Device Architecture

DEVICE ARCHITECTURE ARTICLES



Presto Engineering signs agreement with NAGRA for secure product production

06/27/2016  Presto will provide supply chain management and production services for several of NAGRA’s key products in the Pay TV market.

SMIC acquires LFoundry

06/27/2016  Semiconductor Manufacturing International Corporation jointly announces with LFoundry Europe GmbH and Marsica Innovation S.p.A., the signing of an agreement on June 24, 2016 to purchase a 70% stake of LFoundry for a consideration of 49 million EUR.

Qualcomm files complaint against Meizu in China

06/24/2016  Qualcomm Incorporated announced that it has filed a complaint against Meizu in the Beijing Intellectual Property Court.

Photovoltaic cells replicate rose petals

06/24/2016  With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.

Process Watch: Process control and production cycle time

06/24/2016  In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).

Increased use of semiconductors in auto industry to boost global semiconductor capital equipment until 2020

06/23/2016  According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.

SMIC begins mass production of Qualcomm Snapdragon 425 processor in Beijing

06/23/2016  The successful production of 28nm Snapdragon products in Beijing represents an important step for SMIC's 28nm technology.

MagnaChip selects Mentor Graphics Analog FastSPICE platform

06/23/2016  The AFS Platform provides the world's fastest circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits.

POET Technologies announces closing of acquisition of BB Photonics

06/23/2016  POET completes the transaction owning 100% of BB Photonics and its assets, including intellectual property and technologies.

Power transistors to see less volatility in second half of this decade

06/22/2016  Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

Automotive semiconductor market grows slightly in 2015 while ranks shift

06/22/2016  Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.

Ultratech receives follow-on order from major Asian foundry for laser spike annealing system

06/21/2016  The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

Dialog Semiconductor announces director appointment

06/17/2016  Dialog Semiconductor plc, a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth low energy technology, today announced the appointment of Nick Jeffery to the company's Board of Directors.

Circuit technology that resolves issues with high-frequency piezoelectric resonators

06/17/2016  Realizing compact, low-cost, high-speed radio communication systems for the IoT age.

Leti extends CMOS platforms' lifespan and explores new computing paradigms

06/17/2016  Leti, an institute of CEA Tech, said today its teams have demonstrated how Fully Depleted Silicon on Insulator (FDSOI) technology can be scaled downwards and how the experience in thin-film engineering built on FDSOI development can be harnessed for innovative architectures and computing paradigms.

Imec demonstrates gate-all-around MOSFETs with lateral silicon nanowires at scaled dimensions

06/16/2016  Today, at the 2016 Symposia on VLSI Technology & Circuits, nano-electronics research center imec presented gate-all-around (GAA) n- and p-MOSFET devices made of vertically stacked horizontal silicon (Si) nanowires (NWs) with a diameter of only 8nm.

Imec demonstrates junction-less gate-all-around lateral and vertical nanowire FET devices

06/16/2016  The new GAA-NWFET is a promising candidate for advanced logic & analog/RF applications, and scaled SRAM cells.

Gartner says worldwide smartphone sales to slow in 2016

06/14/2016  Gartner, Inc. said global smartphone sales will continue to slow and will no longer grow in double digits.

Changing markets drive smarter manufacturing by IC sector

06/13/2016  The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.

Kicking off #TheConFab2016

06/13/2016  The ConFab 2016 kicked off this morning with speakers from GlobalFoundries, Silicon Catalyst, imec, TechInsights, CEA Leti, and New York Empire State Development.




TWITTER


WEBCASTS



Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS