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DISPLAYS ARTICLES



Quantum Materials scaling up photoactive quantum dot production for solar power generation

10/01/2014  Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies.

SEMICON Japan features "World of IoT"

10/01/2014  Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

United States photomask market to reach around $475M by 2019

09/29/2014  According to the recently published TechSci Research report, "United States Photomask Market Forecast & Opportunities, 2019", the photomask market in the United States is forecast to reach $474.58 billion by 2019.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

09/26/2014  Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

Flexible LEDs

09/24/2014  Flexible light-emitting diode (LED) displays and solar cells crafted with inorganic compound semiconductor micro-rods are moving one step closer to reality, thanks to graphene and the work of a team of researchers in Korea.

Future flexible electronics based on carbon nanotubes

09/24/2014  Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

NVIDIA unveils Maxwell GPU architecture

09/19/2014  In a major leap forward for gaming, NVIDIA today introduced the first high-end products based on its Maxwell chip architecture -- the new GeForce GTX 980 and 970 GPUs -- delivering unmatched performance, major new graphics capabilities and twice the energy efficiency of the previous generation.

Toward optical chips

09/19/2014  A promising light source for optoelectronic chips can be tuned to different frequencies.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

09/18/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Sapphire display covers featured in Apple smart watches but not in iPhone 6

09/11/2014  The long wait is finally over. From a sapphire industry standpoint, Apple killed the suspense within the first 10 minutes by announcing that its new 4.7” and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover.

Outlook: Healthy equipment spending into 2015

09/10/2014  The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Equipment spending shows strong growth for 2014 and 2015

09/10/2014  Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

A fundamental truth of process control

09/09/2014  You can’t fix what you can’t find. You can’t control what you can’t measure.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

09/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

10nm success depends on concurrent design and development

09/08/2014  The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

NVIDIA files complaints against Samsung and Qualcomm

09/05/2014  NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

Copper shines as flexible conductor

08/29/2014  Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

08/28/2014  SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

Plastic electronics: Opportunity on the edge of commercialization

08/27/2014  The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October.

In rapidly changing display industry, metal oxide TFT backplanes are promising

08/26/2014  MarketResearchReports.Biz released a new market research report this week entitled "Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players."




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

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WEBCASTS



Advanced Packaging

Oct. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

Oct. 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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