Device Architecture

DEVICE ARCHITECTURE ARTICLES



Reducing conducting thin film surface roughness for electronics

03/07/2017  In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.

Imec’s 200mm GaN-on-Si e-mode power devices withstand heavy ion and neutron irradiation

03/07/2017  Radiation hardness of e-mode devices confirm maturity of imec’s 200mm GaN-on-Si platform.

Record spending for fab equipment expected in 2017 and 2018

03/07/2017  Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

Cypress closes sale of Minnesota wafer fabrication facility

03/06/2017  Cypress Semiconductor Corp. (Nasdaq: CY) today announced it has sold the subsidiary that owns its semiconductor wafer fabrication facility in Bloomington, Minnesota to SkyWater Technology Foundry for $30 million.

January semiconductor sales up 14% compared to last year

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

Imec presents InGaAs TFET with sub-60 mV/decade sub-threshold swing

03/06/2017  Promising alternative for MOSFET in future ultralow power chips.

Semiconductor manufacturing's next big thing at ASMC 2017

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

Eleven companies forecast to account for 78% of semi capex in 2017

03/02/2017  Three of the top 11 companies are expected to increase capex spending by 25% or more.

TSMC joins Semiconductor Research Corporation

02/28/2017  Semiconductor Research Corporation today announced that TSMC has signed an agreement to participate in two SRC research initiatives.

Semitrex changes name to Helix Semiconductors

02/24/2017  Fabless power semiconductor company Semitrex announced today that it has changed its name to Helix Semiconductors.

NXP joins Auto-ISAC to collaborate on security challenges of connected cars

02/24/2017  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, announced that it has joined the Automotive Information Sharing and Analysis Center (Auto-ISAC).

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

Taiwan maintains largest share of global IC wafer fab capacity

02/23/2017  South Korea narrows gap with Taiwan; China shows biggest increase, accounts for nearly 11%.

North American semiconductor equipment industry posts January 2017 billings

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

GlobalFoundries announces availability of 45nm RF SOI

02/21/2017  Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations.

Brooks Instrument names Mohamed Saleem as new Chief Technology Officer

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

'Lossless' metamaterial could boost efficiency of lasers and other light-based devices

02/17/2017  Engineers at the University of California San Diego have developed a material that could reduce signal losses in photonic devices.

Huge growth in cloud memory changes semiconductor supply chain

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.




TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS