Device Architecture

DEVICE ARCHITECTURE ARTICLES



2014 was bumper year for automotive semiconductors

01/27/2015  The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New pathway to valleytronics

01/27/2015  A potential avenue to quantum computing currently generating quite the buzz in the high-tech industry is "valleytronics," in which information is coded based on the wavelike motion of electrons moving through certain two-dimensional (2D) semiconductors.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

01/26/2015  Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

Rambus appoints Tom Fisher to its Board of Directors

01/23/2015  Rambus Inc. today announced the appointment of Mr. Ellis Thomas Fisher as a director to its Board, effective immediately.

EMCORE Corporation announces the appointment of Dr. Hank Blauvelt as Chief Technology Officer

01/23/2015  EMCORE Corporation, a provider of compound semiconductor-based components, subsystems and systems for the broadband and specialty fiber optics market, announced today the appointment of Dr. Hank Blauvelt to Chief Technology Officer for EMCORE Corporation, reporting to Chief Executive Officer, Jeffrey Rittichier.

Self-assembled nanotextures create antireflective surface on silicon solar cells

01/23/2015  Scientists at the U.S. Department of Energy's Brookhaven National Laboratory show that etching a nanoscale texture onto the silicon material itself creates an antireflective surface that works as well as state-of-the-art thin-film multilayer coatings.

Graphene enables all-electrical control of energy flow from light emitters

01/23/2015  Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have now demonstrated active, in-situ electrical control of the energy flow from erbium ions into photons and plasmons.

Silver nanowires demonstrate unexpected self-healing mechanism

01/23/2015  With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Underdog DRAM

01/20/2015  DRAM shifts out of a slump, but sector still faces obstacles.

Carbon nanotube finding could lead to flexible electronics with longer battery life

01/16/2015  University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

Rice-sized laser, powered one electron at a time, bodes well for quantum computing

01/16/2015  Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

Samsung Electronics starts mass producing industry’s first 8-gigabit graphics DRAM

01/15/2015  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

UC Berkeley Extension launches three online programs in semiconductor technology

01/15/2015  UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

JEOL and UC Irvine partner to develop electron microscopy and materials research center

01/14/2015  JEOL USA and the University of California's Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

Zinc oxide materials tapped for tiny energy harvesting devices

01/13/2015  New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

Graphene plasmons go ballistic

01/12/2015  Graphene combined with the insulting power of boron nitride enables light control in tiny circuits with dramatically reduced energy loss.

DRAM capacity rises from slump; Sector faces new challenges

01/12/2015  SEMI today announced details from the SEMI World Fab Forecast Report illuminating the state of the semiconductor manufacturing industry, coincident with convening SEMI’s Industry Strategy Symposium (ISS) in Half Moon Bay, Calif.

ON Semiconductor demonstrates high efficiency 3D sensor stacking technology

01/06/2015  ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs.

Freshmen-level chemistry solves the solubility mystery of graphene oxide films

01/06/2015  A Northwestern University-led team recently found the answer to a mysterious question that has puzzled the materials science community for years--and it came in the form of some surprisingly basic chemistry.




HEADLINES

Assessment of Waveform Similarity in Clinical Gait Data: The Linear Fit Method
January 28, 2015

Qorvo Joins Lexicon After Big Chip Merger; RF Micro-TriQuint firm aims to boost innovation in connectivity sectors
January 28, 2015

Yahoo Spinoff Of Alibaba Stake Cheers Investors As Q4 Lags; Sales Still Falling; EPS Sinks Holdings in China e-com leader represents great majority of portal's value
January 28, 2015

Tessera enters into settlement agreement with Amkor
January 27, 2015

UPDATE - INVESTOR ALERT: Levi & Korsinsky, LLP Commences an Investigation of the Board of Directors of Silicon Image Inc. in Connection With the Fairness of the Sale of the Company to Lattice Semiconductor Corporation
January 27, 2015

Renesas Electronics Unveils New Solution to Increase Productivity and Security for Industrial Internet of Things Applications; New RX700 Microcontroller Series Expands 32-Bit RX Family to Offer High 240 MHz Operation, Security Features and 4 MB of Large Memory Capacity
January 27, 2015

SILICON IMAGE, INC. SHAREHOLDER ALERT: Former SEC Attorney Willie Briscoe and Powers Taylor LLP Investigate Sale to Lattice Semiconductor Corporation
January 27, 2015

Next generation computers could have paper screens
January 27, 2015

Lattice Semiconductor to Acquire Silicon Image for Approximately $600 Million
January 27, 2015

eXelate Announces Customer Data Cloud(TM): a Breakthrough in Cross-Platform Marketing; Marketers Can Now Leverage Data Across All Screens and Devices, Including Mobile, Audio and Smart TV
January 27, 2015

FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015