Device Architecture

DEVICE ARCHITECTURE ARTICLES



Memory for future wearable electronics

09/02/2016  Stretchable, flexible, reliable memory device inspired by the brain.

Semiconductor industry icons to gather at SIA Award Dinner Nov. 10 in San Jose

09/02/2016  The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.

Enabling industry collaboration to address critical ATE challenges

09/01/2016  For many years, the ATE industry has been challenged with controlling the cost of both production and development test by implementing innovative approaches and employing clever strategies (e.g., multi-site test implementation, DFT, etc.) to make “ends” meet, so to speak.

ASMC 2017 "Call for Papers" deadline is October 17

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

Global GaN semiconductor devices market is expected to be worth $3438.4M by 2024

08/31/2016  The global market for gallium nitride (GaN) semiconductor devices is largely consolidated, with the top four companies commanding a share of over 65% of the overall market in 2015, states Transparency Market Research (TMR) in a new report.

Fujitsu Semiconductor licenses Nantero's NRAM, begins developing memory products

08/31/2016  Agreement covers joint development and licensing of ultrafast, ultrahigh-density NRAM, non-volatile RAM using carbon nanotubes.

Plastic crystals could improve fabrication of memory devices

08/31/2016  A novel 'plastic crystal' developed by Hokkaido University researchers has switching properties suitable for memory-related applications.

FEI celebrates shipment of 1,000th Helios DualBeam System

08/31/2016  FEI today announced a milestone of the 1,000th Helios DualBeam system shipped since the product family was introduced in 2006.

NXP Semiconductors joins Semiconductor Research Corporation

08/31/2016  Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, today announced that NXP Semiconductors has signed an agreement to participate in multiple SRC research initiatives.

Texas Instruments announces strategic relationship with Silicon Catalyst

08/30/2016  Texas Instruments (TI) recently entered into an agreement with Silicon Catalyst, a Silicon Valley-based incubator, that will expand TI's access to new technology innovations and potentially lead to engagements with semiconductor startups focused on creating chips and system solutions in analog and embedded processing.

Industry veteran Lung Chu named president of SEMI China

08/30/2016  SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016.

MCU market forecast to reach record high revenues through 2020

08/30/2016  After recent years of price erosion, MCU ASPs are forecast to rise and help lift sales to new highs.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

Silego announces shipping more than 2 billion configurable mixed-signal ICs

08/29/2016  Silego Technology today announced shipping two billion units since its introduction of the pioneering Configurable Mixed-signal ICs (CMICs). In just two years since Silego Technology announced shipment of its billionth unit, Silego has more than doubled its total volume shipped.

TowerJazz and SMIC’s sales forecast to surge in 2016

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

Hua Hong Semiconductor taps potential of international MCU markets

08/22/2016  Hua Hong Semiconductor Limited, a global pure-play 200mm foundry, today announced that its shipment of microcontroller (MCU) chips in the first half of 2016 grew to 1.2 billion, a year-on-year increase of 50%, breaking the historical record.

China's semiconductor industry worth $157.66B by 2020

08/22/2016  The China semiconductor industry is expected to reach $157.66 billion by 2020, at a CAGR of 12.8% between 2016 and 2020.

New theory could lead to new generation of energy friendly optoelectronics

08/22/2016  Researchers at Queen's University Belfast and ETH Zurich, Switzerland, have created a new theoretical framework which could help physicists and device engineers design better optoelectronics.

Intel to produce 10nm ARM chip designs

08/19/2016  ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

Innodisk unveils its next-generation M2DOM

08/19/2016  Innodisk unveiled its Next Generation innovation in flash storage design technology last week during its VIP product launch at the Hyatt Hotel in Santa Clara, CA.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS