Device Architecture


Analog Devices acquires Innovasic

10/27/2016  Analog Devices, Inc. today announced the acquisition of Innovasic Inc., a provider of Deterministic Ethernet semiconductor and software solutions.

Cadence CEO to be awarded Dr. Morris Chang Exemplary Leadership Award

10/27/2016  He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.

Qualcomm to acquire NXP

10/27/2016  Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

SMIC standardizes on Synopsys StarRC for signoff parasitic extraction

10/26/2016  Semiconductor Manufacturing International Corporation and Synopsys, Inc. today announced that it has adopted Synopsys' StarRC product as the standard solution for signoff parasitic extraction for its 28nm process technology.

Semiconductor IP market to exceed $8B by 2020, according to Semico Research

10/26/2016  One of the mainstays of the System-on-a-Chip (SoC) market is the continued growth of the 3rd Party Semiconductor Intellectual Property (SIP) market.

Aura Semiconductor raises Series A funding

10/25/2016  Aura Semiconductor, a provider of high performance analog mixed signal solutions, today announced that it has completed Series A round of equity investment from Bay Area based WRV Capital.

Synopsys Custom Compiler certified for Samsung's 10nm process technology

10/25/2016  Synopsys, Inc. today announced that its Custom Compiler tool has been certified by Samsung Electronics Co., Ltd. to support their 10-nanometer (nm) LPP (Low Power Plus) process.

SEMICON Europa opens tomorrow in Grenoble, France

10/24/2016  SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing.

ams schedules 2017 multi-project wafer starts for analog foundry customers

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

Messe München and SEMI Europe announce new alliance

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

Ultralow power transistors could function for years without a battery

10/21/2016  A new design for transistors which operate on 'scavenged' energy from their environment could form the basis for devices which function for months or years without a battery, and could be used for wearable or implantable electronics.

New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

Semiconductor equipment bookings continue to outpace equipment billings in new book-to-bill report

10/21/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Exploring defects in nanoscale devices for possible quantum computing applications

10/20/2016  Researchers at Tokyo Institute of Technology in collaboration with the University of Cambridge have studied the interaction between microwave fields and electronic defect states inside the oxide layer of field-effect transistors at cryogenic temperatures.

2016 IC market forecast raised from -2% to +1%

10/19/2016  Rebound in DRAM market helps raise outlook for total IC market.

SEMI Korea Members Day provides industry insights and networking

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

HSA Foundation announces new developments in heterogeneous systems architecture from Northeastern University

10/18/2016  The HSA Foundation has expanded its Academic Partnership Program with the addition of Northeastern University as the first HSA Academic Center of Excellence.

SMIC TianJin launches capacity expansion project

10/18/2016  After the project's completion, SMIC TianJin is expected to become the world's largest integrated 8-inch IC production line.

Avery Dennison and NXP lead the industry in more sustainable RFID production

10/18/2016  NXP doubles production capacity with new innovation for UHF RFID solutions.

Samsung starts industry's first mass production of System-on-Chip with 10nm finFET technology

10/17/2016  Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.



DSA: Progress Toward Manufacturing Readiness

November 15, 2016 at 1:00 p.m. ET / Sponsored by Brewer Science

Directed self-assembly (DSA) patterning is one of the primary methods being pursued for future advanced patterning nodes. Since DSA’s initial introduction in the early 2000s, great progress has been made. However, many challenges remain for achieving manufacturing readiness. Key improvements in the areas of materials, defectivity, and process integration are still needed. This webcast will cover published progress to date, review key improvements needed, and discuss new advances in DSA technology. Results from CEA-LETI’s 300-mm lab-to-fab for validation of DSA’s manufacturing readiness will be discussed.

Sponsored By:
Enabling The Future Of Information Technology Without Moore’s Law Scaling

November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.

Sponsored By:
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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers


Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017