Device Architecture

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DEVICE ARCHITECTURE ARTICLES



Texas Instruments announces strategic relationship with Silicon Catalyst

08/30/2016  Texas Instruments (TI) recently entered into an agreement with Silicon Catalyst, a Silicon Valley-based incubator, that will expand TI's access to new technology innovations and potentially lead to engagements with semiconductor startups focused on creating chips and system solutions in analog and embedded processing.

Industry veteran Lung Chu named president of SEMI China

08/30/2016  SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016.

MCU market forecast to reach record high revenues through 2020

08/30/2016  After recent years of price erosion, MCU ASPs are forecast to rise and help lift sales to new highs.

Silego announces shipping more than 2 billion configurable mixed-signal ICs

08/29/2016  Silego Technology today announced shipping two billion units since its introduction of the pioneering Configurable Mixed-signal ICs (CMICs). In just two years since Silego Technology announced shipment of its billionth unit, Silego has more than doubled its total volume shipped.

TowerJazz and SMIC’s sales forecast to surge in 2016

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

Hua Hong Semiconductor taps potential of international MCU markets

08/22/2016  Hua Hong Semiconductor Limited, a global pure-play 200mm foundry, today announced that its shipment of microcontroller (MCU) chips in the first half of 2016 grew to 1.2 billion, a year-on-year increase of 50%, breaking the historical record.

China's semiconductor industry worth $157.66B by 2020

08/22/2016  The China semiconductor industry is expected to reach $157.66 billion by 2020, at a CAGR of 12.8% between 2016 and 2020.

New theory could lead to new generation of energy friendly optoelectronics

08/22/2016  Researchers at Queen's University Belfast and ETH Zurich, Switzerland, have created a new theoretical framework which could help physicists and device engineers design better optoelectronics.

Intel to produce 10nm ARM chip designs

08/19/2016  ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

Innodisk unveils its next-generation M2DOM

08/19/2016  Innodisk unveiled its Next Generation innovation in flash storage design technology last week during its VIP product launch at the Hyatt Hotel in Santa Clara, CA.

GlobalWafers to acquire SunEdison Semiconductor

08/18/2016  GlobalWafers Co., Ltd. and SunEdison Semiconductor Limited (NASDAQ:SEMI) announced today that they have entered into a definitive agreement for the acquisition by GlobalWafers of all of the outstanding ordinary shares of SunEdison Semiconductor in a transaction valued at US$683 million, including SunEdison Semiconductor outstanding net indebtedness.

Reno Sub-Systems secures first EVC matching network design win and large production order

08/16/2016  Reno Sub-Systems today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network.

Hexagonal boron nitride semiconductors enable cost-effective detection of neutron signals

08/16/2016  Texas Tech University researchers demonstrate hexagonal boron nitride semiconductors as a cost-effective alternative for inspecting overseas cargo containers entering US ports.

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TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

Date and time TBD / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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EVENTS



European MEMS Summit 2016
Stuttgart, Germany
http://www.semi.org/eu/node/8871
September 15, 2016 - September 16, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS