Displays

DISPLAYS ARTICLES



Picture this: Graphene brings 3-D holograms clearer and closer

04/28/2015  From mobile phones and computers to television, cinema and wearable devices, the display of full color, wide-angle, 3D holographic images is moving ever closer to fruition, thanks to international research featuring Griffith University.

Global LCD TV panel shipments reached monthly record high in March 2015

04/28/2015  LCD TV panel shipments from global panel makers reached 23.9 million in March 2015, growing 20 percent month over month and 11 percent year over year.

C3nano seals acquisition of Asia's largest manufacturer of silver nanowire, Aiden Co. Ltd. Korea

04/28/2015  C3nano, Inc. announced today that it has acquired the major supplier of silver nanowire (AgNW) in Asia, Aiden Co. Ltd. of Korea.

Canatu launches high transmittance CNB transparent conductive film for touch sensors

04/27/2015  Canatu, a manufacturer of next generation transparent conductive films and touch sensors, announces a new generation of high optical transmittance CNB (Carbon NanoBud) transparent conductive films at Printed Electronics Europe.

Applied Materials and Tokyo Electron terminate merger

04/27/2015  The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Brewer Science closer to zero-landfill status with "Big Blue" compactor that turns waste into electricity

04/21/2015  Brewer Science today announced its latest initiative to achieve and maintain zero-landfill status: a giant blue trash compactor that turns garbage into electricity.

Global 4K display market to reach $52B in 2020

04/20/2015  Once a feature mainly found in next-gen TVs, 4K resolution displays now being adopted in smartphones, PC monitors, OLED displays and notebook PCs.

Global semiconductor market achieves strong, broad-based growth in 2014

04/20/2015  Highest annual growth rate since 2010; strong growth expected again in 2015.

Applied Materials announces new photomask etch system

04/20/2015  Applied Materials today announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

Solid State Watch: April 10-16, 2015

04/17/2015  SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

Semiconductor CEOs urge congress to enact Trade Promotion Authority

04/16/2015  The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage.

Samsung Galaxy S6 Edge pricier to build, cheaper to buy than comparable Apple iPhone 6 Plus

04/16/2015  The recently released Samsung Galaxy S6 Edge is the most expensive Galaxy S line smartphone yet built, but has a lower retail price than a comparable iPhone 6 Plus, according to a preliminary estimate by IHS and its Technology Mobile Handsets Intelligence Service.

Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwide

04/14/2015  April 2015 marks the 50th anniversary of one of the business world’'s most profound drivers, now commonly referred to as Moore's Law.

Automotive touch panel revenues to hit $1.5B by 2018

04/10/2015  The explosion of touch-enabled screens used in smartphones, tablets and other consumer devices, along with improvements in touch technology, are increasing demand for touch-screen automotive displays.

Solid State Watch: April 3-9, 2015

04/10/2015  SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production

2014: A year in review - Semiconductor equipment and materials market and outlook

04/09/2015  2014 was the second record breaking year in a row in terms of semiconductor device revenues; the industry grew a robust 10 percent to total $336 billion, according to the WSTS.

Flexible facilities for 450mm wafer fabs

04/07/2015  When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS



MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015