Displays

DISPLAYS ARTICLES



Sapphire display covers featured in Apple smart watches but not in iPhone 6

09/11/2014  The long wait is finally over. From a sapphire industry standpoint, Apple killed the suspense within the first 10 minutes by announcing that its new 4.7” and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover.

Outlook: Healthy equipment spending into 2015

09/10/2014  The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Equipment spending shows strong growth for 2014 and 2015

09/10/2014  Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

A fundamental truth of process control

09/09/2014  You can’t fix what you can’t find. You can’t control what you can’t measure.

Research Alert: September 9, 2014

09/09/2014  GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students; Layered graphene sandwich for next generation electronics; Doped graphene nanoribbons with potential

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

09/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

10nm success depends on concurrent design and development

09/08/2014  The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

The Week in Review: September 5, 2014

09/05/2014  New non-volatile memory technology; President and CEO of FSA announced; Samsung to use ProPlus 14nm finFET SPICE modeling platform; MEMS gyroscope from Analog Devices; SEMICON Taiwan held this week

NVIDIA files complaints against Samsung and Qualcomm

09/05/2014  NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

Research Alert: September 3, 2014

09/03/2014  A new, tunable device for spintronics; Copper shines as flexible conductor; Competition for graphene

Intel Announces “New Interconnect” for 14nm

09/02/2014  Intel has just announced that “Embedded Multi-die Interconnect Bridge (EMIB”) packaging technology will be available to 14nm foundry customers.

The Week in Review: August 29, 2014

08/29/2014  Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu's new foundry company; Thinnest-possible semiconductor; SEMI announces keynotes for Vietnam Semiconductor Strategy Summit

Copper shines as flexible conductor

08/29/2014  Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

Lithography: What are the alternatives to EUV?

08/28/2014  Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

08/28/2014  SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

Plastic electronics: Opportunity on the edge of commercialization

08/27/2014  The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October.

In rapidly changing display industry, metal oxide TFT backplanes are promising

08/26/2014  MarketResearchReports.Biz released a new market research report this week entitled "Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players."

ESI appoints new board member

08/25/2014  Electro Scientific Industries, Inc., a supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Richard H. Wills, former Chairman and Chief Executive Officer of Tektronix, Inc., was appointed to the company’s Board of Directors.

The Week in Review: August 22, 2014

08/22/2014  Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

08/19/2014  Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Interconnects

Nov. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

More Webcasts

VIDEOS