07/28/2014 Addressing the analytics challenges in supply chain management.
07/25/2014 New approaches to start-ups can unlock mega-trend opportunities.
07/22/2014 SEMI today announced the launch of the association's first-ever event in Latin America.
07/16/2014 The capacitive touch controller IC market is predicted to reach about $2.8 billion in 2017, an increase of nearly 50 percent from $1.9 billion in 2013, according to a new report from IHS Technology.
07/16/2014 Renesas Electronics America Inc., a supplier of advanced semiconductor solutions, today announced development of innovative new intellectual property (IP) that implements capacitive-touch sensing technology ideal for home appliances and healthcare equipment.
07/10/2014 A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.
07/09/2014 The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.
07/08/2014 On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.
07/08/2014 Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.
07/08/2014 In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.
07/03/2014 Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.
07/03/2014 Cars that can get along without drivers are coming, down the road, but they are a small part of the changes that the global transportation industries will undertake as microelectronics and the Internet of Things prompt major changes in infrastructure and logistics, as well as all type of vehicles.
06/25/2014 The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.
06/24/2014 Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst
06/23/2014 Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.
06/23/2014 Many questions were in the air on the first day of the 10th annual ConFab 2014, and certainly chief among them was raised during Dr. Roawen Chen of Qualcomm’s keynote “What’s On Our Mind” on Monday morning when he asked, “Should we pursue Moore's Law unconditionally?"
06/23/2014 JSR Corporation, Lam Research, Tokyo Electron Ltd. and SUMCO Corporation honored for outstanding collaboration, service and cost leadership.
06/22/2014 Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.
06/19/2014 Storing gas on a sorbent provides an innovative, yet simple and lasting solution.
06/16/2014 In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.
This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment.
May 22, 2014Sponsored by Diamond-MT
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014Sponsored by Master Bond, Inc.,
Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014Sponsored by Mentor Graphics
July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.
July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.
August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.