Device Architecture

DEVICE ARCHITECTURE ARTICLES



GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory solution

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

IntelliProp announces Gen-Z persistent memory controller combining DRAM and NAND

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

Microsemi collaboration enables Mellanox and other industry leaders to deliver NVMe-oF architectures

08/08/2017  Microsemi's peer-to-peer memory technology facilitates large data streams to transfer between NVMe-oF applications with better throughput, latency and quality of service.

NXP announces production of security chips in its US manufacturing facilities

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

​GLOBALFOUNDRIES, Silicon Mobility deliver the industry’s first automotive FPCU to boost performance for hybrid and electric vehicles

08/03/2017  GLOBALFOUNDRIES and Silicon Mobility today announced they have successfully produced the industry’s first automotive Field Programmable Controller Unit (FPCU) solution, called OLEA T222.

Gen. Keith Alexander to deliver keynote address at SIA's 40th Anniversary Award Dinner

08/02/2017  Former Director of National Security Agency, Commander of U.S. Cyber Command to weigh in on the importance of technology to national security.

Significant mid-year revision to 2017 IC market forecast

08/02/2017  DRAM, NAND flash memory markets drive the first annual double-digit upturn since 2010.

Ferroelectric phenomenon proven viable for oxide electrodes, disproving predictions

08/01/2017  Researchers in China have disproved the theory that oxide electrodes destabilize ferroelectric phenomena called flux-closure domains in ferroelectric thin films.

Analog Devices joins University of Michigan’s Mcity Initiative for advancing connected and autonomous vehicles

07/31/2017  Analog Devices, Inc. (ADI) today announced that it has become an affiliate member of Mcity at the University of Michigan.

The pervasiveness of ASICs in the IoT era

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

Overcoming challenges in 3D NAND volume manufacturing

07/27/2017  As 3D NAND becomes the mainstream technology, its challenging roadmap poses opportunities for continued innovation.

Atomic discovery opens door to greener, faster, smaller electronic circuitry

07/26/2017  Scientists find way to correct communication pathways in silicon chips, making them perfect.

Dow Corning receives Global Supplier Award from Bosch

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Scientists announce the quest for high-index materials

07/25/2017  A team of physicists featuring researchers from MIPT and ITMO University has conducted a comparative analysis of a range of materials to determine if they are applicable to dielectric nanophotonics. Their systematic study produced results that can optimize the use of known materials for building optical nanodevices, as well as encourage the search for new materials with superior properties.

Second quarter 2017 silicon wafer shipments increase quarter-over-quarter

07/25/2017  Worldwide silicon wafer area shipments increased during the second quarter 2017 when compared to first quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

CCNY physicists master unexplored electron property

07/25/2017  While the charge and spin properties of electrons are widely utilized in modern day technologies such as transistors and memories, another aspect of the subatomic particle has long remained uncharted. This is the "valley" property which has potential for realizing a new class of technology termed "valleytronics" - similar to electronics (charge) and spintronics (spin). This property arises from the fact that the electrons in the crystal occupy different positions that are quantum mechanically distinct.

Chemical route towards electronic devices in graphene

07/25/2017  Essential electronic components, such as diodes and tunnel barriers, can be incorporated in single graphene wires (nanoribbons) with atomic precision.

Value of semiconductor industry M&A deals slows dramatically in 1H17

07/25/2017  Numerous smaller deals have been made but “megadeals” have yet to surface this year.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS