Device Architecture

DEVICE ARCHITECTURE ARTICLES



Microsemi to offer FPGA-based RISC-V IP core

11/21/2016  Microsemi Corporation (Nasdaq: MSCC) announced it is the first field programmable gate array (FPGA) provider to offer a comprehensive software tool chain and intellectual property (IP) core for RISC-V designs.

MACOM announces definitive agreement to acquire AppliedMicro

11/21/2016  MACOM Technology Solutions Holdings, Inc., a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced it has entered into a definitive agreement to acquire Applied Micro Circuits Corporation

Executives to get strategic perspectives for success at SEMI ISS 2017

11/17/2016  Electronics manufacturing executives will examine growth prospects, global industry developments and technology strategy at the SEMI Industry Strategy Symposium (ISS) 2017 to be held January 8-11 at the Ritz-Carlton, Half Moon Bay.

Registration open for SEMICON Korea 2017's special 30-Year anniversary

11/16/2016  Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.

What a twist: Silicon nanoantennas turn light around

11/16/2016  The theoretical results will allow scientists to design nanodevices with extraordinary features for use in optoelectronics.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

Five Top-20 semiconductor suppliers to show double-digit gains in 2016

11/15/2016  Nvidia and MediaTek forecast to register the fastest 2016 growth rates of 35% and 29%, respectively.

Nano-scale electronics score laboratory victory

11/10/2016  NYU Tandon researchers pioneer technique to grow monolayer tungsten disulfide for next-generation transistors, wearable electronics, and biomedical devices.

The thinnest photodetector in the world

11/10/2016  Graphene-based device could accelerate the development of 2-D photoelectronics.

Semiconductor-free microelectronics are now possible, thanks to metamaterials

11/09/2016  Engineers at the University of California San Diego have fabricated the first semiconductor-free, optically-controlled microelectronic device.

New record for silicon-based multi-junction solar cell

11/09/2016  Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

President’s Council launches semiconductor working group

11/08/2016  Tthe President’s Council of Advisors on Science and Technology (PCAST) announced the formation of a new working group focused on strengthening the U.S. semiconductor industry in ways that benefit the nation’s economic and security interests.

Astronics Test Systems announces new semiconductor system-level test platform

11/07/2016  Astronics Corporation (NASDAQ:ATRO), through its wholly-owned subsidiary Astronics Test Systems, introduced its new breakthrough System-Level Test (SLT) platform that is expected to revolutionize the testing of high volume integrated semiconductor devices.

Lattice Semiconductor to be acquired by Canyon Bridge Capital Partners, Inc. for $1.3B

11/03/2016  Lattice Semiconductor Corporation and Canyon Bridge Capital Partners, Inc. today announced that Lattice and Canyon Bridge Acquisition Company, Inc., an affiliate of Canyon Bridge, have signed a definitive agreement under which Canyon Bridge will acquire all outstanding shares of Lattice for approximately $1.3 billion.

Qualcomm/NXP deal underscores semiconductor merger trend

11/02/2016  Qualcomm's proposed acquisition of NXP Semiconductors marks the latest deal in a wave of industry consolidation that includes increasingly expensive transactions with greater focus on expanding scope rather than economies of scale.

Global semiconductor sales increase 11.5% in Q3

11/01/2016  Industry posts highest-ever quarterly sales; market still behind 2015's year-to-date total.

Analog Devices acquires Innovasic

10/27/2016  Analog Devices, Inc. today announced the acquisition of Innovasic Inc., a provider of Deterministic Ethernet semiconductor and software solutions.

Cadence CEO to be awarded Dr. Morris Chang Exemplary Leadership Award

10/27/2016  He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.

Qualcomm to acquire NXP

10/27/2016  Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

SMIC standardizes on Synopsys StarRC for signoff parasitic extraction

10/26/2016  Semiconductor Manufacturing International Corporation and Synopsys, Inc. today announced that it has adopted Synopsys' StarRC product as the standard solution for signoff parasitic extraction for its 28nm process technology.




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WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:
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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS