Device Architecture

DEVICE ARCHITECTURE ARTICLES



The growing semiconductor market in India

08/14/2014  The semiconductor industry in India is estimated to grow from $10.02 billion in 2013 to $52.58 billion in 2020 at CAGR of 26.72%, according to Research and Markets new report the "Semiconductor Market in India 2014 - 2020."

Pairing old technologies with new for next-generation electronic devices

08/12/2014  UCL scientists have discovered a new method to efficiently generate and control currents based on the magnetic nature of electrons in semiconducting materials, offering a radical way to develop a new generation of electronic devices.

Strong growth in second quarter 2014 silicon wafer shipments

08/12/2014  Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SEMICON Taiwan 2014 to capitalize on growing market opportunities in Taiwan

08/06/2014  Taiwan is forecast to have the largest regional semiconductor manufacturing equipment and materials capital expenditures in both 2014 and 2015.

New material allows for ultra-thin solar cells

08/04/2014  Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Atomic Layer Etch now in Fab Evaluations

08/04/2014  Lam’s CTO talks about the future of etch in beta-site tests.

Cavium to acquire switching and SDN specialist Xpliant

08/04/2014  Cavium, Inc., a provider of semiconductor products, announced an agreement to acquire Xpliant, Inc., a privately held company headquartered in San Jose, California.

Wireless connectivity semiconductors maintain strong double-digit growth in health and fitness

07/31/2014  Semiconductors providing wireless connectivity in health and fitness devices are set for solid double-digit growth in 2014 and beyond, especially as a clutch of wireless technologies make their way into a growing number of wearable devices.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

07/24/2014  Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

07/24/2014  Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

Peregrine Semiconductor and RF Micro Devices settle outstanding litigation

07/23/2014  Peregrine Semiconductor Corporation, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, and RF Micro Devices, Inc., a designer and manufacturer of high-performance radio frequency solutions, today announced that they have settled all outstanding claims between the companies.

Micron 16nm NAND flash memory awarded Most Innovative Memory Device and Semiconductor of the Year

07/23/2014  Micron Technology, Inc. and TechInsights today announced that Micron has been honored with both the Most Innovative Memory Device and Semiconductor of the Year awards for their 16nm NAND Flash memory technology in TechInsights' 11th Annual Insight Awards.

A new multi-bit 'spin' for MRAM storage

07/23/2014  Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

Understanding graphene’s electrical properties on an atomic level

07/23/2014  Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.

Fundamental chemistry findings could help extend Moore’s Law

07/23/2014  A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

SEMI announces new South America Semiconductor Strategy Summit

07/22/2014  SEMI today announced the launch of the association's first-ever event in Latin America.

SEMI: June 2014 equipment bookings at the highest level since May 2012

07/22/2014  North America-based manufacturers of semiconductor equipment posted $1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09, according to the June EMDS Book-to-Bill Report published today by SEMI.

Dongbu HiTek unveils low-voltage BCDMOS process for efficient power management

07/22/2014  Dongbu HiTek today announced the immediate availability of a Low Voltage BCDMOS Process (BD130LV) at the 0.13-micron node that is ideally suited for implementing the main Power Management IC (PMIC) for smart phones and tablet computers.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

07/22/2014  Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

CEA-Leti: Monolithic 3D is the solution for further scaling

07/21/2014  Hughes Metras, Leti’s VP of Strategic Partnerships North America, introduced the lead talk at their SemiconWest 2014 Leti Day about monolithic 3D technology as the "solution for scaling."




FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014