Displays

DISPLAYS ARTICLES



Bending -- but not breaking -- in search of new materials

11/12/2014  Researchers at Drexel University and Dalian University of Technology in China have chemically engineered a new, electrically conductive nanomaterial that is flexible enough to fold, but strong enough to support many times its own weight.

Freescale wearable technology selected as 2015 CES Innovation Awards honoree

11/12/2014  Freescale Semiconductor has been named a 2015 CES Innovation Awards Honoree for its Wearable Reference Platform (WaRP).

Slight increase in third quarter 2014 silicon wafer shipments

11/12/2014  Worldwide silicon wafer area shipments increased during the third quarter 2014 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Double-digit growth: Record sales to shake up Top 20 semi supplier ranking

11/10/2014  TSMC, MediaTek, and SK Hynix’s sales are each expected to jump by >20% this year.

ORNL thermomagnetic processing method provides path to new materials

11/06/2014  For much the same reason LCD televisions offer eye-popping performance, a thermomagnetic processing method developed at the Department of Energy’s Oak Ridge National Laboratory can advance the performance of polymers.

Clearing a path for electrons in polymers: Closing in on the speed limits

11/05/2014  Researchers from the University of Cambridge have identified a class of low-cost, easily-processed semiconducting polymers which, despite their seemingly disorganised internal structure, can transport electrons as efficiently as expensive crystalline inorganic semiconductors.

Crocus MLU sensors aim to put more 'flex' into flexible displays

11/05/2014  Crocus Technology, a provider of magnetically enhanced semiconductor technologies and products, today announces a new Magnetic Logic Unit (MLU) based solution that can detect the position and shape of flexible two dimensional surfaces.

Trans-Lux introduces TL Vision court side LED displays

11/05/2014  Trans-Lux Corporation has released a new series of modular court side LED displays under its premier TL Vision brand.

Better bomb-sniffing technology

11/04/2014  University of Utah engineers have developed a new type of carbon nanotube material for handheld sensors that will be quicker and better at sniffing out explosives, deadly gases and illegal drugs.

Rice chemists gain edge in next-generation energy

11/04/2014  Rice University scientists who want to gain an edge in energy production and storage report they have found it in molybdenum disulfide.

Global semiconductor industry posts highest-ever quarterly sales

11/03/2014  Global sales for the month of September 2014 reached $29 billion, 8 percent higher than the September 2013 total of $26.9 billion and 1.9 percent more than last month's total of $28.5 billion.

Experts at the Table: Focus on Semiconductor Materials

11/03/2014  The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde Electronics; Kate Wilson of Edwards Vacuum; David Thompson of Applied Materials; and Ed Shober of Air Products and Chemicals.

Air-gaps in Copper Interconnects for Logic

10/31/2014  Intel’s “14nm-node” process uses air-gaps in dielectrics; direction disclosed four years ago.

SEMI extends ASMC Call for Papers deadline to November 10

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

New 3D display technology promises greater energy efficiency

10/23/2014  LCD technology developed in Hong Kong maintains the 3D images it displays without drawing power.

Semiconductor equipment book-to-bill declines in September

10/21/2014  While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

Growing momentum in semiconductor manufacturing in Vietnam

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Intermolecular appoints Dr. Bruce McWilliams as President and CEO

10/16/2014  Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

Deeper Dive -- Mentor Graphics Looks to the Future

10/14/2014  There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

Printing in the hobby room: Paper-thin and touch-sensitive displays on various materials

10/13/2014  What if you could integrate paper-thin displays into the cards, which could be printed at home and which would be able to depict self-created symbols or even react to touch? Those only some of the options computer scientists in Saarbrücken can offer.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Extending Moore's Law

January 2015 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2015 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015