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Another record year for silicon wafer shipment volumes in 2015

02/10/2016  Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

58% of pure-play foundry capacity under high risk for seismic activity

02/09/2016  As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

Researchers discover new phase of boron nitride and a new way to create pure c-BN

02/03/2016  Researchers at North Carolina State University have discovered a new phase of the material boron nitride (Q-BN), which has potential applications for both manufacturing tools and electronic displays.

Global semiconductor sales top $335B in 2015

02/01/2016  The Semiconductor Industry Association (SIA) today announced the global semiconductor industry posted sales totaling $335.2 billion in 2015, a slight decrease of 0.2 percent compared to the 2014 total, which was the industry's highest-ever sales total.

Foundries takeover 200mm fab capacity by 2018

02/01/2016  IoT drives worldwide 200mm fab capacity in 2018 back to 2006 levels.

North American semiconductor equipment industry posts December 2015 book-to-bill ratio of 0.99

01/27/2016  A book-to-bill of 0.99 means that $99 worth of orders were received for every $100 of product billed for the month.

Oversupply to overshadow LCD market in 2016

01/26/2016  The ongoing issue of liquid crystal display (LCD) oversupply -- exacerbated by China’s aggressive investment in production capacity as well as high fab utilization -- will continue well into 2016.

China semiconductor acquisitions surge; SEMICON China brings the new market into focus

01/26/2016  During SEMICON China 2016 on March 15-17 in Shanghai, key government decision makers, IC fund managers, and global industry analysts will share their insights on China's IC manufacturing policy.

SEMICON Korea opening: Memory and mobility drive IC manufacturing

01/26/2016  SEMICON Korea 2016 at COEX in Seoul opens tomorrow with more than 540 exhibiting companies and an expected 40,000 attendees.

2016 Critical Materials Council (CMC) Seminar – Call for Papers

01/21/2016  The Critical Materials Council (CMC) and TECHCET have issued a call for papers to be presented at the “Critical Materials for Device Driven Scaling” Seminar to be held May 5-6, 2016 in Hillsboro, Oregon, USA.

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TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016