Displays

DISPLAYS ARTICLES



SEMICON Southeast Asia attendance surges on disruptive technology

04/25/2017  Today, SEMI announced that SEMICON Southeast Asia 2017 (SEMICON SEA 2017) is reporting an increase of up to 30 percent in attendees this year.

Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

04/24/2017  Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

New quantum liquid crystals may play role in future of computers

04/21/2017  New state of matter may have applications in ultrafast quantum computers.

Graphene Flagship researches create thin film transistors printed with layered materials

04/07/2017  Graphene Flagship researchers from AMBER at Trinity College Dublin have fabricated printed transistors consisting entirely of layered materials.

Spray-on memory could enable bendable digital storage

04/04/2017  Nanowire ink enables flexible, programmable electronics on materials like paper, plastic or fabric.

The ConFab preview

04/01/2017  The agenda is set for The ConFab, to be held May 14-17, 2017 in San Diego at the iconic Hotel del Coronado.

New ultrafast flexible and transparent memory devices could herald new era of electronics

03/31/2017  An innovative new technique to produce the quickest, smallest, highest-capacity memories for flexible and transparent applications could pave the way for a future golden age of electronics.

Revenues from flexible AMOLED display on pace to exceed rigid AMOLED panel in Q3 2017

03/28/2017  As demand for the flexible AMOLED display continues to sharply increase, its revenues are expected to reach $3.2 billion in the third quarter of 2017, exceeding that of rigid AMOLED panels at $3.0 billion, according to IHS Markit.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

Linde Invests Over EUR 110M in China to Strengthen Position as Supplier of Choice for Electronics Manufacturers

03/22/2017  Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million.

MicroLEDs for displays: How we can make it happen

03/22/2017  Many large companies and startups are currently working on microLED technologies for display applications: from LED makers such as Epistar, Nichia or Osram to display makers like AUO, BOE or CSOT and OEMs such as Apple or Facebook/Oculus.

Please, touch the display

03/20/2017  The possibilities for integrating haptics with displays are nearly limitless.

SEMI headquarters relocates

03/20/2017  SEMI today announced that it has moved its headquarters office to Milpitas, Calif.

Nano-polycrystalline film leads to stronger magnetism compared to single-crystal films

03/17/2017  Oxygen defects like nanopillars enhanced magnetic and magnetooptical response of STF films.

The ConFab 2017 announces leading semiconductor industry keynotes

03/14/2017  The ConFab announces keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

Simultaneous detection of multiple spin states in a single quantum dot

03/13/2017  Osaka University-based researchers simultaneously detect multiple spin states in a quantum dot in real time, holding great promise for quantum computing.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Kateeva expands Silicon Valley headquarters

03/08/2017  The company has leased an adjacent building at its Newark campus, adding 75,000 sq. ft. that is zoned for manufacturing and business operations.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

SEMI announces Japan's first flexible hybrid electronics conference

03/02/2017  Today, FlexTech, a SEMI Strategic Association Partner, announced the agenda for 2017FLEX Japan, the first flexible hybrid electronics (FHE) conference in Tokyo on April 11-12.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS