Device Architecture

DEVICE ARCHITECTURE ARTICLES



Imec advances drive current in vertical 3D NAND memory devices

12/09/2015  At this week’s IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm.

Imec improves performance and reliability of deeply-scaled CMOS logic devices

12/09/2015  At this week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented breakthrough results to increase performance and improve reliability of deeply scaled silicon CMOS logic devices.

Practical limits for metallization scaling in fabs

12/08/2015  Beyond economic limits due to litho limitations, the inherent need for a physical barrier puts an electrical limit on the ability to scale.

Leti develops local-strain techniques in FD-SOI fabrication to improve next-generation performance

12/08/2015  CEA-Leti today announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed at the same, or lower, power consumption, and improve performance.

NXP and Freescale announce completion of merger

12/08/2015  The merger has created a high performance mixed signal semiconductor industry leader, with combined revenue of over $10 billion.

Smart Rock Bolt Wins Prize at Designers of Things Conference

12/07/2015  When it comes to Internet of Things products, most people would think of the Apple Watch or Fitbit fitness-tracking devices. A device aimed at the mining industry has proved to be a popular entry at the Designers of Things conference in San Jose, Calif.

Semiconductor sales: slight growth projected for next three years

12/07/2015  Market projected to grow by 0.2 percent in 2015, 1.4 percent in 2016, and 3.1 percent in 2017.

Intersil CEO Necip Sayiner elected chair of Semiconductor Industry Association

12/04/2015  The Semiconductor Industry Association (SIA) today announced the SIA Board of Directors has elected Dr. Necip Sayiner, President, CEO and Director of Intersil, as its 2016 Chair and Tunç Doluca, President and CEO of Maxim Integrated, as its 2016 Vice Chair.

IDMs could top fabless semiconductor company growth for only the second time in history

12/03/2015  Sales of top 10 IDMs forecast to be flat; top 10 fabless companies expected to slip into negative growth this year.

Quantum computer made of standard semiconductor materials

12/02/2015  Physicists at the Technical University of Munich, the Los Alamos National Laboratory and Stanford University (USA) have tracked down semiconductor nanostructure mechanisms that can result in the loss of stored information - and halted the amnesia using an external magnetic field.

Diodes finalizes acquisition of Pericom Semiconductor

12/02/2015  Diodes reported that it has completed its acquisition of Pericom Semiconductor.

Ambiq Micro appoints new CEO

12/01/2015  Ambiq Micro, a developer of ultra-low power semiconductor solutions, today announced that Fumihide (Humi) Esakahas joined the firm as Chief Executive Officer.

Global discrete semiconductors market expected to surpass $24B by 2019

12/01/2015  The new industry research report from Technavio discusses in detail the key drivers and trends responsible for the growth of this market and its sub-segments.

GaN Systems announces 10x production increase at TSMC

12/01/2015  GaN Systems, a manufacturer of gallium nitride power transistors, announces that its foundry, Taiwan Semiconductor Manufacturing Corporation (TMSC), has expanded the high volume production of products based on GaN System’s proprietary Island Technology by 10X in response to surging global demand from consumer and enterprise customers.

Measuring 5nm Particles In-Line

11/30/2015  ITRI and TSMC co-develop aerosol method to monitor liquids and slurries.

Stanford technology makes metal wires on solar cells nearly invisible to light

11/30/2015  Stanford University scientists have discovered how to hide the reflective upper contact and funnel light directly to the semiconductor below.

Tallness Makes Reliable Spindt Tip Cold Cathodes

11/30/2015  Vacuum nanowire arrays of cold cathodes for high frequency sources and amplifiers

Mergers: Commission clears Avago's acquisition of Broadcom

11/25/2015  The Commission concluded that the merged entity would continue to face effective competition in Europe.

Lattice Semiconductor appoints new COO

11/25/2015  Lattice Semiconductor Corporation, a manufacturer of programmable logic devices, has appointed Glen Hawk as COO.

Silicon Labs acquires Telegesis, a provider of ZigBee modules

11/24/2015  A privately held company founded in 1998 and based near London, Telegesis has established itself as a ZigBee expert with strong momentum in the smart energy market, providing ZigBee module solutions to many of the world’s top smart metering manufacturers.




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TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016