Displays

MAGAZINE



DISPLAYS ARTICLES



Kateeva names Dr. Homer Antoniadis as Executive Vice President of Technology

11/17/2017  Kateeva, a developer of OLED production equipment solutions, today appointed Dr. Homer Antoniadis to the newly created role of Executive Vice President of Technology.

Flexible AMOLED panel supply capacity to exceed demand by 44% in 2018

11/16/2017  With flexible active-matrix organic light-emitting diode (AMOLED) panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44 percent higher than global demand in 2018, according to IHS Markit.

Japan issues landmark diamond semiconductor patent to AKHAN

11/15/2017  AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronics-grade diamond, announced today the issuance by the Japan Patent Office of a patent covering a method for the fabrication of diamond semiconductor materials.

Electronics industry conference to debut in Kuala Lumpur

11/15/2017  SEMICON Southeast Asia 2018 to bolster growing semiconductor industry in the region.

Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

Pixelligent Technologies appoints Alain Harrus and Gene Banucci to its Board of Directors

11/07/2017  Pixelligent Technologies announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

Global shipments of oxide TFT LCD mobile PC panels to grow 200% this year

11/06/2017  Global shipments of large oxide TFT LCD panels of 9 inches or larger are expected to grow from 20 million units in 2016 to 55.6 million units in 2017.

Costs of 55-inch OLED TV display production catch up to LCD TV panels

11/03/2017  Unit cost for 55-inch UHD OLED TV panels recorded a 55 percent decline in second quarter of 2017 since its introduction in early 2015.

IPS display adoption in notebook PCs continues to increase

11/01/2017  IPS to make up 37 percent of all notebook PC panels shipped in 2017 and 42 percent in 2018, up from 27 percent in 2016.

Veeco and ALLOS demonstrate 200mm GaN-on-Si performance to enable micro-LED adoption

11/01/2017  Veeco Instruments Inc. (Nasdaq: VECO) announced today the completion of a strategic initiative with ALLOS Semiconductors (ALLOS) to demonstrate 200mm GaN-on-Si wafers for Blue/Green micro-LED production.

Quantum dots visualize tiny vibrational resonances

10/30/2017  Innovative device could lead to the development of new sensing technologies.

TowerJazz and Yuanchen Microelectronics announce partnership for BSI manufacturing

10/30/2017  This is the first time BSI will be offered by a foundry to the high-end photography market, including large formats requiring stitching.

NXP unveils breakthrough tech for payment cards

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

MORE DISPLAYS ARTICLES

TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

VIDEOS