Displays

DISPLAYS ARTICLES



Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

Imec scientist awarded ERC Starting Grant to develop breakthrough flexible electronics

09/13/2016  Nanoelectronics research center imec announces that Kris Myny, one of its young scientists, has been awarded an ERC Starting Grant.

SEMI’s new interactive mobile fab forecast: SEMI FabView

09/13/2016  SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts.

Silicon nanoparticles instead of expensive semiconductors

09/12/2016  Within an international collaboration, physicists of the Moscow State University replace expensive semiconductors with affordable silicon nanoparticles for display production.

Fab equipment spending ascending

09/08/2016  Expect 4% growth (YoY) for 2016 and 11% for 2017

Super cement's secret

08/30/2016  Electron anions impart unconventional properties in a unique cement semiconductor for potentials uses in industrial catalysts and flat panel displays.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

Continuous roll-process technology for transferring and packaging flexible LSI

08/29/2016  A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has jointly developed a continuous roll-processing technology that transfers and packages flexible large-scale integrated circuits.

North American semiconductor equipment industry posts July 2016 book-to-bill ratio of 1.05

08/24/2016  North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July 2016 (three-month average basis) and a book-to-bill ratio of 1.05.

McMaster researchers resolve a problem that has been holding back a technological revolution

08/16/2016  Researchers at McMaster University have cleared that obstacle by developing a new way to purify carbon nanotubes -- the smaller, nimbler semiconductors that are expected to replace silicon within computer chips and a wide array of electronics.

Ensuring safety in the sub-fab

08/16/2016  Problems frequently arise as a result of an incomplete or absent formal risk assessment when processes are modified or new materials introduced.

Advanced materials manufacturer Pixelligent closes $10.4M in funding

08/15/2016  Pixelligent Technologies, a developer of high-index advanced materials for solid state lighting and display applications and producer of PixClear products, announced today that it closed $10.4 million in new funding.

Quantum dots with an impermeable shell

08/11/2016  Scientists from the Institute of Physical Chemistry of the Polish Academy of Sciences (IPC PAS) in Warsaw and the Faculty of Chemistry of the Warsaw University of Technology (FC WUT) have shown that zinc oxide (ZnO) quantum dots prepared by an original method developed by them, after modification by the click reaction with the participation of copper ions, fully retain their ability to emit light.

Towards a better screen

08/09/2016  New molecules promise cheaper, more efficient OLED displays.

Oversupply in global display market corrected, IHS Markit reports

08/03/2016  Because of seasonally very weak demand and the ramping of new capacity in China, flat-panel display (FPD) supply exceeded demand by 20 percent in the first quarter of 2016, the largest glut since early 2012.

Challenging the 'rigidity' for smart soft electronics

08/03/2016  Soft electronic devices, such as a smartphone on your wrist and a folding screen in your pocket, are looking to much improve your lifestyle in the not-too-distant future. That is, if we could find ways to make electronic devices out of soft organic materials instead of the existing rigid inorganic materials.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

TouchSystems announces new multi-touch display

08/01/2016  TouchSystems, a provider of professional-grade touch display and digital signage solutions, announced today the latest generation of its P-Series large format touch displays.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:

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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS