07/10/2014 A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.
07/08/2014 In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.
06/22/2014 Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.
06/04/2014 Yesterday, the Society for Information Display (SID) unveiled the winners of its prestigious 19th annual Display Industry Awards.
06/04/2014 Samsung Display announced today that it won the Gold Display of the Year Award with the world's first 5.68-inch curved super AMOLED display panel at the Society for Information Display’s (SID) Display Week 2014 being held in the San Diego Convention Center June 3-5.
03/25/2014 Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes?
11/26/2013 University of Illinois researchers have developed a way to heal gaps in wires too small for even the world’s tiniest soldering iron.
11/07/2013 The display industry has developed towards in realizing large-screen and high quality image so far. But in the future, the development directions would go toward the reasonably priced flexible displays.
09/26/2013 Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.
09/24/2013 A better understanding of the conductive properties of flexible semiconductors will aid in the development of bendable electronics.
09/11/2013 Following Samsung’s introduction of the first flexible organic light-emitting diode (OLED) products this year, demand for these elastic displays is expected to grow by more than a factor of four next year, with sales reaching nearly $100 million in 2014.
09/10/2013 Electronic devices with touchscreens are ubiquitous, and one key piece of technology makes them possible: transparent conductors. However, the cost and the physical limitations of the material these conductors are usually made of are hampering progress toward flexible touchscreen devices.
After experiencing runaway growth in recent years, the OLED display market is gearing up to make another big leap.
Whereas the current display industry has developed its technology and products centered on scaling-up to large sizes and realizing high-resolution images, the future industry development direction is expected to focus on flexible displays.
ISORG and Plastic Logic have co-developed the first conformable organic image sensor on plastic, with the potential to revolutionize weight/power trade-offs and optical design parameters for any systems with a digital imaging element.
Demand for flexible displays is set to undergo massive growth during the next seven years, with a broad variety of applications—ranging from smartphones to giant screens mounted on buildings—driving a nearly 250 times expansion in shipments from 2013 through 2020.
Transparent electrodes refer to oxide degenerate semiconductor electrodes that possess a high level of light transmittance (more than 85 percent) in the visible light spectrum, and low resistivity (less than 1×10-3 Ω-㎝) at the same time.
A new report from IHS Displaybank analyzes the scope of the flexible OLED patents issued.
The diffusion of roll-to-roll technologies is expected to have a marked effect in lowering the unit prices of flexible devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately.
Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing.
This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment.
May 22, 2014Sponsored by Diamond-MT
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014Sponsored by Master Bond, Inc.,
Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014Sponsored by Mentor Graphics
July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.
July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.
August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.