Flexible Displays



2015 large area display shipment unit decline offset by increase in shipment area

11/24/2015  While unit shipments are forecast to fall 5 percent this year, total shipment area is expected to rise 5 percent.

Highlights from Day 1 of IDTechEx Printed Electronics USA 2015

11/19/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

China to dominate flat panel display manufacturing by 2018, says IHS

11/13/2015  While conventional thin film transistor liquid crystal (TFT LCD) displays are rapidly trending towards commoditization and currently suffering from declining prices and margins, China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.

Printing & vacuum deposition: Competing for market share in the flexible electronics sector

11/13/2015  Flexible electronic devices are starting to experience significant proliferation, with more and more devices with innovative form factors being brought to market, from small components such as disposable sensors that have been in the market for quite some time now, all the way to new flexible smart phones currently being demonstrated by consumer electronics giants like Samsung and LG.

Xaar and Lawter collaborate to deliver nanoink printing

11/10/2015  Xaar plc and Lawter announced a collaboration to optimize the performance of a line of nanosilver conductive inks in the Xaar 1002 industrial inkjet printhead.

Advance could bring commercial applications for silver nanowires

11/10/2015  New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

China to dominate flat panel display manufacturing by 2018, IHS

11/05/2015  China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.

FlexEnable spearheads breakthrough in flexible electronics

10/14/2015  FlexEnable has successfully validated a new class of high performance organic semiconductors in a million pound project funded by Innovate UK.

UK collaboration seeks to develop new ultra-barrier materials based on Graphene interlayers

10/12/2015  The Centre of Process Innovation (CPI) has announced that it is part of a UK based collaboration to develop the next generation of ultra-barrier materials using graphene for the production of flexible transparent plastic electronic based displays.

SEMI announces FlexTech Alliance as first Strategic Association Partner

10/07/2015  SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner.





Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015