Device Architecture

DEVICE ARCHITECTURE ARTICLES



Making electronics safer with perovskites

03/16/2016  Scientists in Japan are developing methods to manufacture safer ceramic capacitors.

2016 semiconductor sales to go negative, says Semico Research

03/15/2016  After analyzing current trends, Semico announced the semiconductor industry is repeating the pattern from 2011-2012, albeit at a muted level.

GLOBALFOUNDRIES broadens SiGe power amplifier portfolio

03/15/2016  GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.

Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC

03/14/2016  Mentor Graphics Corporation today announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology.

High-K precursors for ICs to reach ~$400M by 2020

03/14/2016  Chemical precursors (inorganic and organic) used to form high dielectric constant (High-K) materials, metals and metal nitrides needed in advanced ICs are forecasted to reach $400M USD in global sales by 2020, as highlighted in TECHCET’s 2016 Critical Materials Report.

Intel honors 27 companies with Preferred Quality Supplier and Achievement Awards

03/11/2016  Intel Corporation this week recognized 26 companies with its 2015 Preferred Quality Supplier (PQS) award, which celebrates exceptional performance and continuous pursuit of excellence.

SMIC and Crossbar announce strategic partnership agreement

03/11/2016  Semiconductor Manufacturing International Corporation and Crossbar, Inc. jointly announced today that they had signed a strategic partnership agreement on non-volatile RRAM development and production.

Multitest introduces mmWave Contactor

03/10/2016  Multitest successfully introduced a contacting solution for testing of extremely high frequency semiconductors in high volume production.

Think small

03/09/2016  Students learn huge challenges involved in making tiny devices in SEAS Microfabrication Laboratory.

Market for GaN and SiC power semiconductors to top $1B in 2020

03/09/2016  The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass the $1 billion mark in five years, energized by demand from hybrid and electric vehicles, power supplies and photovoltaic (PV) inverters.

Warming up optoelectronic research

03/08/2016  A team of physicists from the University of California, San Diego and The University of Manchester is creating tailor-made materials for cutting-edge research and perhaps a new generation of optoelectronic devices.

Lattice Semiconductor announces CFO's plans to step down

03/07/2016  As part of this transition, Max Downing, Lattice's vice president of Finance, has been named interim chief financial officer.

Semiconductor unit shipments to exceed one trillion devices in 2018

03/07/2016  Total yearly semiconductor unit shipments are forecast to continue their upward march and are now expected to top one trillion units for the first time in 2018.

'Bending current' opens up the way for a new type of magnetic memory

03/07/2016  Use your computer without the need to start it up: a new type of magnetic memory makes it possible. This "MRAM" is faster, more efficient and robust than other kinds of data storage. However, switching bits still requires too much electrical power to make large-scale application practicable.

GLOBALFOUNDRIES adds Alain Mutricy as head of Product Management Group

03/04/2016  Mutricy succeeds Mike Cadigan, who will transition to a newly created role as senior vice president of global sales and business development.

Electricity can flow through graphene at high frequencies without energy loss

03/04/2016  Research has shown graphene out-performs any other known material, including superconductors, when carrying high-frequency electrical signals compared to direct current, essentially transmitting signals without any additional energy loss.

Many Mixes to Match Litho Apps

03/03/2016  "Mix and Match" has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing.

NEC honors NXP with "Partner of the Year" Award

03/02/2016  NEC recognized NXP for its contribution to speeding time-to-market for NEC LTE-Advanced base station technology.

Spinning better electronic devices

03/02/2016  Researchers demonstrate a proof-of-concept device that could take advantage of spin of electrons to potentially create more energy efficient electronic devices.

Taiwan passes South Korea to become #1 in total IC wafer fab capacity

03/01/2016  IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region, and by product type through 2020.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS