Device Architecture

DEVICE ARCHITECTURE ARTICLES



Samsung announces mass production of industry’s first 14nm finFET mobile application processor

02/17/2015  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

Novel solid-state nanomaterial platform enables terahertz photonics

02/17/2015  cientists are pioneering the use of nanomaterials in compact, sensitive, fast, low-cost terahertz detectors with potential in applications such as biomedical diagnostics, airport security screening and high data-rate wireless communication

Ghent University and imec demonstrate interaction between light and sound in nanoscale waveguide

02/17/2015  Silicon photonics enables extreme light-matter interaction.

Extreme-temperature electronics

02/13/2015  Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200° Celsius.

Giga-scale challenges will dominate 2015

02/13/2015  It wasn’t all that long ago when nano-scale was the term the semiconductor industry used to describe small transistor sizes to indicate technological advancement.

Applied's merger with TEL: Still a work in progress

02/11/2015  Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

02/10/2015  The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Strategy is key differentiator as more efficient GaN, SiC power electronics enter market

02/10/2015  Power electronics based on gallium nitride (GaN) and silicon carbide (SiC) have the potential to significantly improve efficiency. But since these materials are higher-cost, companies need market-specific strategies in order to succeed as these new wide-bandgap (WBG) materials claim market share from silicon-based semiconductors, according to Lux Research.

Precision growth of light-emitting nanowires

02/10/2015  A novel approach to growing nanowires promises a new means of control over their light-emitting and electronic properties.

Mentor Graphics launches broadest embedded systems solution for industrial automation

02/09/2015  Mentor Graphics Corporation today announced the embedded systems industry's broadest portfolio for industrial automation.

Qualcomm and China's National Development and Reform Commission reach resolution

02/09/2015  Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.

Spansion and XMC expand partnership to jointly develop 3D NAND

02/09/2015  Spansion Inc. and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology.

One-atom-thin silicon transistors hold promise for super-fast computing

02/09/2015  Researchers at The University of Texas at Austin's Cockrell School of Engineering have created the first transistors made of silicene, the world's thinnest silicon material.

Breakthrough may lead to industrial production of graphene devices

02/09/2015  With properties that promise faster computers, better sensors and much more, graphene has been dubbed the 'miracle material'. But progress in producing it on an industrial scale without compromising its properties has proved elusive.

ROHM Semiconductor announces monolithic EDLC cell balancing IC

02/05/2015  ROHM recently announced the development of a cell balancing IC that contributes to increased miniaturization, greater stability, and longer life for EDLCs.

SEMICON Show Highlights Chip Manufacturing in South Korea

02/04/2015  The SEMICON Korea conference and exhibition opens Wednesday in Seoul for a three-day run. The show highlights the importance of semiconductor manufacturing in South Korea, home to two of the biggest memory chip makers in the world, Samsung Electronics and SK Hynix.

Status of the power electronics industry: It is now a question of integration

02/02/2015  According to Yole Développement’s team, wide band gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is now: How?

New method allows for greater variation in band gap tunability

01/30/2015  If you can't find the ideal material, then design a new one.

Demystifying nanocrystal solar cells

01/30/2015  Scientists are focusing on nanometer-sized crystals for the next generation of solar cells. These nanocrystals have excellent optical properties. Compared with silicon in today's solar cells, nanocrystals can be designed to absorb a larger fraction of the solar light spectrum. However, the development of nanocrystal-based solar cells is challenging.

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

01/28/2015  Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the issue of improving communications between the Old World and the New World.




FINANCIALS



TECHNOLOGY PAPERS



High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

April 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015