpur

11/15/2017  SEMICON Southeast Asia 2018 to bolster growing semiconductor industry in the region.

Will Samsung's 2017 semi capex deliver knockout blow to competition?

11/15/2017  The company’s $26 billion in 2017 outlays expected to be more than Intel and TSMC combined.

SUNY Poly, IBM celebrates 20th anniversary of copper interconnects during Albany nanotechnology symposium

11/14/2017  SUNY Polytechnic Institute (SUNY Poly) is hosting the 11th IEEE Nanotechnology Symposium at its world-class Albany NanoTech Complex on Wednesday, November 15, from 9 a.m. to 5:30 p.m.

First SEMICON Europa opens this year in co-location with productronica

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

GLOBALFOUNDRIES, Fudan team to deliver next generation dual interface smart card

11/14/2017  GF's 55LPx platform with embedded non-volatile memory and integrated RF enables Fudan to create China's most advanced CPU bank card.

Ben-Gurion University researchers achieve breakthrough in camouflaging an optical chip rendering it invisible

11/14/2017  Ben-Gurion University of the Negev (BGU) researchers have achieved a breakthrough in manipulating light to render an object, such as an optical chip, invisible.

Micron advances persistent memory with 32GB NVDIMM

11/13/2017  Micron Technology, Inc., today announced a new 32GB NVDIMM-N offering twice the capacity of existing NVDIMMs, providing system designers and original equipment manufacturers with new flexibility to work with larger data sets in fast persistent memory.

An interview with Bosch Sensortec CEO: IoT, environmental sensing and value chain

11/10/2017  SEMI interviewed one of the four keynotes presenting on November 14 during the Opening Ceremony, Dr. Stefan Finkbeiner, CEO of Bosch Sensortec, about topics about developments and trends in IoT, Environmental Sensing, and Value Chain as well as the role of Europe.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

VIDEOS