Device Architecture

DEVICE ARCHITECTURE ARTICLES



AKHAN Semiconductor announces licensing agreement with Argonne National Laboratory

11/11/2014  AKHAN Semiconductor Inc. and the U.S. Department of Energy’s Argonne National Laboratory have reached an exclusive licensing agreement on a patent portfolio that will provide AKHAN with the intellectual property to become a fully-integrated semiconductor designer, developer and manufacturer.

Freescale and Intel processors now active at Rochester Electronics

11/11/2014  Rochester Electronics, a fully-authorized manufacturer and distributor of semiconductors, will launch 2015 with the re-introduction of many popular processors from Freescale and Intel.

Qualcomm joins SRC’s Trustworthy and Secure Semiconductors and Systems Initiative

11/11/2014  Semiconductor Research Corporation (SRC) today announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, has joined SRC’s Trustworthy and Secure Semiconductors and Systems (T3S) program.

$1,000,000 "Challenge Grant" goal achieved for SEMI high tech industry workforce development

11/11/2014  With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

On-demand conductivity for graphene nanoribbons

11/10/2014  New research may help to develop graphene-based electronic devices that only become conductors when an external ultra-short pulse is applied, and are otherwise insulators.

Applied Materials develops advanced patterning solution for memory devices

11/10/2014  Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Graphene Frontiers secures patent for commercial-scale material production

11/07/2014  Graphene Frontiers LLC, a developer of graphene materials and device technology, announces the issuance of a key industry patent.

SEMATECH names Ronald Goldblatt permanent CEO

11/07/2014  SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

Focus on technology challenges at SEMICON Japan 2014

11/06/2014  Presentations by Accenture Japan, Scripps, Toyota and ARM, were announced today for SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology.

GLOBALFOUNDRIES and INVECAS introduce new dedicated design service partner for leading-edge technologies

11/06/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc.

Tetsuro Higashi to receive the SEMI Sales and Marketing Excellence Award

11/05/2014  SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

Reno Sub-Systems closes first venture round with Intel Capital, Innovacorp and other investors

11/05/2014  Reno Sub-Systems (Reno) today announced that it has closed its first venture funding round with Intel Capital, early stage Canadian venture capital organization Innovacorp and other investors.

2014 Global Semiconductor Alliance Award nominees announced

11/04/2014  The Global Semiconductor Alliance (GSA) is pleased to announce the 2014 award nominees for the GSA Awards Dinner Celebration taking place on Thursday, December 11, 2014, at the Santa Clara Convention Center in Santa Clara, Calif.

Experts at the Table: Focus on Semiconductor Materials

11/03/2014  The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde Electronics; Kate Wilson of Edwards Vacuum; David Thompson of Applied Materials; and Ed Shober of Air Products and Chemicals.

Air-gaps in Copper Interconnects for Logic

10/31/2014  Intel’s “14nm-node” process uses air-gaps in dielectrics; direction disclosed four years ago.

SEMI extends ASMC Call for Papers deadline to November 10

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

10/30/2014  Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

10/29/2014  Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS process

10/29/2014  Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

10/28/2014  Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Extending Moore's Law

January 2015 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2015 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015