Device Architecture

DEVICE ARCHITECTURE ARTICLES



Top 10 semiconductor R&D spenders increase outlays 6% in 2017

02/20/2018  Intel far surpasses others with R&D spending of $13.1 billion in 2017 and accounts for 36% of expenditures among Top R&D spenders.

3D depth sensing & VCSEL technology surges: Key takeaways from SEMI Member Forum

02/16/2018  Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

Better together: Silicon qubits plus light add up to new quantum computing capability

02/15/2018  A silicon-based quantum computing device could be closer than ever due to a new experimental device that demonstrates the potential to use light as a messenger to connect quantum bits of information -- known as qubits -- that are not immediately adjacent to each other. The feat is a step toward making quantum computing devices from silicon, the same material used in today's smartphones and computers.

Technavio releases report on key findings of the global semiconductor IP market 

02/15/2018  The latest market research report by Technavio on the global semiconductor IP market predicts a CAGR of close to 10% during the period 2018-2022.

SiFive appoints CFO to Executive Team

02/15/2018  SiFive, the provider of commercial RISC-V processor IP, continues to grow its executive staff with the appointment of Shiva Natarajan as chief financial officer.

SEMI China President Lung Chu leads mayor roundtable discussion at International IoT Summit in Silicon Valley

02/14/2018  Yawning differences between cultures, economic systems and rules of law stand as barriers for many China- and US-based technology companies to do business on each other’s soil, making it imperative for both countries to work together to bridge the gaps that make it harder for tech businesses in each country to find partners and open markets in the other, SEMI China president Lung Chu said at a recent conference.

MagnaChip offers 2nd-generation 0.13 micron BCD process technology with high-density embedded flash memory

02/12/2018  MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

Today's highest quality composite-piezoelectric developed at NUST MISIS

02/12/2018  NUST MISIS scientists jointly with an international group of scientists have managed to develop a composite material that has the best piezoelectric properties today. The research results were published in Scientific Reports journal.

Applied Materials named one of the World's Most Ethical Companies for 2018

02/12/2018  Applied Materials, Inc. announced today that it has been recognized by the Ethisphere Institute, a global leader in defining and advancing the standards of ethical business practices, on its 2018 list as one of the World's Most Ethical Companies.

Amkor Technology names Doug Alexander and MaryFrances McCourt to Board of Directors

02/09/2018  Amkor Technology, Inc. today announced that Doug Alexander and MaryFrances McCourt have been appointed as new members of the Company's Board of Directors. With these appointments, Amkor's Board has been expanded to twelve members.

First Trump State of the Union address: How it stacks up against SEMI public policy priorities

02/07/2018  SEMI evaluates the implications of the SOTU address for Trade, Taxes, Technology, Talent and other SEMI public policy priorities.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

The dawn of gallium oxide microelectronics

02/06/2018  Gallium oxide has an advantage over silicon in producing cheaper and smaller devices.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

Vanadium dioxyde: A revolutionary material for tomorrow's electronics

02/05/2018  Phase-chance switch can now be performed at higher temperatures.

Measuring the temperature of two-dimensional materials at the atomic level

02/05/2018  Researchers at the University of Illinois at Chicago describe a new technique for precisely measuring the temperature and behavior of new two-dimensional materials that will allow engineers to design smaller and faster microprocessors.

Air Products to supply Samsung Electronics' second 3D V-NAND fab in western China

02/02/2018  Air Products today announced it has been awarded the industrial gases supply for Samsung Electronics' second semiconductor fab in Xi'an, Shaanxi Province, western China.

New UC Riverside research advances spintronics technology

02/01/2018  Discoveries will help realize the promise of faster, energy-efficient spintronic computers and ultra-high-capacity data storage.

Mobile system-on-chip designs, embedded processing lift MPU market

02/01/2018  Though accounting for less than half of total MPU sales, data-handling cellphones, tablets, and MPUs for embedded processing applications to keep MPU market active through 2022.

Smart manufacturing fuels digital transformation: Takeaways from SEMI Member Forum

02/01/2018  Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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