Displays

DISPLAYS ARTICLES



It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

Pixelligent Technologies named 2017 Manufacturer of the Year by Frost & Sullivan

06/19/2017  It won this award in the small/midsize company category for companies with revenues under $1B, for its PixClearProcess that is revolutionizing chemical composite technology.

To connect biology with electronics, be rigid, yet flexible

06/19/2017  Researchers uncover design principles to make polymers that can transport both ions and electrons.

Development of low-dimensional nanomaterials could revolutionize future technologies

06/15/2017  Javier Vela, scientist at the US Department of Energy's Ames Laboratory, believes improvements in computer processors, TV displays and solar cells will come from scientific advancements in the synthesis of low-dimensional nanomaterials.

Automotive touch screen shipments to top 50M units in 2017

06/12/2017  With consumers already accustomed with using smartphones and tablet PCs in their everyday lives, touch screens are now increasingly making their way into their vehicles, too.

The drive to smart manufacturing

06/09/2017  What does Smart Manufacturing mean for the future of the electronics manufacturing supply chain?

The first nanometrically-sized superelastic alloy

06/09/2017  UPV/EHU-University of the Basque Country's researchers have explored superelasticity properties on a nanometric scale based on shearing an alloy's pillars down to nanometric size.

AMOLED TV panel shipments to top 10 million units by 2023

06/06/2017  As panel makers are increasingly targeting the premium TV market, active-matrix organic light-emitting diode TV panel shipments are expected to exceed 10 million units by 2023, growing at a compound annual growth rate (CAGR) of 42 percent from 2017.

Air Products invests in six industrial gas plants to support electronics manufacturing industry in China

06/05/2017  Air Products announced it has recently received multiple, long-term supply awards from semiconductor and flat panel display manufacturers in China as the country's electronics manufacturing industry continues to boom.

Queen's researcher's 'miracle material' discovery could end cracked smart devices

06/02/2017  A Queen's University researcher has led an international team of scientists to the discovery of a new material, which could finally bring an end to the misery of cracked smartphone and tablet screens.

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

2017FLEX Korea: First flexible hybrid electronics conference in Korea

05/10/2017  Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.

Primary automotive display systems market valued at $11.6B globally in 2017

05/08/2017  Will grow to nearly $21 billion in 2022, IHS Markit says.

Tianma selects Orbotech solutions for its flex AMOLED Gen 6 fab

05/08/2017  Orbotech Ltd. announced today that Tianma Micro-electronics Co. Ltd. has selected Orbotech's ArrayChecker and Automated Optical Inspection (AOI) solutions for its production line upgrade to flexible AMOLED technology.

Discovery of new transparent thin film material could improve electronics and solar cells

05/08/2017  Conductivity is highest-ever for thin film oxide semiconductor material.

Panel shipment forecast rises for Q2, 2017 ahead of new product model launches

05/03/2017  Global liquid crystal display (LCD) and organic light-emitting diode (OLED) panel shipments are expected to increase by 7 percent in the second quarter of 2017 quarter to quarter to 646.7 million units, a rebound from a 9 percent quarter-to-quarter decrease in the first quarter, according to IHS Markit.

Flexible, organic and biodegradable: Stanford researchers develop new wave of electronics

05/02/2017  A new semiconductor developed by Stanford researchers is as flexible as skin and easily degradable. It could have diverse medical and environmental applications, without adding to the mounting pile of global electronic waste.

ASML, ZEISS file joint patent infringement lawsuits against Nikon

04/28/2017  ASML and ZEISS today announced that both companies are filing initial legal claims against Nikon for infringement of more than 10 patents.

Entegris acquires MicroElectronics filtration product line from W. L. Gore & Associates

04/25/2017  The transaction expands Entegris' portfolio of filtration solutions for semiconductor, OLED and flat panel display applications.

Galaxy S8 materials costs highest by far compared to previous versions, IHS Markit teardown reveals

04/25/2017  The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions of the company’s smartphones, according to a preliminary estimate from IHS Markit.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS