Device Architecture

DEVICE ARCHITECTURE ARTICLES



Model for multivalley polaritons

04/25/2017  IBS scientists model the formation of multivalleys in semiconductor microcavities, bringing new ideas to the emerging valleytronics field

Process Watch: Having confidence in your confidence level

04/20/2017  This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

Global semiconductor wafer-level equipment revenue to grow 11% in 2016

04/20/2017  Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3 percent increase from 2015, according to final results by Gartner, Inc.

Gartner reports worldwide PC shipments declined 2.4% in first quarter of 2017

04/19/2017  Worldwide PC shipments totaled 62.2 million units in the first quarter of 2017, a 2.4 percent decline from the first quarter of 2016, according to preliminary results by Gartner, Inc.

Samsung completes qualification of its 2nd gen 10nm process technology

04/19/2017  Samsung expands 10nm capacity, to be ready for production by the fourth quarter of this year.

Graphene 'copy machine' may produce cheap semiconductor wafers

04/19/2017  Engineers use graphene as a 'copy machine' to produce cheaper semiconductor wafers.

Columbia engineers invent method to control light propagation in waveguides

04/17/2017  New technique using nano-antennas to make photonic integrated devices smaller with a broader working wavelength range could transform optical communications.

SEMICON Southeast Asia 2017: Disruption and the value of digital transformation in manufacturing

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

GaN Systems' investors receive Venture Capital Awards

04/17/2017  Investor of the Year, Chrysalix Venture Capital selected over 11,000 nominees Cycle Capital Management named Canada's 2nd most active VC in 2016.

Gartner: Worldwide semiconductor revenue forecast to increase 12.3% in 2017

04/14/2017  Worldwide semiconductor revenue is forecast to total $386 billion in 2017, an increase of 12.3 percent from 2016, according to Gartner, Inc.

New switching process in non-volatile spintronics devices

04/14/2017  Physicists achieved a robust and reliable magnetization switching process by domain wall displacement without any applied fields. The effect is observed in tiny asymmetric permalloy rings and may pave the way to extremely efficient new memory devices.

DDR4 set to account for largest share of DRAM market by architecture

04/14/2017  DDR4 and DDR3 forecast to represent 97% of sizzling 2017 DRAM market.

PolyU develops novel semiconductor nanofiber with superb charge conductivity

04/13/2017  The Department of Mechanical Engineering of The Hong Kong Polytechnic University (PolyU) has developed a novel technology of embedding highly conductive nanostructure into semiconductor nanofiber.

Method improves semiconductor fiber optics, paves way for developing devices

04/13/2017  A new method to improve semiconductor fiber optics may lead to a material structure that might one day revolutionize the global transmission of data, according to an interdisciplinary team of researchers.

Art of paper-cutting inspires self-charging paper device

04/12/2017  Despite the many advances in portable electronic devices, one thing remains constant: the need to plug them into a wall socket to recharge. Now researchers, reporting in the journal ACS Nano, have developed a light-weight, paper-based device inspired by the Chinese and Japanese arts of paper-cutting that can harvest and store energy from body movements.

Silicon-on-insulator market worth 1,859.3M USD by 2022

04/12/2017  The factors that are driving the growth of this market include the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices.

Microprocessors based on a layer of just 3 atoms

04/12/2017  Microprocessors based on atomically thin materials hold the promise of the evolution of traditional processors as well as new applications in the field of flexible electronics.

Si2 contributes advanced IC power modeling technology to IEEE

04/11/2017  Silicon Integration Initiative, Inc. (Si2), a integrated circuit research and development joint venture, has contributed new power modeling technology to the IEEE P2416 System Level Power Model Working Group.

ON Semiconductor extends leading image sensor portfolio for sub-lux imaging applications

04/10/2017  New IT-EMCCD image sensors combine improved low-light and NIR sensitivity with simplified integration for camera manufacturers.

MagnaChip to host its annual Foundry Technology Symposium in Santa Clara, California

04/10/2017  MagnaChip Semiconductor Corporation announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.




TWITTER


WEBCASTS



Metrology Challenges and Opportunities

Wednesday, April 26, 2017 at 2 p.m. ET

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:
Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS