Displays

DISPLAYS ARTICLES



2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

2017FLEX Korea: First flexible hybrid electronics conference in Korea

05/10/2017  Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.

Primary automotive display systems market valued at $11.6B globally in 2017

05/08/2017  Will grow to nearly $21 billion in 2022, IHS Markit says.

Tianma selects Orbotech solutions for its flex AMOLED Gen 6 fab

05/08/2017  Orbotech Ltd. announced today that Tianma Micro-electronics Co. Ltd. has selected Orbotech's ArrayChecker and Automated Optical Inspection (AOI) solutions for its production line upgrade to flexible AMOLED technology.

Discovery of new transparent thin film material could improve electronics and solar cells

05/08/2017  Conductivity is highest-ever for thin film oxide semiconductor material.

Panel shipment forecast rises for Q2, 2017 ahead of new product model launches

05/03/2017  Global liquid crystal display (LCD) and organic light-emitting diode (OLED) panel shipments are expected to increase by 7 percent in the second quarter of 2017 quarter to quarter to 646.7 million units, a rebound from a 9 percent quarter-to-quarter decrease in the first quarter, according to IHS Markit.

Flexible, organic and biodegradable: Stanford researchers develop new wave of electronics

05/02/2017  A new semiconductor developed by Stanford researchers is as flexible as skin and easily degradable. It could have diverse medical and environmental applications, without adding to the mounting pile of global electronic waste.

ASML, ZEISS file joint patent infringement lawsuits against Nikon

04/28/2017  ASML and ZEISS today announced that both companies are filing initial legal claims against Nikon for infringement of more than 10 patents.

Entegris acquires MicroElectronics filtration product line from W. L. Gore & Associates

04/25/2017  The transaction expands Entegris' portfolio of filtration solutions for semiconductor, OLED and flat panel display applications.

Galaxy S8 materials costs highest by far compared to previous versions, IHS Markit teardown reveals

04/25/2017  The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions of the company’s smartphones, according to a preliminary estimate from IHS Markit.

SEMICON Southeast Asia attendance surges on disruptive technology

04/25/2017  Today, SEMI announced that SEMICON Southeast Asia 2017 (SEMICON SEA 2017) is reporting an increase of up to 30 percent in attendees this year.

Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

04/24/2017  Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

New quantum liquid crystals may play role in future of computers

04/21/2017  New state of matter may have applications in ultrafast quantum computers.

Graphene Flagship researches create thin film transistors printed with layered materials

04/07/2017  Graphene Flagship researchers from AMBER at Trinity College Dublin have fabricated printed transistors consisting entirely of layered materials.

Spray-on memory could enable bendable digital storage

04/04/2017  Nanowire ink enables flexible, programmable electronics on materials like paper, plastic or fabric.

The ConFab preview

04/01/2017  The agenda is set for The ConFab, to be held May 14-17, 2017 in San Diego at the iconic Hotel del Coronado.

New ultrafast flexible and transparent memory devices could herald new era of electronics

03/31/2017  An innovative new technique to produce the quickest, smallest, highest-capacity memories for flexible and transparent applications could pave the way for a future golden age of electronics.

Revenues from flexible AMOLED display on pace to exceed rigid AMOLED panel in Q3 2017

03/28/2017  As demand for the flexible AMOLED display continues to sharply increase, its revenues are expected to reach $3.2 billion in the third quarter of 2017, exceeding that of rigid AMOLED panels at $3.0 billion, according to IHS Markit.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

Linde Invests Over EUR 110M in China to Strengthen Position as Supplier of Choice for Electronics Manufacturers

03/22/2017  Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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VIDEOS