TSMC commits to two tools for delivery next year
Maybe, just maybe, ASML Holding N.V. (ASML) has made the near-impossible a reality by creating a cost-effective Extreme Ultra-Violet (EUV @ ~13.5nm wavelength) all-reflective lithographic tool. The company has announced that Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has ordered two NXE:3350B EUV systems for delivery in 2015 with the intention to use those systems in production. In addition, two NXE:3300B systems already delivered to TSMC will be upgraded to NXE:3350B performance. While costs and throughputs are conspicuously not-mentioned, this is still an important step for the industry.
Perhaps acquiring Cymer to get the source-technology in-house for tighter integration was important. Perhaps evolutionary improvements crept along by tough engineering rigor. Perhaps the industry got lucky. One way or the other, ASML has had the goal of delivering not just hardware but functional uptime/availability using very complex EUV technology, and now it seems to be on the cusp of making it happen. The company claims that current EUV tools are available 50% of the time, at unspecified source power levels.
At its Investor Day in London today, ASML outlined its expected opportunity to grow net sales to about EUR 10 billion and to triple earnings per share by 2020, an indication of the confidence the company has in its technology and employees. Much of the growth will be in Deep-UV immersion tools, and in so-called “Holistic Lithography” products to deliver advanced correction capabilities. An example of Holistic Litho is Source-Mask-Optimization (SMO) that can be used for triple-patterning of a 48nm minimum pitch metal layer using DUV immersion in a Litho-Etch-Litho-Etch-Litho-Etch (LELELE) flow, such that the Depth-of-Focus (DoF) can be increased from 70 to 86nm. Holistic EUV means that SMO can reduce the dose required to get 120nm DoF from 46 to 20 mJ/cm2 for a 45nm minimum pitch metal layer.
The presentations can be found at the company’s website.
— E. K.