Device Architecture

DEVICE ARCHITECTURE ARTICLES



Analog IC market forecast with strongest annual growth through 2022

01/12/2018  Power management, signal conversion, and automotive-specific analog markets drive expansion.

Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position

01/11/2018  Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to preliminary results by Gartner, Inc. Undersupply helped drive 64 percent revenue growth in the memory market, which accounted for 31 percent of total semiconductor revenue in 2017.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Process Watch: The (automotive) problem with semiconductors

01/11/2018  This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the challenges involved in the automotive supply chain. Future articles in the series will address specific process control solutions to those challenges.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

ON Semiconductor and ConvenientPower Systems announce strategic collaboration in automotive wireless charging

01/09/2018  ON Semiconductor has announced a strategic collaboration with ConvenientPower Systems (CPS) whereby CPS will design, develop and market in-vehicle wireless charging solutions using ON Semiconductor’s NCV6500 application dedicated, power management controller.

Arrow completes acquisition of eInfochips

01/09/2018  Arrow Electronics, Inc. announced today the successful completion of its acquisition of eInfochips, one of the world’s largest design and managed services companies.

STMicroelectronics selects GLOBALFOUNDRIES 22FDX to extend its FD-SOI platform

01/09/2018  GLOBALFOUNDRIES and STMicroelectronics today announced that ST has selected GF's 22nm FD-SOI (22FDX) technology platform to support its next-generation of processor solutions for industrial and consumer applications.

Semtech enables IoT of the future with next generation LoRa platform

01/08/2018  Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its next generation LoRa devices and wireless radio frequency (RF) technology (LoRa Technology) chipsets enabling innovative LPWAN use cases for consumers with its advanced technology.

Micron and Intel announce update to NAND memory joint development program

01/08/2018  Micron and Intel today announced an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.

Room-temperature multiferroic thin films and their properties

01/08/2018  Scientists at Tokyo Institute of Technology (Tokyo Tech) and Tohoku University have developed high-quality GFO epitaxial films and systematically investigated their ferroelectric and ferromagnetic properties. They also demonstrated the room-temperature magnetocapacitance effects of these GFO thin films.

NRL improves optical efficiency in nanophotonic devices

01/05/2018  A team of physicists, headed by the U.S. Naval Research Laboratory (NRL), have demonstrated the means to improve the optical loss characteristics and transmission efficiency of hexagonal boron nitride devices, enabling very small lasers and nanoscale optics.

Xilinx appoints Victor Peng as president and CEO

01/05/2018  Xilinx, Inc. today announced that its board of directors has appointed Victor Peng as president and chief executive officer, effective January 29, 2018.

APAC tops the global RF power semiconductor devices market

01/05/2018  The latest market research report by Technavio on the global radio-frequency (RF) power semiconductor devices market predicts a CAGR of close to 12% during the period 2017-2021.

Nine SEMI Standards committee members recognized at SEMICON Japan for outstanding contributions

01/05/2018  At the SEMI Standards Friendship Party during SEMICON Japan, JRSC recognized the following nine committee members for outstanding contributions to the development of SEMI Standards.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

Touchy nanotubes work better when clean

01/04/2018  Rice, Swansea scientists show that decontaminating nanotubes can simplify nanoscale devices.

Surprising changes in semiconductor equipment market share in 2017

01/04/2018  Through three quarters of calendar year 2017, market shares of top semiconductor equipment manufacturers indicate large gains by Tokyo Electron and Lam Research.

Viewing atomic structures of dopant atoms in 3-D relating to electrical activity in a semiconductor

01/02/2018  Scientists at Tokyo Institute of Technology (Tokyo Tech) and their research team involving researchers of JASRI, Osaka University, Nagoya Institute of Technology, and Nara Institute of Science and Technology have just developed a novel approach to determine and visualize the three-dimensional (3D) structure of individual dopant atoms using SPring-8.

eVaderis completes tape-out of MRAM-based, memory-centric MCU demonstrator for next-gen IoT applications

01/02/2018  eVaderis, a semiconductor IP start-up that provides design solutions to improve the functionality, power efficiency and performance of its customers' semiconductor chips, has successfully demonstrated a fully functioning design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor's BA2X product line.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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