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DEVICE ARCHITECTURE ARTICLES



A partnership to secure and protect the emerging Internet of Things

08/28/2015  The National Science Foundation (NSF), in partnership with Intel Corporation, one of the world's leading technology companies, today announced two new grants totaling $6 million to research teams that will study solutions to address the security and privacy of cyber-physical systems.

Pure-play foundry sales forecast to surpass $12B in fourth quarter 2015

08/28/2015  Atypical 2015 sales pattern, but stronger growth forecast to resume in second half of this year.

ROHM adopts latest model of Lasertec's SiC wafer inspection and review system

08/27/2015  Lasertec Corporation announced today that ROHM Co., Ltd. selected the latest model of Lasertec’s SICA, SiC wafer inspection and review system.

New AMS fab going to Marcy, NY

08/27/2015  Austria-based ams AG, formerly known as Austriamicrosystem, announced plans to locate a new 360,000 ft2 fab in upstate New York at the Nano Utica site in Marcy, NY.

Successful boron-doping of graphene nanoribbon

08/27/2015  Physicists at the University of Basel succeed in synthesizing boron-doped graphene nanoribbons and characterizing their structural, electronic and chemical properties.

GaN nanoelectronics-transistor blocking voltage exceeds 1kV

08/24/2015  Research reported in Applied Physics Express (APEX) by Tohru Oka and colleagues at the Research and Development Headquarters for TOYODA GOSEI Co., Ltd in Japan describe the development of ‘vertically orientated’ GaN-based transistors with blocking voltages exceeding 1kV.

Opportunities in South America for semiconductor manufacturing

08/24/2015  SEMI today announced the second annual SEMI South America Semiconductor Strategy Summit (SA SSS) at the Sheraton Rio on November 10-12 in Rio De Janeiro, Brazil.

Cypress introduces the world's lowest-power energy harvesting power management ICs

08/21/2015  Cypress Semiconductor Corp. today announced a new family of Energy Harvesting Power Management Integrated Circuits (PMICs) that enable tiny, solar-powered wireless sensors for Internet of Things (IoT) applications.

Small electronics companies spent $78.3B on semiconductors in 2014

08/21/2015  Startups and small electronics companies spent $78.3 billion on semiconductors in 2014, representing 23 percent of the total market, compelling semiconductor companies to revisit their sales strategy to focus on the large number of smaller organizations than relying on big deals from large customers, research firm Gartner said.

Book-to-bill ratio reports indicate a solid year for the industry

08/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

Peregrine Semiconductor announces next chapter in intelligent integration

08/20/2015  Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the next chapter in intelligent integration -- integrated phase and amplitude control at microwave frequencies.

MagnaChip appoints Gary Tanner to Board of Directors

08/20/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced the appointment of Gary Tanner to its Board of Directors.

ON Semiconductor names former Texas Instruments VP to Board of Directors

08/19/2015  ON Semiconductor Corporation this week announced that Gilles Delfassy has joined its Board of Directors.

Microcontroller unit shipments surge but falling prices sap sales growth

08/19/2015  Explosion of smartcards, embedded sensors, and new Internet of Things applications are driving up unit volumes of low-cost 32-bit MCU solutions, says Mid-Year Update.

Update for exporters: Trade wins and delays

08/18/2015  With trade policy dominating headlines in recent weeks, all eyes were on Maui in the waning days of August as trade ministers from twelve nations convened for perhaps the final time to finalize the Trans-Pacific Partnership (TPP).

Leon Panetta to deliver keynote address at annual SIA Award Dinner

08/18/2015  The Semiconductor Industry Association (SIA) announced former Defense Secretary Leon Panetta will deliver the keynote address at the upcoming SIA Award Dinner, taking place on Thursday, Dec. 3 in San Jose, Calif.

As utilities get smarter, smart meter semiconductors rise

08/18/2015  The global market for semiconductors used in smart meters that provide two-way communications between meters and utilities will continue to expand in the coming years, providing significant growth opportunities semiconductor manufacturers.

Comparison 1Y nanometer NAND architecture and beyond

08/17/2015  Do we still think the 2D NAND Flash technologies have hit the scaling wall?

Surprising discoveries about 2-D molybdenum disulfide

08/17/2015  Scientists with the U.S. Department of Energy (DOE)'s Lawrence Berkeley National Laboratory (Berkeley Lab) have used a unique nano-optical probe to study the effects of illumination on two-dimensional semiconductors at the molecular level.

ISSI provides update on closing of acquisition by Uphill

08/14/2015  Integrated Silicon Solution, Inc., a global fabless semiconductor company, today provided an update on the closing of its pending acquisition by Uphill Investment Co. for $23.00 per share in cash.




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TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

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More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
http://www.semiconjapan.org/en/
December 16, 2015 - December 18, 2015