Displays

DISPLAYS ARTICLES



EU regulation update: What could impact the industry next?

04/20/2016  In a global industry, monitoring regulatory developments across different regions can be a challenge.

UW-Madison engineers fabricate fastest flexible silicon transistor

04/20/2016  Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

Researchers develop new semiconducting polymer for forthcoming flexible electronics

04/20/2016  A joint research team has developed a new n-type semiconducting polymer with superior electron mobility and oxidative stability.

What screens are made of: New twists (and bends) in LCD research

04/18/2016  Using a pioneering X-ray technique developed at Berkeley Lab, a research team has recorded the first direct measurements confirming a tightly wound spiral molecular arrangement that could help unravel the mysteries of its formation and possibly improve LCD performance.

Extended supply chain presents exhibitors with new opportunities at SEMICON West

04/18/2016  Leading innovators in today's integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016 on July 12-14 in San Francisco, Calif.

Roll-to-Roll Coating Technology: It's a Different Ball of Wax

04/18/2016  Manufacturing flexible electronics and coatings for a variety of products has some similarities to semiconductor manufacturing and some substantial differences, principally roll-to-roll fabrication, as opposed to making chips on silicon wafers and other rigid substrates. This interview is with Neil Morrison, senior manager, Roll-to-Roll Coating Products Division, Applied Materials.

IEEE International Electron Devices Meeting announces 2016 Call for Papers

04/15/2016  The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

IoT Demands Part 2: Test and Packaging

04/15/2016  To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.

IoT Demands Part 1: EDA and Fab Nodes

04/14/2016  To meet the anticipated needs of the different IoT application spaces, SemiMD asked leading companies within critical industry segments about the state of technology preparedness.

Presto Engineering and Peraso Technologies Develop Innovative Test Solution for 60 GHz Transceiver

04/12/2016  Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, today jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.

Cadence to Acquire Rocketick

04/11/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd.

Mentor Graphics U2U Meeting April 26 in Santa Clara

04/11/2016  Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.

The future is here: Interactive screens on your packages

04/08/2016  Instead of reading a label, consumers could be interacting with an electronic screen on packaging in the future, thanks to a revolutionary new development by scientists at the University of Sheffield.

Cadence and University of Oxford Foster the Advancement of Formal Verification Innovation

04/07/2016  Cadence Design Systems, Inc. and the University of Oxford today announced a move to foster the advancement of formal verification innovation with the appointment of Dr. Ziyad Hanna, Cadence vice president of R&D, as a visiting professor in Oxford's Department of Computer Science for the next three years.

SIA's VP of Global Policy to address China's new role in the semiconductor industry at The ConFab 2016

04/06/2016  Solid State Technology is pleased to announced that Jimmy Goodrich of the Semiconductor Industry Association is the latest distinguished guest confirmed to speak at The ConFab 2016.

Update on neon shortage 2016 highlighted at the Critical Materials Conference

04/04/2016  Communication with suppliers in the Ukraine and China have continued to verify expected shortages occurring toward the end of 2016. Although supply appears stable now, inventories purchased during the second half of 2015 will deplete inventories on the supplier side toward the end of this year.

Synopsys Debuts Tools at Users Group Meeting

03/30/2016  Aart de Geus, the chairman and co-chief executive officer of Synopsys, used his keynote address at the 2016 Synopsys Users Group conference in Silicon Valley to tout a pair of new products.

Effective graphene doping depends on substrate material

03/29/2016  Juelich physicists have discovered unexpected effects in doped graphene - i.e. graphene that is mixed with foreign atoms.

Growth returns to India's LCD TV market, as other emerging nations falter

03/28/2016  Positive growth returned to India’s liquid crystal display (LCD) TV market in the fourth quarter (Q4) of 2015, after the industry posted declines in the second quarter (Q2) and no growth in the third quarter (Q3).

MagnaChip surpasses 6M display driver ICs shipped

03/28/2016  MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that its cumulative shipment of display driver ICs for organic light-emitting diode (OLED) TVs has surpassed the 6 million cumulative unit mark since initial shipments began in 2013.




TWITTER


WEBCASTS



High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS