Device Architecture

DEVICE ARCHITECTURE ARTICLES



Imec honors Dr. Gordon Moore with "Lifetime of Innovation Award"

05/03/2016  Nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law theory and co-founder of Intel, is the recipient of its lifetime of innovation award.

Cypress CEO to step down

04/28/2016  Cypress Semiconductor Corp. (NASDAQ: CY) today announced that its CEO, T.J. Rodgers, will step down this week and that a search—both internal and external—would be launched to replace him.

Hybrid nanoantennas -- next-generation platform for ultradense data recording

04/28/2016  A group of scientists from ITMO University in Saint Petersburg has put forward a new approach to effective manipulation of light at the nanoscale based on hybrid metal-dielectric nanoantennas.

Cypress to acquire Broadcom's Wireless of Internet of Things business

04/28/2016  Cypress Semiconductor Corp. (Nasdaq: CY) and Broadcom Limited (Nasdaq: AVGO) today announced the signing of a definitive agreement under which Cypress will acquire Broadcom's Wireless Internet of Things (IoT) business and related assets in an all-cash transaction valued at $550 million.

Cartamundi, imec and Holst Centre win "Best Product" award at Printed Electronics Europe

04/27/2016  Cartamundi, imec and Holst Centre (set up by imec and TNO) are proud to announce to have just won the "Best Product" - Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi's playing cards.

NREL finds nanotube semiconductors well-suited for PV systems

04/27/2016  Researchers at the Energy Department's National Renewable Energy Laboratory (NREL) discovered single-walled carbon nanotube semiconductors could be favorable for photovoltaic systems because they can potentially convert sunlight to electricity or fuels without losing much energy.

NREL theory establishes a path to high-performance 2-D semiconductor devices

04/26/2016  Researchers at the Energy Department's National Renewable Energy Laboratory (NREL) have uncovered a way to overcome a principal obstacle in using two-dimensional (2D) semiconductors in electronic and optoelectronic devices.

Apple drove entire foundry sales increase at TSMC in 2015

04/26/2016  Without Apple, TSMC’s 2015 foundry sales would have dropped by 2% as compared to a 6% increase.

Spintronic majority gates: A new paradigm for scaling

04/26/2016  Spintronic majority gates could revolutionize circuit design. They will completely change the paradigm – both at device and circuit level – in how to approach scaling.

Cadence CFO Geoff Ribar to retire in March 2017

04/25/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that, Geoff Ribar, senior vice president and chief financial officer, who joined the company in 2010, has decided to retire from Cadence effective March 31, 2017.

North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15

04/22/2016  Order activity remains steady and is on par with both the previous quarter and one year ago.

Park Systems' global expansion in AFM market includes appointment of new executives

04/20/2016  Park Systems announced today the appointments of Charlie Park as Senior Vice President of Global Sales, and Jong-Pil Park as Vice President of Production.

ams breaks ground on NY wafer fab

04/20/2016  ams AG (SIX: AMS) today took a step forward in its long-term strategy of increasing manufacturing capacity for its high-performance sensors and sensor solution integrated circuits (ICs), holding a groundbreaking event at the site of its new wafer fabrication plant in Utica, New York.

Energy harvesting to drive semiconductor sales to $3B by 2020

04/20/2016  The new Semico Research report "Energy Harvesting: The Next Billion Dollar Market for Semiconductors" projects semiconductor sales for this market will reach $3 billion by 2020.

Semiconductor experts chart chip industry's future direction beyond the "Moore's Law" horizon

04/20/2016  Program unveiled for 2016 Symposia on VLSI Technology & Circuits – includes short courses, focus sessions, and panel discussions on "Inflections for a Smart Society" theme.

ESD Alliance, Semico Research sign joint marketing agreement

04/19/2016  The Electronic System Design Alliance (formerly the EDA Consortium) and Semico Research today announced that they have entered into a joint marketing agreement to work together on several business initiatives.

Number of 300mm IC wafer fabs expected to reach 100 in 2016 

04/15/2016  High volume 450mm IC wafer fabs not expected until after 2020.

Leti extends collaboration with Qualcomm on CoolCube 3D integration technology

04/12/2016  Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube.

Sensors driving next-generation wearable devices

04/12/2016  Last week, IDTechEx gave the opening presentation at the 2016 Korea Summit for Smart Wearable Devices, excellently hosted by KDIA and KSA in Seoul, Korea.

SEMI reports 2015 global semiconductor materials sales of $43.4B

04/11/2016  The global semiconductor materials market decreased 1.5 percent in 2015 compared to 2014 while worldwide semiconductor revenues decreased 0.2 percent.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
MEMS: Current Status and Future Directions

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

In 2015, the MEMS market did not grow as much as we initially expected. In the past, the Smart Phone industry was a strong driver of the MEMS industry with ever increasing volume. Today, MEMS are becoming commodity products with very low price. The webcast will review the latest market data and forecasts for the future. The MEMS “commoditization” paradox will be discussed as well as latest technical trends (sensors combos, packaging).

Sponsored By:
Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS