Device Architecture

DEVICE ARCHITECTURE ARTICLES



SRC TECHCON 2014 Conference to feature speakers from GLOBALFOUNDRIES, LinkedIn, High Point University

08/25/2014  The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.

The Week in Review: August 22, 2014

08/22/2014  Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone

Order activity for semiconductor equipment holds steady in July

08/21/2014  North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

Intel and Unity Technologies announce collaboration

08/21/2014  Intel Corporation and Unity Technologies today announced a strategic collaboration to advance the development of Android-based applications on Intel architecture.

Amkor Technology names David Watson to Board of Directors

08/21/2014  Amkor Technology, Inc. today announced that David Watson has been appointed as a new member of the Company’s Board of Directors.

MediaTek launches R&D center in Bengaluru

08/20/2014  MediaTek today announced the establishment of a new research and development facility in Bengaluru, India.

Renesas Electronics expands portfolio of Simple Power Supply ICs

08/20/2014  Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

08/20/2014  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

Promising ferroelectric materials suffer from unexpected electric polarizations

08/19/2014  Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

08/19/2014  Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

SmartPlay to offer design services for customers of Intel Custom Foundry

08/19/2014  SmartPlay Inc., a design services company with expertise in digital, analog, wireless software and system design, announced that it is ready to offer design services to customers of Intel Custom Foundry that require expertise, know-how and unique IP in critical embedded applications.

ON Semiconductor completes acquisition of Aptina Imaging

08/18/2014  ON Semiconductor today announced the completion of its acquisition of Aptina Imaging.

Riding the embedded software wave

08/18/2014  Software that controls and powers embedded devices is playing a key role in making possible the highly integrated, multi-functional ‘smart’ devices we take for granted in our daily lives – from the ubiquitous smart phones/tablet to ‘smart’ home appliances and wearable electronics.

The Week in Review: August 15, 2014

08/15/2014  The growing semiconductor market in India; MEMSIC's monolithic, wafer-level packaged accelerometer; Si2 adds new director of 3DIC Programs; Worldwide silicon wafer area shipments increased during the second quarter 2014; LightFair announces Call for Speakers

The growing semiconductor market in India

08/14/2014  The semiconductor industry in India is estimated to grow from $10.02 billion in 2013 to $52.58 billion in 2020 at CAGR of 26.72%, according to Research and Markets new report the "Semiconductor Market in India 2014 - 2020."

Pairing old technologies with new for next-generation electronic devices

08/12/2014  UCL scientists have discovered a new method to efficiently generate and control currents based on the magnetic nature of electrons in semiconducting materials, offering a radical way to develop a new generation of electronic devices.

Strong growth in second quarter 2014 silicon wafer shipments

08/12/2014  Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SEMICON Taiwan 2014 to capitalize on growing market opportunities in Taiwan

08/06/2014  Taiwan is forecast to have the largest regional semiconductor manufacturing equipment and materials capital expenditures in both 2014 and 2015.

New material allows for ultra-thin solar cells

08/04/2014  Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Atomic Layer Etch now in Fab Evaluations

08/04/2014  Lam’s CTO talks about the future of etch in beta-site tests.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Advanced Packaging

Thursday, October 16, 2014 at 1 p.m. EST

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

Oct. 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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