Device Architecture

DEVICE ARCHITECTURE ARTICLES



Deca Technologies ships 100-millionth wafer-level packaged component

04/16/2014  Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET production

04/15/2014  Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

Shiny quantum dots brighten the future of solar cells

04/14/2014  A house window that doubles as a solar panel could be on the horizon, thanks to recent quantum-dot work by Los Alamos National Laboratory researchers in collaboration with scientists from University of Milano-Bicocca (UNIMIB), Italy.

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report

04/09/2014  Billings and bookings show improvement in the fourth quarter.

February semiconductor sales up 11.4 percent compared to last year

04/09/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

04/08/2014  The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

04/07/2014  The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

ROHM Semiconductor and imec join forces for ultra-low power radio R&D

04/07/2014  Nanoelectronics research center imec and ROHM Semiconductor Co. Ltd., a world-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices.

ON Semiconductor to acquire Trusense Imaging, Inc.

04/03/2014  ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

SureCore's 28nm silicon tests confirm world leading power efficiency

04/01/2014  SureCore Ltd has today announced that early testing of its innovative low power SRAM design confirms its simulations that deliver in excess of 50 percent power savings over other SRAM technologies.

MACOM announces IP licensing program for GaN-on-Si technology

04/01/2014  M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

Researchers improve performance of III-V nanowire solar cells on graphene

04/01/2014  Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene

SEMATECH announces leadership changes

03/31/2014  SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

Heat-conducting polymer cools hot electronic devices at 200 degrees C

03/31/2014  Polymer materials are usually thermal insulators. But by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, researchers have developed a thermal interface material able to conduct heat 20 times better than the original polymer. The modified material can reliably operate at temperatures of up to 200 degrees Celsius.

eInfochips opens new design services specializing in 16nm geometry

03/26/2014  eInfochips, a semiconductor and product engineering company, today launched design services for chips based on 16nm geometry.

Altera and Intel extend manufacturing partnership to include development of multi-die devices

03/26/2014  Collaboration will optimize integration of 14nm Tri-Gate Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package.

Discovery of new semiconductor holds promise for 2D physics and electronics

03/21/2014  From super-lubricants, to solar cells, to the fledgling technology of valleytronics, there is much to be excited about with the discovery of a unique new two-dimensional semiconductor, rhenium disulfide, by researchers at Berkeley Lab’s Molecular Foundry.

Mentor Graphics acquires Berkeley Design Automation

03/21/2014  Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

ChaoLogix introduces ChaoSecure technology to boost semiconductor chip security

03/20/2014  ChaoLogix, Inc., a semiconductor technology provider focused on developing embedded security and low-power design intellectual property, today introduced ChaoSecure technology that deters side channel attacks on semiconductor chips and contributes a superior layer of security compared to existing solutions.

Equipment bookings and billings continue along a steady trend

03/20/2014  North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014