Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Graphene flexes its electronic muscles

07/01/2015  Flexing graphene may be the most basic way to control its electrical properties, according to calculations by theoretical physicists at Rice University and in Russia.

EMC2015 - New Devices, Old Tricks

06/30/2015  The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into the process-structure-properties relationships of electronic devices now running in high-volume manufacturing (HVM) lines globally.

The peaks and valleys of silicon

06/29/2015  When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.

Solid State Watch: June 19-25, 2015

06/26/2015  IHS says Moore’s Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting record sales in 2015; Nanowires could be the LEDs of the future

Breaking Down Power Management Verification

06/22/2015  During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

3DIC Technology Drivers and Roadmaps

06/22/2015  Circuit performance and silicon area improvements seen in new die stacks.

Researchers create transparent, stretchable conductors using nano-accordion structure

06/18/2015  Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

Optimized printing process enables custom organic electronics

06/16/2015  They are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printed microelectronic components made of synthetics. Flexible displays and touch screens, glowing films, RFID tags and solar cells represent a future market.

4K TV panel shipments reached a monthly record of 3M units in April 2015

06/15/2015  Of all TV panels expected to ship in 2016, one in five is forecast to be 4K TV.

A KAIST research team develops the first flexible phase-change random access memory

06/15/2015  Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

Going organic: The cost-down route to foldable display manufacture

06/09/2015  Organic semiconductors now offer the performance, cost and route to adoption, for foldable displays; from ultra-thin, conformal, wearables to truly foldable smartphones and tablets.

The impact of consumer demand for cutting-edge display technology on the gases market

06/09/2015  How gases are used in the manufacture of displays is being impacted by new technologies, consumer demand, and the burgeoning China market.

Tackling Parameter Extraction for 16nm and Below

06/08/2015  There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in more complex electrical fields around the device 2) multi-patterning, which causes increased variability; 3) a demand for 10X tighter levels of accuracy, and 4) increased levels of secrecy from foundries and designers.

Flat panel display equipment spending forecast to reach $9B in 2015

06/02/2015  Revenues for flat panel display (FPD) manufacturing equipment are expected to grow for the third consecutive year to reach $9.1 billion.

Smartwatch display shipments to reach record 34M units in 2015

06/02/2015  Smartwatch display unit shipments are expected to grow 250 percent year-over-year, reaching a record 34 million units in 2015, led by demand for the new Apple Watch.

Intel CEO looks to 3D tech at display conference

06/02/2015  Intel CEO Brian Krzanich touted the capabilities of his company’s RealSense technology in a keynote address at the Society for Information Display conference in San Jose, California.

Silicon Technology Extensions shown at MRS Spring 2015

06/01/2015  New ultra-fast crystallization using lasers or plasma-jets.

Random nanowire configurations increase conductivity over heavily ordered configurations

05/15/2015  Researchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation.

Danaher to buy Pall in $13.8B deal

05/14/2015  Danaher Corporation announced that it will acquire Pall Corporation for $13.8 billion. Once the transaction is completed, the merged company plans to split into two publicly traded corporations.

Solid State Watch: May 1-8, 2015

05/12/2015  First quarter semiconductor sales up 6% compared to last year; New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead; Microchip and GlobalFoundries announce new 55nm embedded NVM; ASE and TDK announce plans for joint venture agreement




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015