Displays

DISPLAYS ARTICLES



With AMOLED on the rise, full high definition screens proliferate further in third quarter 2015

12/23/2015  Full high-definition (FHD) panels reached a record 21 percent of the smartphone display market in the third quarter (Q3) of 2015, due in large part to increases in active-matrix organic light-emitting diode (AMOLED) panel adoption by Samsung and others.

Apple products spur growth in force sensing display technologies

12/23/2015  Apple’s use of Force Touch technology in the Apple Watch and 3D Touch in the iPhone 6S line is leading to growth in force sensing and other touch-panel enhancements in mobile devices.

Startup Works on Ultralow-k Materials for Chips, Displays

12/21/2015  The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

3D ASIP Conference Hears from EDA, IC Gear Companies

12/18/2015  John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

Packaging Conference Addresses Challenges, Opportunities in New Technologies

12/18/2015  On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.

Conference Features "The Year of Stacked Memory" in 2015

12/17/2015  The theme of this year's 3D Architectures for Semiconductor Integration and Packading (3D ASIP) conference is "The Year of Stacked Memory," noting how memory die stacked in one package are becoming more commonplace in 2015.

Semiconductor equipment sales forecast: $37B in 2015 and $38B in 2016

12/15/2015  SEMI projects that worldwide sales of new semiconductor manufacturing equipment will decrease 0.6 percent to $37.3 billion in 2015.

Leti to demonstrate three consumer technology breakthroughs at CES 2016

12/15/2015  CEA-Leti, an applied-research institute for microelectronics, will demonstrate at CES 2016 three disruptive innovations, ranging from ultra-high-brightness, augmented-reality glasses to extremely high-speed wireless data transmission between mobile devices, and the world’s first TV white-space modem limiting interference in adjacent spectrum bands.

SEMICON Japan 2015 opens tomorrow at Tokyo Big Sight

12/14/2015  SEMICON Japan 2015, an exhibition in Asia for semiconductor manufacturing and related processing technology, opens tomorrow at Tokyo Big Sight.

China Bolsters its IC Gear Business with Mattson Acquisition

12/10/2015  Mattson Technology agreed this month to be acquired by Beijing E-Town Dragon Semiconductor Industry Investment Center, a limited partnership in China, for about $300 million in cash.

Fab equipment spending: Look for upward swing into 2016

12/09/2015  Worldwide semiconductor fab equipment capital expenditure growth (new and used) for 2015 is expected to be 0.5 percent (total capex of US$35.8 billion), increasing another 2.6 percent (to a total of $36.7 billion) in 2016, according to the latest update of the quarterly SEMI World Fab Forecast report.

Smart Rock Bolt Wins Prize at Designers of Things Conference

12/07/2015  When it comes to Internet of Things products, most people would think of the Apple Watch or Fitbit fitness-tracking devices. A device aimed at the mining industry has proved to be a popular entry at the Designers of Things conference in San Jose, Calif.

Nanoscale drawbridges open path to color displays

12/04/2015  A new method for building "drawbridges" between metal nanoparticles may allow electronics makers to build full-color displays using light-scattering nanoparticles that are similar to the gold materials that medieval artisans used to create red stained-glass.

Penn researchers make thinnest plates that can be picked up by hand

12/04/2015  Despite being thousands of times thinner than a sheet of paper and hundreds of times thinner than household cling wrap or aluminum foil, their corrugated plates of aluminum oxide spring back to their original shape after being bent and twisted.

Photonic 'sintering' may create new solar, electronics manufacturing technologies

12/03/2015  Engineers at Oregon State University have made a fundamental breakthrough in understanding the physics of photonic "sintering," which could lead to many new advances in solar cells, flexible electronics, various types of sensors and other high-tech products printed onto something as simple as a sheet of paper or plastic.

SEMI Foundation appoints Leslie Tugman as Executive Director

12/02/2015  SEMI Foundation, created by global industry association SEMI to support education and career awareness in the field of high-tech, has announced the appointment of Leslie Tugman as its executive director.

Measuring 5nm Particles In-Line

11/30/2015  ITRI and TSMC co-develop aerosol method to monitor liquids and slurries.

Tallness Makes Reliable Spindt Tip Cold Cathodes

11/30/2015  Vacuum nanowire arrays of cold cathodes for high frequency sources and amplifiers

Led by Apple and Chinese brands, high tech smartphone panel shipments rising

11/24/2015  Demand for LTPS TFT LCD shipments rose 30 percent in September 2015 to reach 51.6 million units, due to strong demand from Apple and Chinese brands.

2015 large area display shipment unit decline offset by increase in shipment area

11/24/2015  While unit shipments are forecast to fall 5 percent this year, total shipment area is expected to rise 5 percent.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016