Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

09/26/2014  Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

Flexible LEDs

09/24/2014  Flexible light-emitting diode (LED) displays and solar cells crafted with inorganic compound semiconductor micro-rods are moving one step closer to reality, thanks to graphene and the work of a team of researchers in Korea.

Future flexible electronics based on carbon nanotubes

09/24/2014  Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

Toward optical chips

09/19/2014  A promising light source for optoelectronic chips can be tuned to different frequencies.

Copper shines as flexible conductor

08/29/2014  Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

In rapidly changing display industry, metal oxide TFT backplanes are promising

08/26/2014  MarketResearchReports.Biz released a new market research report this week entitled "Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players."

FlexTech Alliance announces 2015FLEX conference theme, Call for Papers and advisory committee

08/12/2014  FlexTech Alliance announced the conference theme, Call for Papers, and the industry chairs for the 14th Annual Flexible & Printed Electronics Conference & Exhibition -- 2015FLEX -- set for February 23 – 26, 2015 at the Monterey Conference Center, Monterey, California.

A cool approach to flexible electronics

07/10/2014  A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.

Printed, flexible, and organic electronics: A growing opportunity

07/08/2014  In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.

Flexible glass firms branch into new applications

06/22/2014  Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.

SID announces winners of 2014 Display Industry Awards

06/04/2014  Yesterday, the Society for Information Display (SID) unveiled the winners of its prestigious 19th annual Display Industry Awards.

Samsung Display recognized for flexible display technology at Display Week 2014

06/04/2014  Samsung Display announced today that it won the Gold Display of the Year Award with the world's first 5.68-inch curved super AMOLED display panel at the Society for Information Display’s (SID) Display Week 2014 being held in the San Diego Convention Center June 3-5.

Flat panel displays get flexible

03/25/2014  Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes?

Nanotubes can solder themselves, markedly improving device performance

11/26/2013  University of Illinois researchers have developed a way to heal gaps in wires too small for even the world’s tiniest soldering iron.

Flexible display market to reach $67.7 billion by 2023

11/07/2013  The display industry has developed towards in realizing large-screen and high quality image so far. But in the future, the development directions would go toward the reasonably priced flexible displays.

A new photoresist technology for organic semiconductors enabling submicron patterns

09/26/2013  Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.

Stanford scientists publish theory, formula to improve 'plastic' semiconductors

09/24/2013  A better understanding of the conductive properties of flexible semiconductors will aid in the development of bendable electronics.

Flexible OLED market to rise to $100 million in 2014

09/11/2013  Following Samsung’s introduction of the first flexible organic light-emitting diode (OLED) products this year, demand for these elastic displays is expected to grow by more than a factor of four next year, with sales reaching nearly $100 million in 2014.
 


University of Pennsylvania develops computer model that will help design flexible touchscreens

09/10/2013  Electronic devices with touchscreens are ubiquitous, and one key piece of technology makes them possible: transparent conductors. However, the cost and the physical limitations of the material these conductors are usually made of are hampering progress toward flexible touchscreen devices.

The flexible OLED sector grows slower than expected

08/27/2013 

After experiencing runaway growth in recent years, the OLED display market is gearing up to make another big leap.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

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WEBCASTS



Advanced Packaging

Oct. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

Oct. 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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