DEVICE ARCHITECTURE ARTICLES
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HEADLINESInvesco Perp Sel Tst Annual Financial Report -3-
August 01, 2014 Sula Iron & Gold Plc Results from 2nd Drill -2- August 01, 2014 Elbit Systems of America Delivers Systems to Lockheed Martin August 01, 2014 ProPhotonix Rolls Out Cobra Cure for UV Curing, Printing and Machine Vision Markets August 01, 2014 Institute of Electrical and Electronics Engineers to Award Analog Devices' Bob Adams August 01, 2014 Elbit Systems of America Delivers F-16 CDEEU and CPD to Lockheed Martin August 01, 2014 Olympia® Launches Environmentally-Friendly Outdoor Solutions at 2014 Outdoor Retailer Summer Market July 31, 2014 The Zacks Analyst Blog Highlights: ProFunds Semiconductor UltraSector ProFund; Service, T Rowe Price Global Tech Fund, ProFunds Technology UltraSector ProFund; Investor, Fidelity Select Electronics Portfolio and USAA Science and Technology Fund July 31, 2014 Sony, Panasonic to Launch Joint Firm for OEL Panels in Jan. July 31, 2014 Runtastic Expands Ecosystem With Launch Of New Wearable, Runtastic Orbit; Runtastic Enters Wearable Market with Industry-Leading Hardware & Compatible App July 31, 2014 |
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TECHNOLOGY PAPERS Parylene 101: Learn about the best protection for MEMS This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment.
May 22, 2014 Conformal Coatings for Reliable Electronic AssembliesModern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014 The Next Step in Diagnosis Resolution ImprovementLearn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014 |
WEBCASTSAdvances in Wet Processing and Wafer CleaningAugust 14th at 1:00 p.m. ET Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.
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450 UpdateJuly 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.
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MetrologyAugust 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.
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VIDEOS |
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EVENTSSPIE Photomask Technology 2014Monterey Conference Center and Monterey Marriott, http://spie.org/photomask.xml?WT.mc_id=RCal-PMW September 16, 2014 - September 18, 2014 Photomask Technology Exhibition 2014Monterey Conference Center and Monterey Marriott, http://spie.org/photomask.xml?WT.mc_id=RCal-PMW September 16, 2014 - September 17, 2014 2014 International Workshop on EUV and Soft X-ray SourcesDublin, Ireland https://www.euvlitho.com/index.php?_a=viewDoc&docId=40 November 03, 2014 - November 06, 2014 The 40th International Symposium for Testing and Failure AnalysisHouston, TX http://www2.asminternational.org/content/Events/istfa/ November 09, 2014 - November 13, 2014 The 40th International Symposium for Testing and Failure Analysis - ExpositionHouston, TX http://www2.asminternational.org/content/Events/istfa/ November 11, 2014 - January 01, 1970 |
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