Displays

DISPLAYS ARTICLES



Global smartphone shipments decline for first time

05/02/2016  Global smartphone shipments fell 3 percent annually to reach 335 million units in Q1 2016. It is the first time ever in history the global smartphone market has shrunk on an annualized basis.

AMOLED growth is a bright spot for the display industry

04/28/2016  Active matrix organic light-emitting diode (AMOLED) displays are rising fast, thanks to lowering costs, wider use in end-market consumer electronics devices and the ramp-up of new manufacturing capacities.

Leti's CoolCube 3D Transistor Stacking Improves with Qualcomm Help

04/27/2016  Collaborating to build out design to fabrication ecosystem.

The human-machine interface: Automotive touch screens on the rise

04/25/2016  With consumers becoming increasingly comfortable using smartphones and tablet PCs, touch screens are now increasingly making their way into their vehicles, too.

Gigaphoton unveils "GIGANEX"

04/22/2016  Gigaphoton Inc., a major semiconductor lithography light source manufacturer, announced its new excimer laser brand “GIGANEX” on April 1, 2016.

With AMOLED shipments rising, Samsung Display led the small-medium display market in 2015

04/22/2016  Year-over-year unit-shipment growth in the small and medium display market was flat in 2015, reaching 2.8 billion units; revenue rose 4 percent over the previous year, to reach $43.9 billion.

As mobile phone market matures, display makers turn to in-cell and on-cell touch technologies for growth

04/22/2016  As the mobile phone market slows, display manufacturers are looking to new in-cell and on-cell touch-screen solutions that offer consumers thinner and brighter displays, while shortening the supply chain for smartphone manufacturers.

Slowing notebook PC replacement cycle leading to higher resolution displays

04/21/2016  The global notebook PC display market fell 23 percent year over year in the first quarter (Q1) of 2016.

EU regulation update: What could impact the industry next?

04/20/2016  In a global industry, monitoring regulatory developments across different regions can be a challenge.

UW-Madison engineers fabricate fastest flexible silicon transistor

04/20/2016  Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

Researchers develop new semiconducting polymer for forthcoming flexible electronics

04/20/2016  A joint research team has developed a new n-type semiconducting polymer with superior electron mobility and oxidative stability.

What screens are made of: New twists (and bends) in LCD research

04/18/2016  Using a pioneering X-ray technique developed at Berkeley Lab, a research team has recorded the first direct measurements confirming a tightly wound spiral molecular arrangement that could help unravel the mysteries of its formation and possibly improve LCD performance.

Extended supply chain presents exhibitors with new opportunities at SEMICON West

04/18/2016  Leading innovators in today's integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016 on July 12-14 in San Francisco, Calif.

Roll-to-Roll Coating Technology: It's a Different Ball of Wax

04/18/2016  Manufacturing flexible electronics and coatings for a variety of products has some similarities to semiconductor manufacturing and some substantial differences, principally roll-to-roll fabrication, as opposed to making chips on silicon wafers and other rigid substrates. This interview is with Neil Morrison, senior manager, Roll-to-Roll Coating Products Division, Applied Materials.

IEEE International Electron Devices Meeting announces 2016 Call for Papers

04/15/2016  The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

IoT Demands Part 2: Test and Packaging

04/15/2016  To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.

IoT Demands Part 1: EDA and Fab Nodes

04/14/2016  To meet the anticipated needs of the different IoT application spaces, SemiMD asked leading companies within critical industry segments about the state of technology preparedness.

Presto Engineering and Peraso Technologies Develop Innovative Test Solution for 60 GHz Transceiver

04/12/2016  Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, today jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.

Cadence to Acquire Rocketick

04/11/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd.

Mentor Graphics U2U Meeting April 26 in Santa Clara

04/11/2016  Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.




TWITTER


WEBCASTS



Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS