DEVICE ARCHITECTURE ARTICLES
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HEADLINESSTATS Chip reveals eWLCS project to offer better quality solutions
July 30, 2014 Highly Conformable TIM July 30, 2014 Analog Devices Completes Purchase of Hittite Microwave July 30, 2014 Transparency Market Research: Global Physical Vapor Deposition Market to be Worth USD 20.45 Billion by 2019 July 30, 2014 Transparency Market Research Reports Physical Vapor Deposition Market Report July 30, 2014 Intel Vietnam to produce 80% of world's computer chips by 2015: CEO July 30, 2014 TechSci Research: Global Pico Projector Market May Reach $1.35 Billion in 2014 July 30, 2014 Fujifilm Electronic Materials U.S.A. Appoints Dr. Brian O'Donnelly as President & CEO July 30, 2014 Royal Show takes place on August 8 and 9 July 30, 2014 SPIE Launches 'Neurophotonics' Journal with Special Section on BRAIN Initiative July 29, 2014 |
FINANCIALS |
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TECHNOLOGY PAPERS Parylene 101: Learn about the best protection for MEMS This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment.
May 22, 2014 Conformal Coatings for Reliable Electronic AssembliesModern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014 The Next Step in Diagnosis Resolution ImprovementLearn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014 |
WEBCASTSWet ProcessingJuly 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.
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450 UpdateJuly 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.
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MetrologyAugust 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.
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VIDEOS |
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EVENTSSPIE Photomask Technology 2014Monterey Conference Center and Monterey Marriott, http://spie.org/photomask.xml?WT.mc_id=RCal-PMW September 16, 2014 - September 18, 2014 Photomask Technology Exhibition 2014Monterey Conference Center and Monterey Marriott, http://spie.org/photomask.xml?WT.mc_id=RCal-PMW September 16, 2014 - September 17, 2014 2014 International Workshop on EUV and Soft X-ray SourcesDublin, Ireland https://www.euvlitho.com/index.php?_a=viewDoc&docId=40 November 03, 2014 - November 06, 2014 The 40th International Symposium for Testing and Failure AnalysisHouston, TX http://www2.asminternational.org/content/Events/istfa/ November 09, 2014 - November 13, 2014 The 40th International Symposium for Testing and Failure Analysis - ExpositionHouston, TX http://www2.asminternational.org/content/Events/istfa/ November 11, 2014 - January 01, 1970 |
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