Device Architecture

DEVICE ARCHITECTURE ARTICLES



Growing momentum in semiconductor manufacturing in Vietnam

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Intermolecular appoints Dr. Bruce McWilliams as President and CEO

10/16/2014  Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

10/16/2014  The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

The mystery of reed relays: Understanding specifications

10/15/2014  Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

IRLYNX and CEA-Leti to streamline new CMOS-based infrared sensing modules

10/15/2014  IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

Threshold voltage tuning for 10nm and beyond CMOS integration

10/13/2014  A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

A novel platform for future spintronic technologies

10/13/2014  Scientists at EPFL, working with Université Paris-Sud and Paul Scherrer Institut, have discovered that a common insulating material behaves as a perfect spintronic conductor because it is not affected by background electron charge.

China's wafer foundry market: 15% growth in 2014

10/09/2014  The wafer foundry market experienced a wavy development, jumping by 39.4 percent in 2010 following a 7.9 percent decline in 2009.

Altera CEO John Daane to receive Robert N. Noyce Award

10/08/2014  The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014

10/08/2014  Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

Samsung to invest $14.7B in new semiconductor fab

10/07/2014  Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea.

SEMI announces rising annual silicon wafer shipment forecast

10/07/2014  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

Europe: Strong growth in chip equipment spending in 2015

10/06/2014  Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

Crumpled graphene could provide an unconventional energy storage

10/03/2014  Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

10/02/2014  ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

Dow Corning releases new 150mm SiC wafers

10/02/2014  Dow Corning, a developer of silicon and wide-bandgap semiconductor technology, announced that it now offers 150mm diameter silicon carbide (SiC) wafers under its Prime Grade portfolio.

Boston Semi Equipment creates industry's largest independent ATE organization

10/01/2014  Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

All directions are not created equal for nanoscale heat sources

10/01/2014  Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

A new dimension for integrated circuits: 3D nanomagnetic logic

09/30/2014  Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

09/26/2014  Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS



Advanced Packaging

Thursday, October 16, 2014 at 1 p.m. EST

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

Oct. 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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