Device Architecture

DEVICE ARCHITECTURE ARTICLES



Worldwide semiconductor revenue grew 21.6% in 2017 as Samsung takes over No. 1 position

04/24/2018  Booming memory market overshadows high growth in other segments.

Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in Innovation 2018

04/24/2018  The award recognizes SPTS's development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices.

Semiconductor Industry Association recognizes Senator Mike Crapo, Congressman Peter Roskam with Congressional Leadership Awards

04/20/2018  The Semiconductor Industry Association (SIA) this week presented its Congressional Leadership Awards to Senator Mike Crapo (R-Idaho) and Congressman Peter Roskam (R-Ill.) for their leadership in enacting tax reform legislation, the Tax Cuts and Jobs Act of 2017.

Mobile Semiconductor's 22nm ULL memory compiler joins the GlobalFoundries FDXcelerator Partner Program

04/20/2018  This new embedded SRAM technology on 22nm FDX offers the best in class memory solution using the GLOBALFOUNDRIES low leakage FDSOI bit cells and ultra-low leakage devices.

Robot developed for automated assembly of designer nanomaterials

04/20/2018  A current area of intense interest in nanotechnology is van der Waals heterostructures, which are assemblies of atomically thin two-dimensional (2D) crystalline materials that display attractive conduction properties for use in advanced electronic devices.

Nexperia secures $800M financing to fund future growth plans

04/19/2018  Discrete semiconductor company’s refinancing supported by major global banks.

Getting better by design

04/18/2018  With the IC industry now worth over $400 billion in annual revenue, developing a single new chip can cost hundreds of millions of dollars.

Toyoda Gosei achieves state-of-the-art high current operation with vertical GaN power semiconductor

04/16/2018  Toyoda Gosei Co., Ltd. has achieved state-of-the-art high current operation in a vertical GaN power semiconductor developed using gallium nitride (GaN), a main material in blue LEDs.

SEMI announces ESD Alliance to join as Strategic Association Partner

04/16/2018  SEMI today announced that it has signed a memorandum of understanding to integrate the ESD (Electronic System Design) Alliance as a SEMI Strategic Association Partner this year.

Psst! A whispering gallery for light boosts solar cells

04/13/2018  Trapping light with an optical version of a whispering gallery, researchers at the National Institute of Standards and Technology (NIST) have developed a nanoscale coating for solar cells that enables them to absorb about 20 percent more sunlight than uncoated devices.

SEMI postpones SEMICON Southeast Asia 2018 to avoid Malaysian election conflict

04/13/2018  SEMI today announced postponement of SEMICON Southeast Asia from 8-10 May 2018 to 22-24 May 2018.

Worldwide PC shipments declined 1.4% in first quarter of 2018

04/12/2018  Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc.

Toshiba releases automotive 40V N-channel power MOSFETs in new package

04/11/2018  Reduced on-resistance from use of a small low-resistance package.

Veeco wins compound semiconductor industry innovation award

04/11/2018  Flexible GENxcel™ MBE Deposition System earns Veeco its fourth Innovation Award in seven years.

Semiconductor leaders' marketshares surge over the past 10 years

04/11/2018  Top 25 companies held more than three-fourths of worldwide semiconductor market.

ON Semiconductor introduces digital image sensor with low light sensitivity and signal-noise ratio

04/10/2018  ON Semiconductor introduced the industry’s first 1/1.7-inch 2.1 megapixel CMOS image sensor featuring ON Semiconductor’s newly developed 4.2μm Back Side Illuminated (BSI) pixels.

Diamond-based circuits can take the heat for advanced applications

04/10/2018  Researchers at Japan's National Institute for Materials Science developed a hydrogenated diamond circuit operational at 300 degrees Celsius.

The 2018 Symposia on VLSI Technology & Circuits covers converging trends in machine learning, artificial intelligence & the IoT

04/09/2018  The 2018 Symposia on VLSI Technology & Circuits will deliver a unique perspective into the technological ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing – the emerging technologies needed for 'smart living.'

POET Technologies and SilTerra announce partnership to develop and manufacture POET's Optical Interposer Platform

04/09/2018  The partnership is expected to accelerate the path to commercial production of the Optical Interposer, which will enable optical engines for single-mode transceiver modules and other high bandwidth devices

GaN power device industry: the supply chain is acting to support market growth

04/06/2018  The GaN power business was worth about US$12 million in 2016, but at Yole, analysts project that the market will reach US$460 million by 2022, with an impressive 79% CAGR.




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WEBCASTS



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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