Device Architecture

DEVICE ARCHITECTURE ARTICLES



Frost & Sullivan recognize RFaxis with Award for Technology Innovation Leadership

02/21/2014  Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan recognizes RFaxis, Inc. with the 2014 North American Frost & Sullivan Award for Technology Innovation Leadership.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

02/21/2014  Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

Single chip device to provide real-time 3-D images from inside the heart and blood vessels

02/20/2014  Researchers have developed the technology for a catheter-based device that would provide forward-looking, real-time, three-dimensional imaging from inside the heart, coronary arteries and peripheral blood vessels.

Semiconductor industry posts record sales in 2013

02/20/2014  The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

2014 SPIE Startup Challenge winners announced

02/20/2014  A microscope in a needle, a handheld device that prescribes corrective eyeglasses, and a device for heart attack diagnosis are winning projects in the 2014 SPIE Startup Challenge.

Using holograms to improve electronic devices

02/20/2014  A team of researchers from the University of California, Riverside Bourns College of Engineering and Russian Academy of Science have demonstrated a new type of holographic memory device that could provide unprecedented data storage capacity and data processing capabilities in electronic devices.

Plasma-Therm signs cross-licensing agreement with ON Semiconductor

02/20/2014  Plasma-Therm announced today that it has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes.

The most expensive SRAM in the world - 2.0

02/20/2014  Embedded SRAM scaling is broken and, with it, Moore's Law.

Silicon-germanium chip sets new speed record

02/18/2014  A research collaboration consisting of IHP-Innovations for High Performance Microelectronics in Germany and the Georgia Institute of Technology has demonstrated the world's fastest silicon-based device to date.

Breakthrough development in 1D-1R memory cell array

02/18/2014  Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

GaN Systems appoints Tony Astley as Director of European Operations

02/18/2014  GaN Systems Inc, a developer of gallium nitride power switching semiconductors, has announced the appointment of Tony Astley as Director of European Operations.

MACOM acquires Nitronex

02/18/2014  M/A-COM Technology Solutions Inc., a supplier of high performance analog, RF, microwave and millimeter wave products, last week announced that it has acquired Nitronex, LLC.

Renesas Electronics develops industry's first 28nm embedded flash memory tech for microcontrollers

02/18/2014  Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

Dow Electronic Materials launches CMP polishing pads

02/14/2014  Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads.

Honeywell introduces new copper manganese sputtering targets

02/14/2014  Honeywell announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better performance.

ROHM Semiconductor's operational amplifiers for sensor signal amplification

02/13/2014  ROHM Semiconductor today introduced the development of the BD5291G and the BD5291FVE low voltage, low offset operational amplifiers (opamp) designed to amplify signals from motion sensors such as accelerometers and gyroscopes.

Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

02/12/2014  At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

Fujitsu Labs and imec develop wireless transceiver technology for medical devices

02/12/2014  Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

IBM continues to evolve: Semiconductor business up for sale; moving into the cloud

02/07/2014  The Financial Times (FT) is reporting that IBM Corp is exploring the sale of its semiconductor business and has hired Goldman Sachs to find potential buyers.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

02/07/2014  Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014