Device Architecture

DEVICE ARCHITECTURE ARTICLES



Biodegradable, flexible silicon transistors

06/30/2015  Wisconsin researchers have developed a new biodegradable silicon transistor based on a material derived from wood, opening the door for green, flexible, low-cost portable electronics in future.

Making new materials with micro-explosions

06/29/2015  Scientists have made exotic new materials by creating laser-induced micro-explosions in silicon, the common computer chip material.

What chipmakers will need to address growing complexity, cost of IC design and yield ramps

06/29/2015  As these early days of the Internet of Things show the network’s promise and reveal technological challenges that could threaten its ability to meet user expectations in the years ahead, technology providers will be charged with supplying the solutions that will meet those challenges.

Power transistors seen stabilizing and setting record sales in 2015

06/25/2015  After six years of gyrating between strong increases and sales declines, the power transistor business is returning to more normal growth patterns.

SMIC receives "2014 Foundry Supplier of the Year" award from Qualcomm

06/25/2015  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology

06/24/2015  Freescale Semiconductor has disclosed initial details regarding the next generation of its successful QorIQ multicore processor portfolio, today announcing it will drive innovation for the secure Internet of Tomorrow (IoT) on highly advanced 16nm FinFET process technology.

SMIC, Huawei, imec, and Qualcomm in joint investment on SMIC's new R&D company

06/23/2015  The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform.

Exagan raises €5.7M to produce high-efficiency GaN-on-Silicon power-switching devices on 200mm wafers

06/23/2015  Exagan, a start-up innovator of gallium-nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers.

Cadence and Applied Materials collaborate on CMP process optimization

06/22/2015  Cadence Design Systems, Inc. and Applied Materials, Inc. today announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below.

UMC collaborates with ARM to validate UMC 14nm finFET process

06/22/2015  United Microelectronics Corporation, a global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node.

IC manufacturers close or repurpose 83 wafer fabs from 2009-2014

06/17/2015  150mm and 200mm wafer fabs account for two-thirds of total closures.

Leti workshop covers major trends in FD-SOI technologies

06/16/2015  CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.

SK Hynix ramps production of high bandwidth memory

06/16/2015  SK Hynix Inc. announced today that it is shipping mass production volumes of 1st generation High Bandwidth Memory (HBM1) based on SK hynix’s advanced 20nm-class DRAM process technology.

Renesas Electronics announces Synergy Platform for IoT

06/15/2015  Renesas Electronics, a supplier of advanced semiconductor solutions, today announced the Renesas Synergy Platform.

DCG Systems acquires MultiProbe

06/15/2015  DCG Systems announced today that it has acquired the assets of MultiProbe, a provider of atomic force-based nanoprobing solutions for the semiconductor industry.

Startups find strategic investors at SEMICON West 2015

06/15/2015  SEMI today announced that SEMICON West 2015 will feature the Silicon Innovation Forum (SIF), a unique forum for strategic investors and key decision makers to meet new and emerging early-stage companies developing the future of microelectronics.

A KAIST research team develops the first flexible phase-change random access memory

06/15/2015  Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

More change for the chip industry

06/11/2015  As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

06/11/2015  Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

06/10/2015  CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.




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FINANCIALS



TECHNOLOGY PAPERS



Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

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WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015