Flexible Displays

MAGAZINE



FLEXIBLE DISPLAYS ARTICLES



Driven by size migration and high-end products, large TFT display market continued to grow in 2017

02/16/2018  Despite slower demand from end market and panel price erosion, the large thin-film transistor (TFT) display market expanded in 2017 in all three aspects -- unit shipments, area shipments and revenue.

2018 FLEXI awards innovation and leadership in flexible hybrid electronics

02/13/2018  The 2018 FLEXI Awards today recognized groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in 2017.

Chinese panel makers catching up fast in LTPS LCD panel shipments for mobile phones

02/12/2018  Total shipments of mobile phone displays, including thin-film transistor liquid crystal display (TFT LCD) and active matrix organic light-emitting diode (AMOLED) panels, reached 2.01 billion units in 2017, up 3 percent from 2016.

MicroLED displays: the patent landscape reflects the dynamism of the sector

01/31/2018  This year again, the Las Vegas Consumer Electronics Show, 2018 edition allowed us to discover the latest innovations in numerous fields including the microLED displays sector.

Kateeva appoints Marc Haugen as Chief Operating Officer

01/30/2018  Kateeva, a developer of inkjet deposition equipment solutions for OLED display manufacturing, today announced that the company has expanded its executive team by appointing Marc Haugen as chief operating officer (COO).

Turbulent times ahead for trade

01/25/2018  International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion.

2018FLEX highlights opportunities, advances in flexible hybrid electronics

01/18/2018  2018FLEX, the Flexible Hybrid Electronics (FHE) Conference and Exhibition, will bring together more than 600 experts from around the world for business-critical insights and the latest technology in both flexible electronics and MEMS and sensors.

Nanostructured gate dielectric boosts stability of organic thin-film transistors

01/16/2018  A nanostructured gate dielectric may have addressed the most significant obstacle to expanding the use of organic semiconductors for thin-film transistors.

Advancing the path to organic electronics beyond cell phone screens

01/12/2018  A discovery by an international team of researchers from Princeton University, the Georgia Institute of Technology and Humboldt University in Berlin points the way to more widespread use of an advanced technology generally known as organic electronics.

SEMI-FlexTech Committee in China kicks off to drive global exchange and collaboration

12/04/2017  On October 27, SEMI China held a kickoff meeting for a new FlexTech Committee in Suzhou. FlexTech, a SEMI Strategic Association Partner, is devoted to fostering the growth, profitability and success of the flexible and printed electronics supply chain, and enabling the many smart products enabled by this new class of electronic intelligence.

Kateeva introduces the YIELDjet EXPLORE product family for OLED RGB pixel deposition

11/28/2017  Suite of inkjet deposition systems to enable R&D and pilot production of large-size OLED displays

Kateeva names Dr. Homer Antoniadis as Executive Vice President of Technology

11/17/2017  Kateeva, a developer of OLED production equipment solutions, today appointed Dr. Homer Antoniadis to the newly created role of Executive Vice President of Technology.

Flexible AMOLED panel supply capacity to exceed demand by 44% in 2018

11/16/2017  With flexible active-matrix organic light-emitting diode (AMOLED) panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44 percent higher than global demand in 2018, according to IHS Markit.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018


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VIDEOS