Displays

DISPLAYS ARTICLES



IoT Planet to co-locate with SEMICON Europa in 2016

03/09/2016  IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.

Declining flat panel display revenue to reach lowest level since 2012

03/08/2016  Global flat panel display (FPD) market revenue is expected to shrink by 6 percent year over year in 2016 to $120 billion.

Many Mixes to Match Litho Apps

03/03/2016  "Mix and Match" has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing.

Inventory adjustments causing TV and IT display shipments to decline in Q1 2016

03/02/2016  LCD manufacturer inventory adjustments and continued slowing demand are causing TV and IT display prices to fall, further eroding panel makers’ profitability.

Mentor Graphics expands Mentor Embedded Linux support

03/01/2016  Mentor Graphics Corporation today announced the availability of new expanded processor support.

Lifetime breakthrough promising for low-cost and efficient OLED displays and lights

03/01/2016  Researchers increased the device lifetime of OLEDs that use a recently developed class of molecules to convert electricity into light.

Microchip announces kit for integrated 2D projected capacitive touch, 3D gestures on displays

02/29/2016  Microchip Technology Inc. today announced the industry's first development kit for integrated 2D projective capacitive touch and 3D gesture recognition on displays.

Wearable device display unit shipments to hit $39M by 2016

02/26/2016  The growing popularity of wearable applications is driving up shipments of the displays used in these devices.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

New molecular property may mean more efficient solar and opto-electronic devices

02/25/2016  Scientists at the University of Massachusetts Amherst identified an unexpected property in an organic semiconductor molecule that could lead to more efficient and cost-effective materials for use in displays.

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

Call for Papers open for SEMICON Europa 2016 and 2016FLEX Europe

02/24/2016  SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2016 which takes place 25-27 October in Grenoble, France.

Applied Materials' Robert Visser honored by Society of Information Display

02/24/2016  Applied Materials, Inc. today announced that Dr. Robert Visser has received a 2016 Special Recognition Award from the Society of Information Display.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

Gartner says worldwide smartphone sales grew 9.7% in fourth quarter of 2015

02/22/2016  Global smartphone sales exhibited slowest growth since 2008; iPhone sales declined for the first time.

Neon shortage coming

02/18/2016  Semiconductor lithographic use of Neon is increasing more rapidly than expected for several reasons including the delay of EUVL while demand for finer line width patterning is increasing.

Flat panel display equipment spending to reach to $11.2B by 2016

02/18/2016  Flat-panel display (FPD) equipment spending this year will reach its highest level since 2011, according to IHS Inc.

Seeing the future in flexible AMOLED displays, manufacturers expand production capacity in 2016

02/18/2016  With the growing popularity of the Samsung Galaxy Edge series and the Apple Watch, display manufacturers are expanding their production capacity of flexible AMOLED displays.




TWITTER


WEBCASTS



Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS