Displays

DISPLAYS ARTICLES



Costs of 55-inch OLED TV display production catch up to LCD TV panels

11/03/2017  Unit cost for 55-inch UHD OLED TV panels recorded a 55 percent decline in second quarter of 2017 since its introduction in early 2015.

IPS display adoption in notebook PCs continues to increase

11/01/2017  IPS to make up 37 percent of all notebook PC panels shipped in 2017 and 42 percent in 2018, up from 27 percent in 2016.

Veeco and ALLOS demonstrate 200mm GaN-on-Si performance to enable micro-LED adoption

11/01/2017  Veeco Instruments Inc. (Nasdaq: VECO) announced today the completion of a strategic initiative with ALLOS Semiconductors (ALLOS) to demonstrate 200mm GaN-on-Si wafers for Blue/Green micro-LED production.

Quantum dots visualize tiny vibrational resonances

10/30/2017  Innovative device could lead to the development of new sensing technologies.

TowerJazz and Yuanchen Microelectronics announce partnership for BSI manufacturing

10/30/2017  This is the first time BSI will be offered by a foundry to the high-end photography market, including large formats requiring stitching.

NXP unveils breakthrough tech for payment cards

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

Global AMOLED panel production capacity set to more than quadruple over next five years

10/27/2017  Samsung Display and LG Display to remain as market leaders.

Researchers look to patterns to envision new engineering field

10/27/2017  The phenomenon that forms interference patterns on television displays when a camera focuses on a pattern like a person wearing stripes has inspired a new way to conceptualize electronic devices. Researchers at the University of Illinois are showing how the atomic-scale version of this phenomenon may hold the secrets to help advance electronics design to the limits of size and speed.

China's first Gen6 flexible AMOLED production line put into mass production

10/26/2017  On October 26, China's first Gen6 flexible AMOLED line - BOE Chengdu Gen6 flexible AMOLED production line has put into mass production in advance.

NVIDIA, Taiwan's Ministry of Science and Technology to accelerate Taiwan AI revolution with NVIDIA AI computing platform

10/26/2017  NVIDIA today announced that it is collaborating with Taiwan's Ministry of Science and Technology (MOST) to accelerate the development of artificial intelligence across Taiwan's commercial sector in support of its recently announced AI Grand Plan to help foster domestic AI-related industries.

Sussex physicists have breakthrough on brittle smart phone screens

10/25/2017  New 'potato stamp' technique combining silver and graphene may create cheaper, more flexible and eco-friendly screens.

SEMICON Japan brings smart applications and IoT

10/25/2017  Over 30,000 attendees are expected to convene at SEMICON Japan at Tokyo Big Sight in Tokyo on December 13-15.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

Wafer shipments forecast to increase in 2017, 2018 and 2019

10/17/2017  Total wafer shipments this year are expected to exceed the market high set in 2016 and are forecast to continue shipping at record levels in 2018 and 2019.

Sun Chemical enters into license agreement to introduce new screen printable molecular inks

10/12/2017  Sun Chemical has entered into a license agreement to introduce a new family of molecular inks for the printed electronics market with Groupe Graham International (GGI).

Gartner identifies the top 10 strategic technology trends for 2018

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

Flexible display shipments will increase to 643M units annually by 2022

10/04/2017  In 2017, key flexible display components achieved cost and performance parity with their rigid counterparts for the first time, thus removing a key market barrier and opening the door to rapid adoption in a variety of otherwise-rigid devices such as e-readers and wearables.

Team builds flexible new platform for high-performance electronics

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

Extra sulphur improves electronic structure of quantum dots

10/02/2017  Quantum dots are nanometre-sized semiconductor particles with potential applications in solar cells and electronics. Scientists from the University of Groningen and their colleagues from ETH Zürich have now discovered how to increase the efficiency of charge conductivity in lead-sulphur quantum dots.

SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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VIDEOS