Device Architecture

DEVICE ARCHITECTURE ARTICLES



Injecting electrons jolts 2-D structure into new atomic pattern

10/11/2017  Berkeley Lab study is first to show potential of energy-efficient next-gen electronic memory.

Fujitsu Semiconductor and ON Semiconductor announce increased strategic partnership

10/10/2017  ON Semiconductor agrees to purchase 30 percent incremental share of Fujitsu’s 8-inch wafer fab in Aizu-Wakamatsu, Japan, resulting in 40 percent ownership with plans to increase to 60 percent by the second half of 2018 and full ownership in the first half of 2020.

Gartner identifies the top 10 strategic technology trends for 2018

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

NXP awarded Excellence in Quality for 2017 by Cisco

10/06/2017  This prestigious award recognizes NXP for Excellence in Quality for displaying the highest quality standards, practices, and methodologies in their products and processes, and differentiating through their quality management systems and alignment to Cisco’s strategies and values.

Columbia engineers invent breakthrough millimeter-wave circulator IC

10/06/2017  Researchers are first to demonstrate a circulator on a silicon chip at mm-wave frequencies that enables nonreciprocal transmission of waves: device could enable two-way radios and transform 5g networks, self-driving cars, and virtual reality.

Power semiconductor sales rebounded in 2016 and will continue to grow through 2021

10/05/2017  Global power semiconductor revenues grew year-over-year by 3.9 percent in 2016, reversing a 4.8 percent decline in 2015.

Pure-play foundries boosting their presence in China

10/05/2017  With fabless companies in China on the rise, the country is expected to account for 13% share of pure-play foundry sales in 2017.

Industry first precision p-channel zero threshold MOSFET array enables sub-threshold circuits for ultra-low power applications

10/04/2017  The MOSFET currently has the industry’s lowest operating voltage of 0.2 Volt (V) and current of less than one nano amp (nA).

Monthly semiconductor sales reach $35B globally for first time in August

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

Team builds flexible new platform for high-performance electronics

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

A sea of spinning electrons

10/03/2017  Rutgers-led discovery could spawn a wave of new electronic devices.

Comparing XPoint memory architecture with NAND and DRAM products

10/03/2017  There has been a great deal of speculation around the composition of Intel’s Optane XPoint memory technology. TechInsights set about to find answers.

SEMICON Japan 2017 keynotes announced

10/03/2017  Today, SEMI announced the lineup of keynotes coming to SEMICON Japan's "SuperTHEATER" -- focusing on the future of the electronics manufacturing supply chain.

Robotics and chip industries in Japan

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

New 3D packaging & integration committee

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

Pressure between layers of stacked graphene oxide nanosheets increases with heat

10/02/2017  Graphene is a sheet of carbon one atom thick, and it has drawn worldwide attention as a new material. A Japanese research group discovered that pressure is generated by simply stacking graphene oxide nanosheets. They also found that the pressure can be increased by reducing the interlayer distance through heat treatment. It is an innovative approach for applying high pressure without using an enormous amount of energy.

Semiconductor Industry Association announces support of corporate tax reform framework

09/29/2017  The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress.

SK Hynix Inc.'s Board approved a plan to invest in Toshiba Memory Corp

09/28/2017  SK Hynix Inc. announced its board of directors yesterday approved its plan to participate in a Bain Capital-led consortium that plans to purchase Toshiba Corporation's memory chip unit, Toshiba Memory Corporation

Power transistor growth returns after volatile period

09/27/2017  Inventory corrections, economic uncertainty, and price erosion derailed the power transistor market in the last five years, but the 2017 O-S-D Report sees steady modest growth ahead.

SiFive joins TSMC IP Alliance Program

09/26/2017  SiFive today announced it has joined the TSMC IP Alliance Program, part of the TSMC Open Innovation Platform, which accelerates innovation in the semiconductor design community.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS