Device Architecture


ISSI provides update on closing of acquisition by Uphill

08/14/2015  Integrated Silicon Solution, Inc., a global fabless semiconductor company, today provided an update on the closing of its pending acquisition by Uphill Investment Co. for $23.00 per share in cash.

Peregrine Semiconductor expands into new building

08/14/2015  Peregrine Semiconductor Corp. announced the addition of a third building to its Sorrento Valley headquarters.

Qualcomm completes $2.4B acquisition of CSR

08/14/2015  Qualcomm Incorporated today announced that its indirect, wholly-owned subsidiary, Qualcomm Global Trading Pte. Ltd, has completed its acquisition of CSR plc (CSR), a fabless provider of end-to-end semiconductor and software solutions for the Internet of Everything (IoE) and automotive segments.

CMOS image sensors see higher growth from diversity of uses

08/12/2015  Dependency on camera phones lessens as imaging technology moves into a wider range of systems -- from automotive and machine vision to surveillance and sensors for Internet of Things.

Low Power Conference at SEMICON Europa 2015

08/12/2015  Trends and innovations for low and ultra-low power integrated circuits are the focus of the Low Power Conference at the SEMICON Europa 2015 in Dresden, October 6-8.

Imec pushes the boundaries of GaN technology

08/12/2015  Nano-electronics research center imec announced today that it is extending its Gallium Nitride-on-Silicon (GaN-on-Si) R&D program, and is now offering joint research on GaN-on-Si 200mm epitaxy and enhancement mode device technology.

Rice U. discovery may boost memory technology

08/11/2015  Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

08/11/2015  Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

ON Semiconductor appoints Alan Campbell to Board of Directors

08/07/2015  ON Semiconductor Corporation today announced that Alan Campbell has joined its Board of Directors.

Toshiba develops world's first 16-die stacked NAND flash memory with TSV tech

08/06/2015  Toshiba Corporation today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

Qualcomm to acquire Ikanos

08/06/2015  Qualcomm Incorporated subsidiary, Qualcomm Atheros, Inc., today announced it entered into a definitive merger agreement to acquire Ikanos Communications, Inc., a high performance broadband networking semiconductor and software provider enabling both central office and home gateway solutions.

Samsung cuts Intel's semiconductor sales lead to 16% in second quarter

08/06/2015  Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

SEMI Taiwan PV Committee elects new vice chairs

08/05/2015  SEMI Taiwan PV Committee announced the newly-elected vice chairs: Cafer Huang, general manager at Giga Solar Materials Corp., and Swean Lin, president at Green Energy Technology Inc.

SunEdison Semiconductor announces manufacturing consolidation

08/05/2015  The consolidation will consist of closing its Ipoh, Malaysia wafering plant by the end of 2016, and relocating the associated capacity to other plant sites. The company does not expect its total capacity to change.

Toshiba develops world’s first 256Gb, 48-layer BiCS FLASH

08/04/2015  Toshiba America Electronic Components, Inc. (TAEC) today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.

Microchip Technology completes acquisition of Micrel

08/04/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

Better together: Graphene-nanotube hybrid switches

08/03/2015  Yoke Khin Yap, a professor of physics at Michigan Technological University, has worked with a research team that created these digital switches by combining graphene and boron nitride nanotubes.

SEMICON West: The road forward is 3DIC

07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

The confidence of the Wide Band Gap industry

07/30/2015  WBG companies are slowly but surely reshaping the industry and accelerate the market adoption with numerous strategic mergers and acquisitions and the development of disruptive solutions.

Process Watch: The most expensive defect - Part 2

07/30/2015  The December 2014 edition of Process Watch suggested that the most expensive defect is the one that goes undetected until the end of line. Indeed, undetected excursions typically result in the scrap of millions of dollars per year of defective semiconductor chips.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015