3D-Micromac, TDMDA, and MOS Technology host International Laser and Coating Symposium 2018

01/22/2018  Experts in the field of display fabrication to meet in Hsinchu, Taiwan on February 1 to discuss business opportunities and new manufacturing trends for advanced displays.

Value of semiconductor industry M&A deals slows dramatically in 2017

01/18/2018  Numerous smaller deals were made but "megadeals" were scarce last year.

LCD TV panel demand expected to go through a correction in first quarter of 2018

01/18/2018  Demand for liquid crystal display (LCD) panels from South Korean and Chinese TV makers was strong in the fourth quarter of 2017, but implementation of their panel purchasing strategies for the first quarter of 2018 may result in a correction as demand expectations change.

2018FLEX highlights opportunities, advances in flexible hybrid electronics

01/18/2018  2018FLEX, the Flexible Hybrid Electronics (FHE) Conference and Exhibition, will bring together more than 600 experts from around the world for business-critical insights and the latest technology in both flexible electronics and MEMS and sensors.

2018 will see first uses of 8K resolution display

01/16/2018  As the demand for super-large TV displays grow, the need for higher resolution is set to increase, seeing the first uses of 8K display in 2018, according to IHS Markit.

Nanostructured gate dielectric boosts stability of organic thin-film transistors

01/16/2018  A nanostructured gate dielectric may have addressed the most significant obstacle to expanding the use of organic semiconductors for thin-film transistors.

Advancing the path to organic electronics beyond cell phone screens

01/12/2018  A discovery by an international team of researchers from Princeton University, the Georgia Institute of Technology and Humboldt University in Berlin points the way to more widespread use of an advanced technology generally known as organic electronics.

Worldwide PC shipments declined 2% in 4Q17 and 2.8% for the year

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

Semtech appoints Chris Chang to executive management team

01/09/2018  Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, today announced Chris Chang has joined the Company as Senior Vice President, Corporate Marketing and Business Development.

Record number of OLED TVs shipped before the holidays

01/09/2018  With consumer television prices falling, global shipments of organic light-emitting diode (OLED) TVs grew 133 percent year over year, reaching a new monthly record of 270,000 units in November 2017, during the lead-up to the holiday shopping season.

SEMI and Fab Owners Association strengthen supply chain

01/08/2018  With integration complete, FOA is managed as a Special Interest Group (SIG) within SEMI. FOA member companies will become full SEMI members, with FOA continuing to expand its global membership through SEMI's global network, while maintaining its unique community.

IHS Markit identifies the top eight technology trends for 2018

01/04/2018  From the Internet of Things to the cloud to artificial intelligence, industries are seeing a new wave of technologies that have the potential to transform and significantly impact the world around us.

New Vivid Color HDR technology, for thinner, brighter, more colorful experience

01/03/2018  An alternative for power-efficient portable HDR displays, in Notebook, Tablet, SmartPhone, Monitor, TV, AR, and VR applications.

Largest SEMICON China ever targets industry growth

12/19/2017  More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate already strong industry growth.

Gen 10 and larger flat panel display capacity to grow at 59% CAGR to 2022

12/08/2017  Gen 10 and larger fabs to account for 26 percent of large-area capacity by 2020 from 4 percent in 2017.

How to tame the electromagnetic interference in the fabs and beyond

12/07/2017  Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.

Global semiconductor sales increase 21.9% year-to-year in October

12/05/2017  October marked the global industry's largest-ever monthly sales total.

SEMI-FlexTech Committee in China kicks off to drive global exchange and collaboration

12/04/2017  On October 27, SEMI China held a kickoff meeting for a new FlexTech Committee in Suzhou. FlexTech, a SEMI Strategic Association Partner, is devoted to fostering the growth, profitability and success of the flexible and printed electronics supply chain, and enabling the many smart products enabled by this new class of electronic intelligence.

Clear leads to fully transparent devices

12/04/2017  See-through electronic devices, such as transparent displays, smart windows and concealed circuits require completely translucent components if users are to digitally interact with their perceived surroundings and manipulate this information in real time. Now, KAUST researchers have devised a strategy that helps to integrate transparent conducting metal-oxide contacts with two-dimensional (2D) semiconductors into these devices.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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