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DEVICE ARCHITECTURE ARTICLES



Chinese chipmaker Tsinghua prepares $23B bid for Micron Technology

07/14/2015  China’s state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, in what analysts say would be the biggest Chinese takeover of a U.S. company.

SEMI forecasts three years of growth in chip equipment spending

07/14/2015  SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

Blood and tears at DAC

07/14/2015  At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

ECAE improves sputtering target performance

07/14/2015  Because it can achieve extreme deformation, Equal Channel Angular Extrusion (ECAE) can deliver submicron, high strength and uniform microstructures. The resulting improvements in strength allow for monolithic targets with a longer target life of 20-100%.

Applied Materials' new etch system provides atomic-level precision

07/13/2015  Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

Imec and Panasonic demonstrate breakthrough RRAM cell

07/13/2015  Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability.

GLOBALFOUNDRIES launches industry's first 22nm FD-SOI technology platform

07/13/2015  GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices.

Substrate innovation for extending Moore and more than Moore

07/10/2015  Engineered SOI substrates are now a mainstream option for the semiconductor industry.

IoT platform, Silicon Impulse, energy efficiency and consumer applications focus of LetiDays discussion

07/09/2015  Smart devices for the Internet of Things are among the top three growth drivers for the semiconductor industry, but the IoT is a highly fragmented market where multiple applications have varying energy requirements.

IBM Research alliance produces industry's first 7nm node test chips

07/09/2015  IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

SEMI updates key safety guidelines for semiconductor manufacturing equipment

07/08/2015  SEMI today announced the cornerstone safety Standard S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) will be updated this month.

Could black phosphorus be the next silicon?

07/07/2015  New material could make it possible to pack more transistors on a chip, research suggests.

Peregrine Semiconductor introduces first RF SOI 300mm technology platform

07/06/2015  Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS 11 platform.

The big picture: More than 850 volume fabs in 2017

07/06/2015  We, in the semiconductor supply chain, are constantly immersed in detailed numbers. It’s important to pull back and look at the major trends that have profoundly changed and are reshaping our industry.

Smartphone sales remain an important IC market driver in 2015

07/02/2015  Smartphones forecast to represent 80% of total cellphone shipments in 4Q15.

Ambiq Micro appoints Mike Noonen as interim CEO

07/01/2015  Ambiq Micro, a developer of ultra-low power integrated circuits for power-sensitive applications, today announced the appointment Mike Noonen as interim Chief Executive Officer with immediate effect.

Graphene flexes its electronic muscles

07/01/2015  Flexing graphene may be the most basic way to control its electrical properties, according to calculations by theoretical physicists at Rice University and in Russia.

New method can make cheaper solar energy storage

07/01/2015  EPFL scientists have now developed a simple, unconventional method to fabricate high-quality, efficient solar panels for direct solar hydrogen production with low cost.

SPP Technologies to acquire SPTS Technologies' Thermal Products business

07/01/2015  ORBOTECH LTD. today announced that SPTS Technologies Group Ltd. (SPTS), an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co, Ltd.

GLOBALFOUNDRIES completes acquisition of IBM Microelectronics business

07/01/2015  GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015