Kateeva appoints Mark R. Shaw, Ph.D. as Senior VP of Human Resources

10/26/2016  Previously, Shaw worked at Lam Research and Applied Materials.

SEMI Korea Members Day provides industry insights and networking

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

Graphene cracks the glass corrosion problem

10/18/2016  Researchers at the Center for Multidimensional Carbon Materials (CMCM), within the Institute for Basic Science (IBS) have demonstrated graphene coating protects glass from corrosion.

Bendable electronic paper displays whole color range

10/14/2016  Less than a micrometre thin, bendable and giving all the colours that a regular LED display does, it still needs ten times less energy than a Kindle tablet. Researchers at Chalmers University of Technology have developed the basis for a new electronic "paper".

The future of electronics at SEMICON Europa 2016

10/13/2016  SEMICON Europa 2016, opening in less than two weeks in Grenoble, will explore the issues facing Europe's semiconductor and electronics industries, including processes, materials, equipment and supply chain.

Flat panel display capital equipment spending surging

10/10/2016  Flat-panel display (FPD) equipment sales are expected to attain their highest sustained three-year level in the history of the industry.

Thinfilm secures fabrication facility in Silicon Valley to house new roll-to-roll manufacturing line

10/07/2016  The company announced today that it has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current US headquarters and NFC Innovation Center in the first quarter of 2017.

South Korean IT display manufacturers replacing LCD with OLED

10/05/2016  Due to increasing capacity from China, South Korean LCD panel makers are quickly realizing that LCD displays profitability may eventually erode, due to growing capacity and price competition from China, so they are betting their future on organic light-emitting diode (OLED) displays.

Dr. Jin Jang joins Silvaco's Technical Advisory Board

10/05/2016  Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Jin Jang of Kyung Hee University in Seoul, Korea, has joined the Technical Advisory Board (TAB).

Elusive Analog Fault Simulation Finally Grasped

09/27/2016  The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

SID announces new award for outstanding contributions for active matrix addressed information displays

09/23/2016  The Peter Brody Prize will be awarded to a young researcher under age 40 who has made outstanding contributions in innovating the design and enhancing the performance of active matrix addressed information displays.

Kateeva's YIELDjet FLEX inkjet printing system takes commanding lead in OLED TFE market

09/21/2016  Since the novel inkjet printing solution debuted in manufacturing in 2014, the company has secured the vast majority of available TFE orders.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

09/21/2016  Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

Applied Materials brings its e-beam review technology to the display industry

09/21/2016  Applied Materials, Inc. today introduced the display industry's first high-resolution inline e-beam review (EBR) system, increasing the speed at which manufacturers of OLED and UHD LCD screens can achieve optimum yields and bring new display concepts to market.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

Imec scientist awarded ERC Starting Grant to develop breakthrough flexible electronics

09/13/2016  Nanoelectronics research center imec announces that Kris Myny, one of its young scientists, has been awarded an ERC Starting Grant.

SEMI’s new interactive mobile fab forecast: SEMI FabView

09/13/2016  SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts.



DSA: Progress Toward Manufacturing Readiness

November 15, 2016 at 1:00 p.m. ET / Sponsored by Brewer Science

Directed self-assembly (DSA) patterning is one of the primary methods being pursued for future advanced patterning nodes. Since DSA’s initial introduction in the early 2000s, great progress has been made. However, many challenges remain for achieving manufacturing readiness. Key improvements in the areas of materials, defectivity, and process integration are still needed. This webcast will cover published progress to date, review key improvements needed, and discuss new advances in DSA technology. Results from CEA-LETI’s 300-mm lab-to-fab for validation of DSA’s manufacturing readiness will be discussed.

Sponsored By:
Enabling The Future Of Information Technology Without Moore’s Law Scaling

November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.

Sponsored By:
More Webcasts


New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers


Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017