Device Architecture

DEVICE ARCHITECTURE ARTICLES



$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

IBM releases new all-flash storage for cognitive workloads

01/13/2017  IBM this week announced new, all-flash storage solutions designed for midrange and large enterprises, where high availability, continuous up-time, and performance are critical.

NUS researchers achieve major breakthrough in flexible electronics

01/13/2017  New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices.

Toshiba expands lineup of industrial-grade e-MMC embedded NAND flash memory products

01/12/2017  Toshiba America Electronic Components, Inc. this week announced the launch of its JEDEC e-MMCTM Version 5.1-compliant embedded NAND flash memory products that feature an enhanced operational temperature range of -40°C to +105°C.

Worldwide semiconductor capital spending is forecast to grow 2.9% in 2017

01/12/2017  Worldwide semiconductor capital spending is projected to increase 2.9 percent in 2017, to $69.9 billion, according to Gartner, Inc.

Synopsys extends Software Integrity Platform with acquisition of Forcheck

01/12/2017  Synopsys, Inc. today announced it has completed its acquisition of certain assets of Forcheck.

Pure-play foundry market surges 11% in 2016 to reach $50B

01/12/2017  X-Fab, SMIC, and TowerJazz each grew by ≥30% last year.

NXP honored as 2016 Top 100 Global Innovator

01/10/2017  NXP Semiconductors N.V. today announced that Clarivate Analytics, formerly the Intellectual Property & Science business of Thomson Reuters, has listed NXP in its highly anticipated list of 2016 Top 100 Global Innovators.

SEMI ISS 2017 uncovers new growth, forecast upgrades

01/10/2017  SEMI's Industry Strategy Symposium (ISS) opened yesterday with a theme focused on new industry forces and new markets.

Memory market poised for strongest annual growth through 2021

01/09/2017  Solid upside potential for DRAM, flash memory markets in 2017 and much of forecast period.

Global semiconductor sales up 7% year-to-year

01/04/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $31.0 billion for the month of November 2016, an increase of 7.4 percent compared to the November 2015 total.

Gartner forecasts flat worldwide device shipments until 2018

01/04/2017  Emerging devices can enhance conventional device sales.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

ESD Alliance reports EDA industry revenue increase for Q3 2016

12/23/2016  The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 7.0 percent for Q3 2016.

Advances in artificial intelligence, IoT highlight IHS Markit's global technology predictions for 2017

12/21/2016  From artificial intelligence to the Internet of Things (IoT), far-reaching innovations are unfolding in virtually every technology sector around the globe, continuing to change the way consumers, businesses and machines interact while also spurring the next revolution in tech market growth.

Toshiba expands line-up of embedded NAND flash memory products for automotive applications

12/20/2016  Sample shipments start from today with mass production scheduled for the second quarter (April to June) of 2017.

Seoul Semiconductor Europe GmbH announces new CEO

12/20/2016  Andreas Weisl (38), former Vice President Europe of Korean LED manufacturer Seoul Semiconductor (SSC), has taken on the position of CEO at Seoul Semiconductor Europe GmbH based Munich, Germany, with effect from November 11, 2016.

Total memory market forecast to increase 10% in 2017

12/20/2016  After two years of decline, firming ASPs for DRAM and NAND flash will boost overall memory sales.

62 new facilities start operation 2017 and beyond

12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.




TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



High Efficiency Wireless: 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS