Displays

DISPLAYS ARTICLES



As larger TVs gain popularity, TV panel area demand to grow 8% in 2017

01/23/2017  Demand for TV panels in terms of area is forecast to reach 143 million square meters in 2017, up 8 percent from 2016, contributing to a 6 percent growth in the overall display market, according to IHS Markit.

Large area displays market to witness growth owing to the high investments in OLED displays

01/18/2017  According to the latest market study released by Technavio, the global large area displays market is expected to reach USD 78.41 billion by 2021, growing at a CAGR of close to 2%.

NUS researchers achieve major breakthrough in flexible electronics

01/13/2017  New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices.

MagnaChip selected as "2016 Best Supplier" by LG Display

01/06/2017  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced it was given the prestigious "2016 Best Supplier Award" by LG Display.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Chinese panel makers top over 1M units in quarterly shipments for AMOLED smartphone displays

12/22/2016  Significant improvement in Chinese panel manufacturing technology offers domestic smartphone brands an alternative AMOLED supplier.

Advance in intense pulsed light sintering opens door to improved electronics manufacturing

12/22/2016  Faster production of advanced, flexible electronics is among the potential benefits of a discovery by researchers at Oregon State University's College of Engineering.

ANU invention to inspire new night-vision specs

12/12/2016  Scientists at The Australian National University (ANU) have designed a nano crystal around 500 times smaller than a human hair that turns darkness into visible light and can be used to create light-weight night-vision glasses.

Flexible display shipments to increase sharply in 2017

12/12/2016  As more smartphone manufacturers build designs using flexible display technology, shipments of flexible displays are expected to reach 139 million units in 2017, an increase of 135 percent compared to 2016.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

EVG and Korea National NanoFab Center program on novel display coatings delivers outstanding results

12/07/2016  EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.

Making graphene using laser-induced phase separation

12/02/2016  IBS & KAIST researchers clarify how laser annealing technology can lead to production of ultra thin nanomaterials.

Kateeva President & COO named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association

12/01/2016  Kateeva, the OLED production equipment leader, today announced that President and COO, Conor Madigan, Ph.D., was named "Inventor of the Year" for 2016 by the Silicon Valley Intellectual Property Law Association (SVIPLA).

ChipMOS and Tsinghua Unigroup agree to form joint-venture

11/30/2016  ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. today announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier private placement plan.

LCD TV panel makers set lower shipment target for 2017

11/29/2016  Restructuring of older display fabs, migration to larger-sized LCD TV panels and business strategy adjustments are some of the factors prompting LCD TV panel manufacturers to set a conservative shipment goal of 258.4 million units in 2017, a 1.2 percent decline from 2016.

Display panel makers increase fab utilization rate to 90% in Q4 2016

11/17/2016  The overall utilization rate at fabrication plants (fabs) used for display panel production is expected to reach 90 percent in the fourth quarter of 2016, up 7 percentage points from the same period in the previous year, and up 1 percentage point from the previous quarter.

Kateeva takes home award for YIELDjetT FLEX System

11/17/2016  Last night at the Printed Electronics USA conference in Santa Clara, Calif., Kateeva’s YIELDjet FLEX inkjet printing system was named the winner of the prestigious Technical Development Manufacturing Award.

Five Top-20 semiconductor suppliers to show double-digit gains in 2016

11/15/2016  Nvidia and MediaTek forecast to register the fastest 2016 growth rates of 35% and 29%, respectively.

Fueling the industry with innovation at SEMICON Japan 2016

11/15/2016  Today, SEMI announced that Innovation Village at SEMICON Japan 2016 has been expanded with participation by 31 start-up companies.

Kateeva appoints Mark R. Shaw, Ph.D. as Senior VP of Human Resources

10/26/2016  Previously, Shaw worked at Lam Research and Applied Materials.




TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS